Top Inventors for class "Electricity: conductors and insulators" |
Rank | Inventor's name | Country | City/State | Last publication | # of patent apps in this class |
1 | Douglas B. Gundel | US | Cedar Park, TX | Aug 25, 2022 / 20220270786 - SHIELDED ELECTRIC CABLE | 39 |
2 | Shou-Kuo Hsu | TW | Tu-Cheng | May 21, 2015 / 20150138744 - PRINTED CIRCUIT BOARD | 37 |
3 | Michimasa Takahashi | JP | Ogaki-Shi | Sep 10, 2015 / 20150257269 - COMBINED WIRING BOARD | 32 |
4 | Hideyuki Kikuchi | JP | Hitachi | Dec 29, 2016 / 20160380499 - INSULATED ELECTRIC WIRE AND COIL | 28 |
5 | Tsung-Yuan Chen | TW | Taoyuan County | Jan 07, 2016 / 20160007472 - METHOD OF FABRICATING AN ELECTRICAL DEVICE PACKAGE STRUCTURE | 25 |
6 | Tomiya Abe | JP | Hitachi | Aug 15, 2013 / 20130209803 - CROSSLINKED RUBBER, RUBBER-SHEATHED CABLE USING SAME, AND CROSSLINKED RUBBER PRODUCING METHOD | 25 |
7 | Gwun-Jin Lin | TW | Taoyuan County | Mar 24, 2016 / 20160088724 - GROUNDING PATTERN STRUCTURE FOR HIGH-FREQUENCY CONNECTION PAD OF CIRCUIT BOARD | 24 |
8 | Kuo-Fu Su | TW | Taoyuan County | Mar 24, 2016 / 20160088724 - GROUNDING PATTERN STRUCTURE FOR HIGH-FREQUENCY CONNECTION PAD OF CIRCUIT BOARD | 24 |
9 | Yu-Chang Pai | TW | Tu-Cheng | Dec 27, 2012 / 20120327550 - ANTISTATIC DEVICE AND METHOD OF REMOVING STATIC ELECTRICITY OF TESTING SYSTEM USING THE SAME | 22 |
10 | Hideomi Adachi | JP | Kosai-Shi | Feb 04, 2016 / 20160036158 - RESIN MOLDED PRODUCT AND WATERPROOF SHIELDED CONNECTOR | 22 |
11 | Han Kim | KR | Yongin-Si | Sep 05, 2013 / 20130229779 - PRINTED CIRCUIT BOARD AND ELECTRO APPLICATION | 22 |
12 | Young Ghyu Ahn | KR | Suwon-Si | Aug 04, 2022 / 20220246356 - MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTILAYERED CERAMIC CAPACITOR, PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR | 22 |
13 | Byoung Hwa Lee | KR | Suwon | Mar 19, 2015 / 20150075853 - MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING THE SAME | 21 |
14 | Sang-Soo Park | KR | Suwon-Si | Aug 04, 2022 / 20220246356 - MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTILAYERED CERAMIC CAPACITOR, PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR | 21 |
15 | Detian Huang | JP | Hitachi | May 19, 2016 / 20160141071 - COAXIAL CABLE AND MEDICAL CABLE USING SAME | 21 |
16 | Yuki Honda | JP | Hitachi | Dec 29, 2016 / 20160380499 - INSULATED ELECTRIC WIRE AND COIL | 21 |
17 | Takahiro Sugiyama | JP | Hitachi | Oct 13, 2016 / 20160300642 - DIFFERENTIAL SIGNAL TRANSMISSION CABLE AND MULTI-CORE DIFFERENTIAL SIGNAL TRANSMISSION CABLE | 21 |
18 | Min Cheol Park | KR | Suwon | May 14, 2015 / 20150131194 - MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON | 21 |
19 | Sang Soo Park | KR | Suwon | May 14, 2015 / 20150131194 - MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON | 20 |
20 | Akinari Nakayama | JP | Hitachinaka | May 05, 2016 / 20160125973 - CABLE | 19 |
21 | Toshiki Furutani | JP | Ogaki-Shi | Nov 17, 2016 / 20160336261 - PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE | 19 |
22 | Masud Bolouri-Saransar | US | Orland Park, IL | Jul 28, 2022 / 20220236306 - CONNECTIVITY VERIFICATION FOR AN ABSENCE OF VOLTAGE TESTER SYSTEM | 19 |
23 | Eiichi Toyama | JP | Kosai-Shi | Aug 28, 2014 / 20140238719 - HIGH VOLTAGE WIRE HARNESS FOR USE IN AUTOMOBILE | 19 |
24 | Ronald Steven Cok | US | Rochester, NY | May 12, 2016 / 20160133357 - PROVIDING ELECTRICALLY-CONDUCTIVE ARTICLES WITH ELECTRICALLY-CONDUCTIVE METALLIC CONNECTORS | 19 |
25 | Cong Thanh Dinh | US | Collierville, TN | Jun 22, 2017 / 20170179694 - WIRE COMPRESSION CONNECTOR | 18 |
26 | Hirotaka Eshima | JP | Hitachi | Sep 14, 2017 / 20170264063 - COMPOSITE CABLE AND COMPOSITE HARNESS | 18 |
27 | Hideaki Yoshimura | JP | Kawasaki | May 31, 2012 / 20120132464 - METHOD FOR MANUFACTURING PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND ELECTRONIC DEVICE | 18 |
28 | Hideomi Adachi | JP | Makinohara-Shi | Jun 30, 2016 / 20160189828 - WATERPROOFING STRUCTURE, WATERPROOFING METHOD AND WIREHARNESS | 18 |
29 | Ronald A. Nordin | US | Naperville, IL | Mar 10, 2022 / 20220077663 - MODULAR AND SCALABLE POWER DISTRIBUTION | 18 |
30 | David P. Camp, Ii | US | Florence, KY | May 21, 2015 / 20150136441 - Communication Cable with Improved Crosstalk Attenuation | 17 |
31 | Annika Smedberg | SE | Myggenas | Apr 16, 2020 / 20200115477 - CROSSLINKABLE POLYMER COMPOSITION AND CABLE WITH ADVANTAGEOUS ELECTRICAL PROPERTIES | 17 |
32 | Jun Ishii | JP | Osaka | Mar 17, 2016 / 20160081185 - WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF | 17 |
33 | Chien-Hung Liu | TW | Tu-Cheng | Feb 07, 2013 / 20130036334 - COMPUTING DEVICE AND METHOD FOR TESTING SERIAL ATTACHED SCSI PORTS OF SERVERS | 17 |
34 | Shu-Sheng Chiang | TW | Taipei City | Jun 15, 2017 / 20170171975 - CIRCUIT BOARD STRUCTURE | 17 |
35 | Kentaro Kaneko | JP | Nagano-Shi | Feb 11, 2016 / 20160044792 - WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME | 16 |
36 | Tzyy-Jang Tseng | TW | Hsinchu City | Aug 20, 2020 / 20200266155 - PACKAGE STRUCTURE WITH STRUCTURE REINFORCING ELEMENT AND MANUFACTURING METHOD THEREOF | 16 |
37 | Heung Kil Park | KR | Suwon | May 07, 2015 / 20150122534 - MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON | 16 |
38 | Scott M. Brown | US | Independence, KY | Dec 10, 2015 / 20150357095 - FOAMED POLYCARBONATE SEPARATORS AND CABLES THEREOF | 16 |
39 | Min-Cheol Park | KR | Suwon-Si | Aug 04, 2022 / 20220246356 - MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTILAYERED CERAMIC CAPACITOR, PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR | 15 |
40 | Takanobu Watanabe | JP | Hitachi | May 19, 2016 / 20160141071 - COAXIAL CABLE AND MEDICAL CABLE USING SAME | 15 |
41 | Krzysztof W. Korcz | US | Grainger, IN | Jun 07, 2018 / 20180159308 - MOUNTING BRACE ASSEMBLY FOR MOUNTING AN ELECTRICAL BOX | 15 |
42 | Mark R. Drane | US | Germantown, TN | Jan 03, 2019 / 20190006830 - POKE-THROUGH DEVICE | 15 |
43 | Noboru Kato | JP | Nagaokakyo-Shi | Aug 25, 2022 / 20220269872 - RFID AUXILIARY ANTENNA DEVICE | 15 |
44 | Jee Soo Mok | KR | Yongin-Si | Dec 29, 2016 / 20160381792 - PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME | 15 |
45 | Joseph Varkey | US | Sugar Land, TX | Jan 03, 2019 / 20190006065 - COMPRESSION AND STRETCH RESISTANT COMPONENTS AND CABLES FOR OILFIELD APPLICATIONS | 15 |
46 | Young Ghyu Ahn | KR | Suwon | Apr 30, 2015 / 20150116966 - COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON | 15 |
47 | Motoo Asai | JP | Ibi-Gun | Sep 03, 2015 / 20150250056 - PRINTED CIRCUIT BOARD | 15 |
48 | Byoung Hwa Lee | KR | Suwon-Si | Aug 04, 2022 / 20220246356 - MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTILAYERED CERAMIC CAPACITOR, PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR | 15 |
49 | Bhyrav M. Mutnury | US | Austin, TX | Jul 21, 2022 / 20220229097 - SYSTEM AND METHOD FOR CHANNEL OPTIMIZATION USING VIA STUBS | 14 |
50 | Joseph Kuczynski | US | Rochester, MN | Nov 05, 2015 / 20150318269 - Method for Carbon Nanotube Alignment Using Magnetic Nanoparticles | 14 |
51 | Doo Young Kim | KR | Suwon | Mar 31, 2016 / 20160090325 - DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR USING THE SAME | 14 |
52 | Cheng-Po Yu | TW | Taoyuan County | Apr 07, 2016 / 20160097130 - PREPARATION METHOD OF CONDUCTIVE SPONGE HAVING EFFECT OF SHIELDING ELECTROMAGNETIC WAVE | 14 |
53 | Chang Sup Ryu | KR | Yongin-Si | Dec 24, 2015 / 20150373856 - METHOD FOR FORMING BUMPS AND SUBSTRATE INCLUDING THE BUMPS | 14 |
54 | Masashi Sato | JP | Yokkaichi-Shi | Mar 19, 2015 / 20150075861 - COMPOSITION FOR WIRE PROTECTIVE MEMBER, WIRE PROTECTIVE MEMBER, AND WIRING HARNESS | 14 |
55 | Tetsuya Ohsawa | JP | Osaka | Sep 17, 2015 / 20150264795 - SUSPENSION BOARD WITH CIRCUIT, PRODUCING METHOD THEREOF, AND POSITIONING METHOD OF SUSPENSION BOARD WITH CIRCUIT | 14 |
56 | Ulf Nilsson | SE | Stenungsund | Apr 16, 2020 / 20200115477 - CROSSLINKABLE POLYMER COMPOSITION AND CABLE WITH ADVANTAGEOUS ELECTRICAL PROPERTIES | 14 |
57 | Teruyuki Ishihara | JP | Ogaki-Shi | Apr 21, 2016 / 20160113120 - PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME | 13 |
58 | Mahran H. Ayrton | US | South Bend, IN | Jun 07, 2018 / 20180159308 - MOUNTING BRACE ASSEMBLY FOR MOUNTING AN ELECTRICAL BOX | 13 |
59 | Belgacem Haba | US | Saratoga, CA | Sep 15, 2022 / 20220293567 - DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROVED YIELD IN MICROELECTRONICS | 13 |
60 | Bernhard Reul | DE | Herzogenrath | Jan 03, 2019 / 20190001888 - LAMINATED VEHICLE GLAZING WITH AMOLED SCREEN | 13 |
61 | Shinnosuke Maeda | JP | Nagoya -Shi | Oct 02, 2014 / 20140290997 - MULTILAYER WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF | 13 |
62 | Chang Sup Ryu | KR | Gyunggi-Do | Feb 06, 2014 / 20140037862 - METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD | 13 |
63 | Takashi Kariya | JP | Ibi-Gun | Nov 29, 2012 / 20120302010 - MULTILAYER PRINTED WIRING BOARD | 13 |
64 | Kazuhiro Kobayashi | JP | Nagano-Shi | Mar 17, 2016 / 20160081194 - Wiring Substrate and Semiconductor Device | 13 |
65 | Chih-Heng Chuo | TW | Taoyuan County | Mar 24, 2016 / 20160088724 - GROUNDING PATTERN STRUCTURE FOR HIGH-FREQUENCY CONNECTION PAD OF CIRCUIT BOARD | 13 |
66 | Po-Chuan Hsieh | TW | Tu-Cheng | Mar 06, 2014 / 20140060914 - ENCLOSURE WITH SHIELD APPARATUS | 13 |
67 | Jee Soo Mok | KR | Gyunggi-Do | Apr 17, 2014 / 20140106510 - DIE MOUNTING SUBSTRATE AND METHOD OF FABRICATING THE SAME | 13 |
68 | Kyo Kwang Lee | KR | Suwon-Si | Apr 19, 2018 / 20180108485 - MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING OF THE SAME | 13 |
69 | Hidehiko Kuboshima | JP | Kosai-Shi | Aug 08, 2013 / 20130199836 - SHIELD COVER AND SHIELD STRUCTURE | 13 |
70 | Seog Moon Choi | KR | Seoul | Mar 26, 2015 / 20150084089 - INSULATION STRUCTURE FOR HIGH TEMPERATURE CONDITIONS AND MANUFACTURING METHOD THEREOF | 13 |
71 | Yul Kyo Chung | KR | Yongin | Oct 13, 2016 / 20160302299 - CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME | 12 |
72 | Masato Inoue | JP | Yokkaichi-Shi | Nov 07, 2013 / 20130292173 - CRIMPED TERMINAL WIRE FOR AUTOMOBILE | 12 |
73 | Jeffrey M. Cogen | US | Flemington, NJ | Sep 22, 2022 / 20220298345 - POLYMERIC COMPOSITIONS FOR OPTICAL FIBER CABLE COMPONENTS | 12 |
74 | Masakazu Aoyama | JP | Ogaki-Shi | Mar 19, 2015 / 20150075848 - WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME | 12 |
75 | Tsuyoshi Nonaka | JP | Yokkaichi-Shi | Aug 01, 2013 / 20130192871 - INSULATED WIRE | 12 |
76 | Nobuyuki Naganuma | JP | Ogaki-Shi | Mar 19, 2015 / 20150075848 - WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME | 12 |
77 | Yasuyuki Otsuka | JP | Yokkaichi-Shi | Oct 28, 2021 / 20210335520 - ELECTRIC WIRE CONDUCTOR, COVERED ELECTRIC WIRE, AND WIRING HARNESS | 12 |
78 | Je-Gwang Yoo | KR | Yongin-Si | Aug 09, 2012 / 20120199388 - PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | 12 |
79 | Moises Cases | US | Austin, TX | Sep 25, 2014 / 20140284217 - MINIMIZING PLATING STUB REFLECTIONS IN A CHIP PACKAGE USING CAPACITANCE | 12 |
80 | Shuta Nabeshima | JP | Hitachi | Dec 29, 2016 / 20160380499 - INSULATED ELECTRIC WIRE AND COIL | 12 |
81 | Seung Eun Lee | KR | Sungnam | Jul 09, 2015 / 20150195907 - MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME | 12 |
82 | Cheng-Hsien Lin | TW | Tayuan | May 27, 2010 / 20100129532 - METHOD FOR FORMING ELECTRICAL TRACES ON SUBSTRATE | 12 |
83 | Tatsuya Oga | JP | Makinohara-Shi | Jun 30, 2016 / 20160189828 - WATERPROOFING STRUCTURE, WATERPROOFING METHOD AND WIREHARNESS | 12 |
84 | Yee Na Shin | KR | Suwon | Jul 09, 2015 / 20150195907 - MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME | 12 |
85 | Spring Stutzman | US | Sidney, NE | Sep 12, 2019 / 20190279785 - COMMUNICATION WIRE | 12 |
86 | Young Gwan Ko | KR | Seoul | Dec 29, 2016 / 20160381794 - MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME | 12 |
87 | Ji-Young Hwang | KR | Daejeon | Jul 28, 2022 / 20220234277 - SUBSTRATE | 12 |
88 | Dae Bok Oh | KR | Suwon | Feb 12, 2015 / 20150041194 - MULTILAYER CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND BOARD FOR MOUNTING THE SAME | 12 |
89 | Joung-Gul Ryu | KR | Seoul | Jun 19, 2014 / 20140165346 - HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME | 11 |
90 | Tomoyuki Abe | JP | Kawasaki | Sep 15, 2011 / 20110220396 - WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF | 11 |
91 | Ying-Tso Lai | TW | Tu-Cheng | Aug 29, 2013 / 20130222082 - EQUALIZER FOR MULTI-LEVEL EQUALIZATION | 11 |
92 | Katsutoshi Kamei | JP | Osaka | May 24, 2012 / 20120124829 - Producing method of wired circuit board | 11 |
93 | Sang Myung Lee | KR | Seoul | Nov 19, 2015 / 20150334843 - PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING SAME | 11 |
94 | Hikari Murai | JP | Ibaraki | Mar 24, 2016 / 20160083614 - VARNISH, PREPREG, FILM WITH RESIN, METAL FOIL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD | 11 |
95 | Fumihito Oka | JP | Hitachi | Sep 14, 2017 / 20170264063 - COMPOSITE CABLE AND COMPOSITE HARNESS | 11 |
96 | Jung-Hyun Park | KR | Suwon-Si | Jul 28, 2022 / 20220236566 - WEARABLE DEVICE | 11 |
97 | Richard Temblador | US | Carrollton, GA | May 18, 2017 / 20170138806 - Wireless-Enabled Tension Meter | 11 |
98 | Je Gwang Yoo | KR | Gyunggi-Do | Sep 06, 2012 / 20120222299 - METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD | 11 |
99 | Dongdong Wang | JP | Ibi-Gun | Sep 03, 2015 / 20150250056 - PRINTED CIRCUIT BOARD | 11 |
100 | Mitsuru Honjo | JP | Osaka | Sep 24, 2015 / 20150270620 - ANTENNA MODULE AND METHOD FOR MANUFACTURING THE SAME | 11 |