Top Inventors for class "Semiconductor device manufacturing: process" |
Rank | Inventor's name | Country | City/State | Last publication | # of patent apps in this class |
1 | Shunpei Yamazaki | JP | Setagaya | Sep 15, 2022 / 20220293798 - SEMICONDUCTOR DEVICE | 236 |
2 | Shunpei Yamazaki | JP | Tokyo | Sep 15, 2022 / 20220293795 - SEMICONDUCTOR DEVICE | 179 |
3 | Kangguo Cheng | US | Schenectady, NY | Sep 08, 2022 / 20220285614 - INTEGRATED SWITCH USING STACKED PHASE CHANGE MATERIALS | 100 |
4 | Chen-Hua Yu | TW | Hsin-Chu | Sep 14, 2017 / 20170263518 - Integrated Fan-Out Package Including Voltage Regulators and Methods Forming Same | 94 |
5 | Devendra K. Sadana | US | Pleasantville, NY | Jul 28, 2022 / 20220238663 - ION IMPLANT DEFINED NANOROD IN A SUSPENDED MAJORANA FERMION DEVICE | 86 |
6 | Nitin K. Ingle | US | San Jose, CA | Jul 14, 2022 / 20220223409 - LOW-K BORON CARBONITRIDE FILMS | 78 |
7 | Shou-Shan Fan | CN | Beijing | Aug 18, 2022 / 20220260829 - METHOD FOR DESIGNING NONSYMMETRIC FREEFORM SURFACE OPTICAL SYSTEM | 71 |
8 | Gurtej S. Sandhu | US | Boise, ID | Aug 18, 2022 / 20220262623 - METHODS OF FORMING NANOSTRUCTURES UTILIZING SELF-ASSEMBLED NUCLEIC ACIDS | 70 |
9 | Hideto Ohnuma | JP | Atsugi | May 05, 2016 / 20160126299 - Semiconductor device and manufacturing method thereof | 63 |
10 | Bruce B. Doris | US | Brewster, NY | Jan 28, 2016 / 20160027789 - DUMMY GATE STRUCTURE FOR ELECTRICAL ISOLATION OF A FIN DRAM | 63 |
11 | Junichiro Sakata | JP | Atsugi | Dec 09, 2021 / 20210384356 - TRANSISTOR AND DISPLAY DEVICE | 62 |
12 | International Business Machines Corporation | US | Armonk, NY | Sep 18, 2014 / 20140282563 - DEPLOYING PARALLEL DATA INTEGRATION APPLICATIONS TO DISTRIBUTED COMPUTING ENVIRONMENTS | 59 |
13 | Huilong Zhu | US | Poughkeepsie, NY | Sep 08, 2022 / 20220285559 - VERTICAL STORAGE DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS INCLUDING STORAGE DEVICE | 58 |
14 | Ajay Kumar | US | Cupertino, CA | Apr 16, 2020 / 20200118880 - WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH | 56 |
15 | Clement Hsingjen Wann | US | Carmel, NY | Aug 18, 2022 / 20220262924 - SEMICONDUCTOR DEVICE WITH REDUCED TRAP DEFECT AND METHOD OF FORMING THE SAME | 53 |
16 | Yoshiro Hirose | JP | Toyama-Shi | Jul 01, 2021 / 20210198785 - METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | 52 |
17 | Gil-Heyun Choi | KR | Seoul | Feb 25, 2016 / 20160056235 - SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 51 |
18 | Anchuan Wang | US | San Jose, CA | Aug 11, 2022 / 20220254648 - SYSTEMS AND METHODS FOR NITRIDE-CONTAINING FILM REMOVAL | 51 |
19 | Kengo Akimoto | JP | Atsugi | Jul 21, 2022 / 20220231056 - DISPLAY DEVICE | 51 |
20 | Brad Eaton | US | Menlo Park, CA | Apr 16, 2020 / 20200118880 - WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH | 49 |
21 | Wei-Sheng Lei | US | San Jose, CA | Dec 23, 2021 / 20210398854 - LASER SCRIBING TRENCH OPENING CONTROL IN WAFER DICING USING HYBRID LASER SCRIBING AND PLASMA ETCH APPROACH | 48 |
22 | Edward J. Nowak | US | Essex Junction, VT | Dec 27, 2018 / 20180374758 - VERTICAL FIELD EFFECT TRANSISTORS | 47 |
23 | Shinya Sasagawa | JP | Chigasaki | Aug 25, 2022 / 20220271168 - SEMICONDUCTOR DEVICE | 47 |
24 | Leonard Forbes | US | Corvallis, OR | Sep 14, 2017 / 20170263671 - PROCESS MODULE FOR INCREASING THE RESPONSE OF BACKSIDE ILLUMINATED PHOTOSENSITIVE IMAGERS AND ASSOCIATED METHODS | 47 |
25 | Mei Chang | US | Saratoga, CA | Oct 07, 2021 / 20210308703 - APPARATUS FOR INCREASING FLUX FROM AN AMPOULE | 45 |
26 | Ali Khakifirooz | US | Mountain View, CA | Jul 13, 2017 / 20170200832 - NANOWIRE TRANSISTOR STRUCTURES WITH MERGED SOURCE/DRAIN REGIONS USING AUXILIARY PILLARS | 45 |
27 | Srinivas D. Nemani | US | Sunnyvale, CA | Aug 25, 2022 / 20220269180 - APPARATUS FOR POST EXPOSURE BAKE OF PHOTORESIST | 43 |
28 | Jan Hoentschel | DE | Dresden | Jan 26, 2017 / 20170025398 - DIE-DIE STACKING | 42 |
29 | Qun-Qing Li | CN | Beijing | Dec 02, 2021 / 20210370282 - METHOD FOR MAKING PHOTOCATALYTIC STRUCTURE | 42 |
30 | Tony P. Chiang | US | Campbell, CA | May 12, 2016 / 20160133691 - DRAM MIMCAP Stack with MoO2 Electrode | 41 |
31 | Chih-Chao Yang | US | Glenmont, NY | Jan 13, 2022 / 20220013723 - PLANAR RESISTIVE RANDOM-ACCESS MEMORY (RRAM) DEVICE WITH A SHARED TOP ELECTRODE | 41 |
32 | Stephen W. Bedell | US | Wappingers Falls, NY | Jul 28, 2022 / 20220238663 - ION IMPLANT DEFINED NANOROD IN A SUSPENDED MAJORANA FERMION DEVICE | 41 |
33 | Jeffrey P. Gambino | US | Westford, VT | Dec 29, 2016 / 20160379948 - CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE | 41 |
34 | Hans-Joachim Schulze | DE | Taufkirchen | Aug 04, 2022 / 20220246745 - Silicon Carbide Devices, Semiconductor Devices and Methods for Forming Silicon Carbide Devices and Semiconductor Devices | 41 |
35 | Belgacem Haba | US | Saratoga, CA | Sep 15, 2022 / 20220293567 - DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROVED YIELD IN MICROELECTRONICS | 41 |
36 | Stefan Flachowsky | DE | Dresden | Jul 13, 2017 / 20170200743 - SEMICONDUCTOR STRUCTURE INCLUDING A FIRST TRANSISTOR AND A SECOND TRANSISTOR | 40 |
37 | Rajinder Dhindsa | US | San Jose, CA | Aug 11, 2022 / 20220254614 - Confinement Ring for Use in a Plasma Processing System | 40 |
38 | Jeffrey W. Sleight | US | Ridgefield, CT | Sep 14, 2017 / 20170263707 - EXPITAXIALLY REGROWN HETEROSTRUCTURE NANOWIRE LATERAL TUNNEL FIELD EFFECT TRANSISTOR | 39 |
39 | Kangguo Cheng | US | Guilderland, NY | Oct 01, 2015 / 20150279936 - STRAINED CHANNEL FOR DEPLETED CHANNEL SEMICONDUCTOR DEVICES | 39 |
40 | Bo-Un Yoon | KR | Seoul | Dec 27, 2018 / 20180374859 - SEMICONDUCTOR DEVICES INCLUDING A DUMMY GATE STRUCTURE ON A FIN | 38 |
41 | Anthony K. Stamper | US | Williston, VT | Dec 02, 2021 / 20210376159 - FIELD-EFFECT TRANSISTORS WITH A POLYCRYSTALLINE BODY IN A SHALLOW TRENCH ISOLATION REGION | 38 |
42 | Hidekazu Miyairi | JP | Isehara | Jun 15, 2017 / 20170170328 - SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 38 |
43 | Anup Bhalla | US | Santa Clara, CA | Apr 16, 2020 / 20200119185 - MOS DEVICE WITH ISLAND REGION | 38 |
44 | Madhava Rao Yalamanchili | US | Morgan Hill, CA | Apr 16, 2020 / 20200118880 - WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH | 37 |
45 | Chun Hsiung Tsai | TW | Xinpu Township | Sep 08, 2022 / 20220285161 - Methods for Doping High-K Metal Gates for Tuning Threshold Voltages | 36 |
46 | Mehrdad M. Moslehi | US | Los Altos, CA | Nov 17, 2016 / 20160336465 - HIGH-EFFICIENCY PHOTOVOLTAIC BACK-CONTACT SOLAR CELL STRUCTURES AND MANUFACTURING METHODS | 36 |
47 | Tenko Yamashita | US | Schenectady, NY | Jul 21, 2022 / 20220231021 - FIN TOP HARD MASK FORMATION AFTER WAFER FLIPPING PROCESS | 36 |
48 | Wen-Chih Chiou | TW | Miaoli | Aug 13, 2015 / 20150228541 - METHODS OF MAKING INTEGRATED CIRCUITS INCLUDING CONDUCTIVE STRUCTURES THROUGH SUBSTRATES | 36 |
49 | Brent A. Anderson | US | Jericho, VT | Apr 16, 2020 / 20200118890 - SELF-ALIGNED TOP SPACERS FOR VERTICAL FETS WITH IN SITU SOLID STATE DOPING | 35 |
50 | Toshinari Sasaki | JP | Atsugi | Nov 25, 2021 / 20210366944 - TRANSISTOR AND DISPLAY DEVICE | 34 |
51 | Mukta G. Farooq | US | Hopewell Junction, NY | Aug 04, 2022 / 20220246472 - DUAL REDISTRIBUTION LAYER STRUCTURE | 34 |
52 | Alexander Reznicek | US | Troy, NY | Sep 01, 2022 / 20220278195 - NANOSHEET METAL-OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTOR WITH ASYMMETRIC THRESHOLD VOLTAGE | 34 |
53 | Chia-Shiung Tsai | TW | Hsin-Chu | Jul 28, 2022 / 20220238662 - METHOD FOR FORMING THIN SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATES | 34 |
54 | Kie Y. Ahn | US | Chappaqua, NY | Apr 28, 2016 / 20160118259 - ZrAlON FILMS | 33 |
55 | Yasuyuki Arai | JP | Atsugi | Nov 17, 2016 / 20160336346 - Semiconductor Device and Method of Fabricating the Same | 33 |
56 | Chung-Shi Liu | TW | Hsin-Chu | Jun 01, 2017 / 20170154862 - Methods of Forming Connector Pad Structures, Interconnect Structures, and Structures Thereof | 33 |
57 | Anton Mauder | DE | Kolbermoor | Aug 18, 2022 / 20220262935 - VOLTAGE-CONTROLLED SWITCHING DEVICE WITH CHANNEL REGION | 32 |
58 | Jun Liu | US | Boise, ID | Aug 25, 2022 / 20220271224 - RESISTIVE MEMORY ARCHITECTURES WITH MULTIPLE MEMORY CELLS PER ACCESS DEVICE | 32 |
59 | Semiconductor Energy Laboratory Co., Ltd. | JP | Atsugi-Shi | Aug 08, 2013 / 20130203214 - METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 32 |
60 | Dun-Nian Yaung | TW | Taipei City | Sep 15, 2022 / 20220293644 - MECHANISMS FOR FORMING IMAGE-SENSOR DEVICE WITH DEEP-TRENCH ISOLATION STRUCTURE | 32 |
61 | Hsien-Wen Liu | TW | Taoyuan County | Jul 09, 2015 / 20150194390 - METHOD FOR FORMING CRACK STOP STRUCTURE | 31 |
62 | Samsung Electronics Co., Ltd. | KR | Suwon-Si | Sep 08, 2022 / 20220283968 - METHOD OF SYNCHRONIZING TIME BETWEEN HOST DEVICE AND STORAGE DEVICE AND SYSTEM PERFORMING THE SAME | 31 |
63 | Sanh D. Tang | US | Boise, ID | Jun 17, 2021 / 20210183887 - THREE DIMENSIONAL MEMORY AND METHODS OF FORMING THE SAME | 31 |
64 | Chih-Hsin Ko | TW | Fongshan City | Nov 11, 2021 / 20210351080 - METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | 30 |
65 | Taiwan Semiconductor Manufacturing Company, Ltd. | US | | Dec 10, 2015 / 20150353342 - MEMS and Method for Forming the Same | 30 |
66 | Chien-Ting Lin | TW | Hsinchu City | Feb 04, 2021 / 20210035620 - SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | 30 |
67 | Chen-Shien Chen | TW | Zhubei City | Sep 01, 2022 / 20220278031 - Package Structures and Methods for Forming the Same | 30 |
68 | Masaki Ueno | JP | Itami-Shi | Sep 14, 2017 / 20170263453 - SUBSTRATE AND ELECTRONIC DEVICE | 30 |
69 | Ilyas Mohammed | US | Santa Clara, CA | Jan 06, 2022 / 20220005784 - LAYER STRUCTURES FOR MAKING DIRECT METAL-TO-METAL BONDS AT LOW TEMPERATURES IN MICROELECTRONICS | 30 |
70 | Ming-Feng Shieh | TW | Yongkang City | Dec 29, 2016 / 20160379889 - Method Of Making A Finfet Device | 30 |
71 | Charles W.c. Lin | SG | Singapore | Apr 30, 2015 / 20150115433 - SEMICONDUCOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 30 |
72 | Toru Takayama | JP | Atsugi | Sep 17, 2020 / 20200294848 - SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 30 |
73 | Nicolas Loubet | US | Guilderland, NY | Dec 23, 2021 / 20210399114 - FORMING NANOSHEET TRANSISTOR USING SACRIFICIAL SPACER AND INNER SPACERS | 30 |
74 | Sampath Purushothaman | US | Yorktown Heights, NY | Jun 15, 2017 / 20170166784 - ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS | 29 |
75 | Hiroki Ohara | JP | Sagamihara | Nov 25, 2021 / 20210366709 - SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 29 |
76 | Akihisa Shimomura | JP | Isehara | Jun 25, 2015 / 20150179813 - SEMICONDUCTOR DEVICE | 29 |
77 | Ghavam G. Shahidi | US | Pound Ridge, NY | Oct 21, 2021 / 20210328679 - CHIP CARRIER INTEGRATING POWER HARVESTING AND REGULATION DIODES AND FABRICATION THEREOF | 29 |
78 | Vijay Narayanan | US | New York, NY | Sep 17, 2020 / 20200295147 - GATE FIRST TECHNIQUE IN VERTICAL TRANSPORT FET USING DOPED SILICON GATES WITH SILICIDE | 29 |
79 | Takeyoshi Masuda | JP | Osaka-Shi | Jun 15, 2017 / 20170170281 - METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE AND SILICON CARBIDE SEMICONDUCTOR DEVICE | 29 |
80 | Junichi Koezuka | JP | Tochigi | Sep 15, 2022 / 20220293641 - SEMICONDUCTOR DEVICE | 28 |
81 | Soo Young Choi | US | Fremont, CA | Sep 15, 2022 / 20220293793 - PROCESS TO REDUCE PLASMA INDUCED DAMAGE | 28 |
82 | Gurtej Sandhu | US | Boise, ID | Oct 28, 2021 / 20210336129 - CONFINED CELL STRUCTURES AND METHODS OF FORMING CONFINED CELL STRUCTURES | 28 |
83 | Chongying Xu | US | New Milford, CT | Nov 06, 2014 / 20140329357 - TELLURIUM COMPOUNDS USEFUL FOR DEPOSITION OF TELLURIUM CONTAINING MATERIALS | 28 |
84 | Ki-Hyun Hwang | KR | Seongnam-Si | Jul 21, 2022 / 20220231117 - SEMICONDUCTOR DEVICE | 28 |
85 | Michal Danek | US | Cupertino, CA | Sep 15, 2022 / 20220290300 - METAL DEPOSITION | 28 |
86 | Bahman Hekmatshoartabari | US | White Plains, NY | Nov 25, 2021 / 20210365819 - THIN-FILM ACTIVE SURFACE FOR FUZZY TEMPLATE MATCHING | 28 |
87 | Chia-Chung Wang | TW | Hsinchu | Apr 30, 2015 / 20150115433 - SEMICONDUCOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 27 |
88 | Ali Khakifirooz | US | Los Altos, CA | Jan 03, 2019 / 20190006016 - METHOD, SYSTEM, AND APPARATUS FOR DETECTING FAILURE OF PROGRAMMING OF A MEMORY DEVICE | 27 |
89 | Chin-Cheng Chien | TW | Tainan City | May 05, 2016 / 20160126091 - CLEANING PROCESS FOR OXIDE | 27 |
90 | International Business Machines Corporation | US | | Jun 09, 2016 / 20160164774 - SET UP OF DIRECT MAPPED ROUTERS LOCATED ACROSS INDEPENDENTLY MANAGED COMPUTE AND STORAGE NETWORKS | 27 |
91 | Haifan Liang | US | Fremont, CA | Jun 25, 2015 / 20150179839 - CONTACT LAYERS FOR PHOTOVOLTAIC DEVICES | 27 |
92 | Yi-Nan Chen | TW | Taipei City | Jul 09, 2015 / 20150194390 - METHOD FOR FORMING CRACK STOP STRUCTURE | 27 |
93 | Josephine B. Chang | US | Mahopac, NY | Oct 13, 2016 / 20160300762 - SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED GATE CONTACTS | 27 |
94 | Fujio Masuoka | JP | Tokyo | Aug 11, 2022 / 20220254790 - PILLAR-SHAPED SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME | 27 |
95 | Hong-Sick Park | KR | Suwon-Si | Oct 13, 2016 / 20160297732 - METHOD FOR MANUFACTURING HIGH PURITY GLYCOL BASED COMPOUND | 27 |
96 | Koichiro Tanaka | JP | Isehara | Apr 04, 2013 / 20130084691 - BEAM HOMOGENIZER, LASER IRRADIATION APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 27 |
97 | Chung H. Lam | US | Peekskill, NY | Dec 31, 2020 / 20200411757 - INTEGRATION OF SELECTOR ON CONFINED PHASE CHANGE MEMORY | 26 |
98 | Hua Chung | US | San Jose, CA | Sep 22, 2022 / 20220298625 - SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | 26 |
99 | Chun-Chen Yeh | US | Clifton Park, NY | Jan 03, 2019 / 20190006377 - HIGHLY COMPACT FLOATING GATE ANALOG MEMORY | 26 |
100 | Gordon M. Grivna | US | Mesa, AZ | Sep 15, 2022 / 20220293781 - STRUCTURES AND METHODS FOR SOURCE-DOWN VERTICAL SEMICONDUCTOR DEVICE | 26 |