Patent application number | Description | Published |
20130322675 | SENSOR MODULE - A cost-effective and extremely space-saving module approach is provided for at least two micromechanical sensor elements having the same packaging requirements. The sensor module described here includes at least two micromechanical sensor elements whose sensor function is based on the direct or indirect impact of a measuring medium. The at least two sensor elements are situated in a shared housing having at least one access opening for the measuring medium, and the at least two sensor elements are stacked with one component back side on one component front side, so that the upper sensor element at least partially covers the active area of the lower sensor element, while still ensuring the impact of the measuring medium, which is used for the sensor function, on the active area of the lower sensor element. | 12-05-2013 |
20140015070 | COMPONENT HAVING A MICROMECHANICAL MICROPHONE PATTERN - A microphone component has a micromechanical microphone pattern which is implemented in a layer construction on a semiconductor substrate and includes (i) an acoustically active diaphragm which at least partially spans a sound opening on the backside of the substrate, (ii) at least one movable electrode of a microphone capacitor system, and (iii) a stationary acoustically penetrable counterelement having through holes, which counterelement is situated in the layer construction over the diaphragm and functions as the carrier for at least one immovable electrode of the microphone capacitor system. The diaphragm is tied in to the semiconductor substrate in a middle area, and the diaphragm has a corrugated sheet metal type of corrugation, at least in regions. | 01-16-2014 |
20140060146 | COMPONENT PART AND METHOD FOR TESTING SUCH A COMPONENT PART - Measures are described which simplify the functional testing of a component having an MEMS element provided with a pressure-sensitive sensor diaphragm, and which allow a self-calibration of the component even after it is already in place, i.e., following the end of the production process. The component has a housing, in which are situated at least one MEMS element having a pressure-sensitive sensor diaphragm and a switching arrangement for detecting the diaphragm deflections as measuring signals; an arrangement for analyzing the measuring signals; and an arrangement for the defined excitation of the sensor diaphragm. The housing has at least one pressure connection port. The arrangement for exciting the sensor diaphragm includes at least one selectively actuable actuator component for generating defined pressure pulses that act on the sensor diaphragm. | 03-06-2014 |
20140105428 | COMPONENT HAVING A MICROMECHANICAL MICROPHONE STRUCTURE - A capacitive MEMS microphone structure is provided, which micromechanical microphone structure of component is realized in a layer construction and includes: a diaphragm structure sensitive to sound pressure, which is deflectable in a direction perpendicular to the layer planes of the layer construction; an acoustically penetrable counter-element which has through holes and is formed above or below the diaphragm structure in the layer construction; and a capacitor system for detecting the excursions of the diaphragm structure. The diaphragm structure includes a structural element in the middle area of the diaphragm structure, which structural element projects perpendicularly from the diaphragm plane and which, depending on the degree of excursion of the diaphragm structure, variably extends into a correspondingly formed and positioned through hole in the counter-element. | 04-17-2014 |
20140124879 | Component and method for producing same - A packaging concept for MEMS components having at least one diaphragm structure formed in the front side of the component is provided, according to which the MEMS component is mounted on a support which at least laterally delimits a cavity adjoining the diaphragm structure. In addition, at least one electrical feedthrough is formed in the support which allows electrical contacting of the MEMS component through the support. To achieve the largest possible rear volume for the diaphragm structure of the MEMS component for a given chip surface area, and also to simplify the processing of the support, according to the invention the electrical feedthroughs are integrated into the wall of the cavity adjoining the diaphragm structure, in that at least one section of such a feedthrough is implemented in the form of an electrically conductive coating of a side wall section of the cavity. | 05-08-2014 |
20140126762 | COMPONENT HAVING A MICROMECHANICAL MICROPHONE STRUCTURE - Measures for dynamically regulating the microphone sensitivity of a MEMS microphone component at low frequencies by way of variable roll-off behavior are proposed. The micromechanical microphone structure of the component, which is implemented in a layer structure on a semiconductor substrate, encompasses an acoustically active diaphragm having leakage openings which spans a sound opening in the substrate back side, and a stationary acoustically permeable counterelement having through openings which is disposed in the layer structure above/below the diaphragm. The component furthermore encompasses a capacitor assemblage for signal sensing, having at least one deflectable electrode on the diaphragm and at least one stationary electrode on the counterelement, and an arrangement for implementing a relative motion between the diaphragm and counterelement parallel to the layer planes. | 05-08-2014 |
20140169594 | MEMS COMPONENT FOR GENERATING PRESSURE PULSES - A MEMS component for generating pressure pulses is provided, its micromechanical structure including at least three function levels: a first function level in which at least one stationary trench structure is implemented, a second function level, which is implemented above the first function level and includes at least one triggerable displacement element as well as through-openings as pressure outlet openings, the displacement element protruding into the trench structure and being movable in parallel with the function levels, whereby positive and negative pressure pulses are generated, and a third function level, which is implemented above the second function level and includes at least one triggerable cover element for at least one part of the pressure outlet openings in the second function level. | 06-19-2014 |
20140291786 | component having a micromechanical microphone structure - Substrate-side overload protection for the diaphragm structure of a microphone component having a micromechanical microphone structure which impairs the damping properties of the microphone structure as little as possible, in which the microphone structure includes a diaphragm structure having at least one acoustically active diaphragm which is formed in a diaphragm layer above a semiconductor substrate. The diaphragm structure spans at least one sound opening in the rear side of the substrate. A stationary, acoustically permeable counter element is formed in the layer structure of the component above the diaphragm layer. According to the invention, at least projections are formed at the outer edge area of the diaphragm structure which protrude beyond the edge area of the sound opening, so that the edge area of the sound opening acts as a substrate-side stop for the diaphragm structure. | 10-02-2014 |
20140319629 | COMPONENT HAVING A MICROMECHANICAL MICROPHONE PATTERN - Measures are provided for increasing the resistance to compression of a component having a micromechanical microphone pattern. In particular, the robustness of the microphone pattern to highly dynamic pressure fluctuations is to be increased, without the microphone sensitivity, i.e. the microphone performance, being impaired. The microphone pattern of such a component is implemented in a layer construction on a semiconductor substrate and includes at least one acoustically active diaphragm, which spans a sound hole on the substrate backside, and a stationary acoustically penetrable counterelement having through hole openings, which is situated above/below the diaphragm in the layer construction. At least one outflow channel is developed which makes possible a rapid pressure equalization between the two sides of the diaphragm. In addition, at least one controllable closing element is provided, with which the at least one outflow channel is optionally able to be opened or closed. | 10-30-2014 |
20150014797 | MEMS DEVICE HAVING A MICROPHONE STRUCTURE, AND METHOD FOR THE PRODUCTION THEREOF - A microphone structure of an MEMS device has a layer construction including: a base substrate; a deflectable microphone diaphragm at least partly spanning a through-opening in the substrate; a deflectable electrode of a microphone condenser system; a stationary counter-element having ventilation openings situated in the layer construction over the microphone diaphragm and acting as a bearer for a stationary electrode of the microphone condenser system. The diaphragm is bonded into the layer construction on the substrate via a flexible beam. The otherwise free edge region of the diaphragm is curved in a pan shape, so that it extends both vertically and also in some regions laterally beyond the edge region of the through-opening, and the edge region of the through-opening forms a lower stop for the diaphragm movement. | 01-15-2015 |
20150035094 | MICROPHONE ASSEMBLY HAVING AT LEAST TWO MEMS MICROPHONE COMPONENTS - A microphone assembly includes two MEMS components each having a micromechanical microphone structure, each microphone structure having: a diaphragm configured to be deflected by sound pressure and provided with at least one diaphragm electrode of a capacitor system; and a stationary acoustically permeable counter-element that acts as bearer for at least one counter-electrode of the capacitor system. The microphone assembly is configured such that under the action of sound the spacing between the diaphragm and the counter-element of the two microphone structures changes in opposite directions. | 02-05-2015 |
20150059482 | MEMS COMPONENT - A new signal acquisition concept is provided for MEMS components having a pressure-sensitive diaphragm element, which at least partially spans a pressure connection opening. This signal acquisition concept is distinguished by an especially high sensitivity. For this purpose, the MEMS component includes a resonant vibrator device having a vibrating element, which is suspended, capable of vibrating, within a closed cavity and is equipped with at least one drive electrode and at least one sensing electrode. The vibrating element of the resonant vibrator device is coupled mechanically to the diaphragm element, so that the vibrating element is deformed in the case of a diaphragm deflection. | 03-05-2015 |