Patent application number | Description | Published |
20080315333 | SUBSTRATE-LEVEL ASSEMBLY FOR AN INTEGRATED DEVICE, MANUFACTURING PROCESS THEREOF AND RELATED INTEGRATED DEVICE - A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity of the top face. A capping substrate is coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided above the membrane. Electrical-contact elements electrically connect the integrated device with the outside of the substrate-level assembly. In one embodiment, the device substrate integrates at least a further integrated device provided with a respective membrane, and a further empty space, fluidically isolated from the first empty space, is provided over the respective membrane of the further integrated device. | 12-25-2008 |
20090115008 | MANUFACTURING METHOD OF AN ELECTRONIC DEVICE INCLUDING OVERMOLDED MEMS DEVICES - A method manufactures an electronic device comprising a MEMS device overmolded in a protective casing. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated, and is sensitive, through a membrane, to chemical/physical variations of a fluid. Prior to the molding step, at least one resin layer is formed on at least one region overlying the active surface in correspondence with the membrane. After, at least one portion of at least one resin layer is removed from at least one region, so that in the region an opening is formed, through which the MEMS device is activated from the outside of the protective casing. | 05-07-2009 |
20100297797 | MANUFACTURING METHOD OF AN ELECTRONIC DEVICE INCLUDING OVERMOLDED MEMS DEVICES - A method manufactures an electronic device comprising a MEMS device overmolded in a protective casing. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated, and is sensitive, through a membrane, to chemical/physical variations of a fluid. Prior to the molding step, at least one resin layer is formed on at least one region overlying the active surface in correspondence with the membrane. After, at least one portion of at least one resin layer is removed from at least one region, so that in the region an opening is formed, through which the MEMS device is activated from the outside of the protective casing. | 11-25-2010 |
Patent application number | Description | Published |
20110209524 | INTEGRATED CHEMICAL SENSOR FOR DETECTING ODOROUS MATTERS - A cartridge-like chemical sensor is formed by a housing having a base and a cover fixed to the base and provided with an input opening, an output hole and a channel for a gas to be analyzed. The channel extends in the cover between the input opening and the output hole and faces a printed circuit board carrying an integrated circuit having a sensitive region open toward the channel and of a material capable to bind with target chemicals in the gas to be analyzed. A fan is arranged in the housing, downstream of the integrated device, for sucking the gas after being analyzed, and is part of a thermal control system for the integrated circuit. | 09-01-2011 |
20110318840 | FLUIDIC CARTRIDGE FOR DETECTING CHEMICALS IN SAMPLES, IN PARTICULAR FOR PERFORMING BIOCHEMICAL ANALYSES - A fluidic cartridge for detecting chemicals, formed by a casing, hermetically housing an integrated device having a plurality of detecting regions to bind with target chemicals; part of a supporting element, bearing the integrated device; a reaction chamber, facing the detecting regions; a sample feeding hole and a washing feeding hole, self-sealingly closed; fluidic paths, which connect the sample feeding and washing feeding holes to the reaction chamber; and a waste reservoir, which may be fluidically connected to the reaction chamber by valve elements that may be controlled from outside. The integrated device is moreover connected to an interface unit carried by the supporting element, electrically connected to the integrated device and including at least one signal processing stage and external contact regions. | 12-29-2011 |
20120132817 | ENCAPSULATED PHOTOMULTIPLIER DEVICE OF SEMICONDUCTOR MATERIAL, FOR USE, FOR EXAMPLE, IN MACHINES FOR PERFORMING POSITRON-EMISSION TOMOGRAPHY - An embodiment of a photomultiplier device is formed by a base substrate of insulating organic material forming a plurality of conductive paths and carrying a plurality of chips of semiconductor material. Each chip integrates a plurality of photon detecting elements, such as Geiger-mode avalanche diodes, and is bonded on a first side of the base substrate. Couplings for photon-counting and image-reconstruction units are formed on a second side of the base substrate. The first side of the base substrate is covered with a transparent encapsulating layer of silicone resin, which, together with the base substrate, bestows stiffness on the photomultiplier device, preventing warpage, and covers and protects the chips. | 05-31-2012 |
20120286381 | ELECTRONIC MEMS DEVICE COMPRISING A CHIP BONDED TO A SUBSTRATE AND HAVING CAVITIES AND MANUFACTURING PROCESS THEREOF - An electronic MEMS device is formed by a chip having with a main face and bonded to a support via an adhesive layer. A cavity extends inside the chip from its main face and is closed by a flexible film covering the main face of the chip at least in the area of the cavity. The support has a depressed portion facing the cavity and delimited by a protruding portion facing the main face of the chip. Inside the depressed portion, the adhesive layer has a greater thickness than the projecting portion so as to be able to absorb any swelling of the flexible film as a result of the expansion of the gas contained inside the cavity during thermal processes. | 11-15-2012 |
20130170166 | SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD, IN PARTICULAR FOR MEMS DEVICES - A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described. | 07-04-2013 |
20130243143 | REACTOR FOR ENERGY GENERATION THROUGH LOW ENERGY NUCLEAR REACTIONS (LENR) BETWEEN HYDROGEN AND TRANSITION METALS AND RELATED METHOD OF ENERGY GENERATION - An embodiment of an apparatus includes a reaction chamber, a reaction unit, and an energy regulator. The reaction chamber includes an energy port, and the reaction unit is disposed in the reaction chamber and is configured to allow an energy-releasing reaction between first and second materials. And the energy regulator is configured to control a rate at which reaction-released energy exits the reaction chamber via the energy port. The reaction chamber may include a thermally conductive wall that forms a portion of the energy port, and the energy regulator may include a thermally conductive member and a mechanism configured to control a distance between the thermally conductive wall and the thermally conductive member. Furthermore, the reaction unit may include a mechanism configured to facilitate the reaction between the first and second materials, and may also include a mechanism configured to control a rate at which the reaction releases energy. | 09-19-2013 |
20130285056 | SEMICONDUCTOR STRUCTURE WITH LOW-MELTING-TEMPERATURE CONDUCTIVE REGIONS, AND METHOD OF REPAIRING A SEMICONDUCTOR STRUCTURE - A semiconductor structure includes at least a semiconductor body, a delimiting structure delimiting a cup-shaped recess in the body and a conductive region in the recess. The conductive region is made of a low-melting-temperature material, having a melting temperature lower than that of the materials forming the delimiting structure. | 10-31-2013 |
20130334675 | PACKAGE STRUCTURE HAVING LATERAL CONNECTIONS - An embodiment of a packaged semiconductor device includes a communication pad formed in a side surface, which is operatively coupled to a communication circuit so as to enable the establishing of a wireless communication channel to an adjacently positioned packaged semiconductor device. The communication pad may be formed upon cutting a block including the packaged semiconductor device and an appropriately positioned and dimensioned conductor. Thus, well-established techniques for incorporating a lead frame or any other conductive system in a package may be applied in order to impart wireless lateral connectivity to packaged semiconductor devices in an electronic system. | 12-19-2013 |
20140061892 | PACKAGED DEVICE EXPOSED TO ENVIRONMENTAL AIR AND LIQUIDS AND MANUFACTURING METHOD THEREOF - A packaged device, wherein at least one sensitive portion of a chip is enclosed in a chamber formed by a package. The package has an air-permeable area having a plurality of holes and a liquid-repellent structure so as to enable passage of air between an external environment and the chamber and block the passage of liquids. | 03-06-2014 |
20140083206 | PLANAR ELECTRIC BOARD WITH PLIABLE WINGS AND SYSTEM FOR SENSING COMPONENTS ALONG THREE COORDINATE AXIS OF INNER FORCES IN A BLOCK MADE OF A BUILDING MATERIAL - A planar electric circuit board may include a planar support of a foldable material defining a base surface and wings coupled to the base surface along respective folding lines so that the wings, when folded along the folding lines, are erected with respect to the base surface and remain in that position. An auxiliary circuit is on the planar support and may include pairs of capacitive coupling plates defined on the wings and on the base surface, and electric communication lines coupled to corresponding ones of the pairs of capacitive coupling plates. | 03-27-2014 |
20140084397 | WAFER-LEVEL PACKAGING OF A MEMS INTEGRATED DEVICE AND RELATED MANUFACTURING PROCESS - A wafer-level package for a MEMS integrated device, envisages: a first body integrating a micromechanical structure; a second body having an active region integrating an electronic circuit, coupled to the micromechanical structure; and a third body defining a covering structure for the first body. The second body defines a base portion of the package and has an inner surface coupled to which is the first body, and an outer surface provided on which are electrical contacts towards the electronic circuit; a routing layer has an inner surface set in contact with the outer surface of the second body and an outer surface that carries electrical contact elements towards the external environment. The third body defines a covering portion for covering the package and is directly coupled to the second body for closing a housing space for the first body. | 03-27-2014 |
20140182390 | INTEGRATED ELECTRONIC DEVICE FOR MONITORING MECHANICAL STRESS WITHIN A SOLID STRUCTURE - The integrated electronic device is for detecting a local parameter related to a force observed in a given direction, within a solid structure. The device includes at least one sensor configured to detect the above-mentioned local parameter at least in the given direction through piezo-resistive effect. At least one damping element, integrated in the device, is arranged within a frame-shaped region that is disposed around the at least one sensor and belongs to a substantially planar region comprising a plane passing through the sensor and perpendicular to the given direction. Such at least one damping element is configured to damp forces acting in the planar region and substantially perpendicular to the given direction. | 07-03-2014 |
20140182394 | INTEGRATED ELECTRONIC DEVICE FOR DETECTING A LOCAL PARAMETER RELATED TO A FORCE EXPERIENCED IN A PREDETERMINED DIRECTION, WITHIN A SOLID STRUCTURE - The integrated electronic device is for detecting a local parameter related to a force experienced in a predetermined direction within a solid structure. The device includes a semiconductor substrate having a substantially planar region that defines a plane substantially perpendicular to the predetermined direction. At least one sensor detects the local parameter at least in the predetermined direction with a piezo-resistive effect. At least one substantially planar face is arranged in a portion of the integrated electronic device, the face belonging to a inclined plane by a predetermined angle relative to the plane perpendicular to the predetermined direction, which plane is defined by the substantially planar region of the substrate. The predetermined angle is defined such as to reduce forces acting in directions other than the predetermined direction at the portion of the device around the at least one sensor. | 07-03-2014 |
20140231979 | STACKED ASSEMBLY OF A MEMS INTEGRATED DEVICE HAVING A REDUCED THICKNESS - An assembly of a MEMS integrated device envisages: a package having a base substrate with a main surface in a horizontal plane, and a coating set on the base substrate; a first body including semiconductor material and integrating a micromechanical structure, housed within the package on the base substrate; at least one second body including semiconductor material and integrating at least one electronic component, designed to be functionally coupled to the micromechanical structure, the first body and the second body being arranged within the package stacked in a vertical direction transverse to the horizontal plane. In particular, at least one between the first body and the base substrate defines a first recess, in which the second body is housed, at least in part. | 08-21-2014 |
20140291850 | METHOD FOR MANUFACTURING ELECTRONIC DEVICES - An embodiment for manufacturing electronic devices is proposed. The embodiment includes the following phases: a) forming a plurality of chips in a semiconductor material wafer including a main surface; each chip includes respective integrated electronic components and respective contact pads facing the main surface; said contact pads are electrically coupled to the integrated electronic components; b) attaching at least one conductive ribbon to at least one contact pad of each chip; c) covering the main surface of the semiconductor material wafer and the at least one conductive ribbon with a layer of plastic material; d) lapping an exposed surface of the layer of plastic material to remove a portion of the plastic material layer at least to uncover portions of the at least one conductive ribbon, and e) sectioning the semiconductor material wafer to separate the chips. | 10-02-2014 |
20150035091 | PROCESS FOR MANUFACTURING A PACKAGED DEVICE, IN PARTICULAR A PACKAGED MICRO-ELECTRO-MECHANICAL SENSOR, HAVING AN ACCESSIBLE STRUCTURE, SUCH AS A MEMS MICROPHONE AND PACKAGED DEVICE OBTAINED THEREBY - In order to manufacture a packaged device, a die having a sensitive region is bonded to a support, and a packaging mass of moldable material is molded on the support so as to surround the die. During molding of the packaging mass, a chamber is formed, which faces the sensitive region and is connected to the outside environment. To this end, a sacrificial mass of material that may evaporate/sublimate is dispensed on the sensitive region; the packaging mass is molded on the sacrificial mass; a through hole is formed in the packaging mass to extend as far as the sacrificial mass; the sacrificial mass is evaporated/sublimated through the hole. | 02-05-2015 |