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8446.30.50 - 8458.99.50
> 8456.99.70
Previous Tariff (8456.99.50 - Machine tool for working material (n/metal) removal of mat. nesoi,operated by electro-chemical,electron-beam,ionic-beam,plasma arc processes)
Next Tariff (8456.99.90 - Machine tool for working material (n/metal) removal of mat. operated by electro-chemical/electron-beam/ionic-beam/plasma arc processes,nesoi)
HTS Number:
8456.99.70
Description:
Machine tool for stripping and cleaning semiconductor wafers,operated by electro-chemical/electron-beam/ionic-beam/plasma arc process,nesoi
MFN Duty Rate:
Free
Previous Tariff (8456.99.50 - Machine tool for working material (n/metal) removal of mat. nesoi,operated by electro-chemical,electron-beam,ionic-beam,plasma arc processes)
Next Tariff (8456.99.90 - Machine tool for working material (n/metal) removal of mat. operated by electro-chemical/electron-beam/ionic-beam/plasma arc processes,nesoi)
Related Rulings:
1998 NY D81954 - The tariff classification of an etch cleaning system for semiconductor wafers from Switzerland.
2000 NY G80858 - The tariff classification of ion sources from England
2004 NY L80301 - The tariff classification of a semiconductor wafer cleaning machine
2006 HQ 967686 - Request for further review of protest 4101-04-100638; Sigma fxP HSE Module