Patent application number | Description | Published |
20120279651 | EPOXY COATING ON SUBSTRATE FOR DIE ATTACH - A system and method are disclosed for applying a die attach epoxy to substrates on a panel of substrates. The system includes a window clamp having one or more windows through which the epoxy may be applied onto the substrate panel. The size and shape of the one or more windows correspond to the size and shape of the area on the substrate to receive the die attach epoxy. Once the die attach epoxy is sprayed onto the substrate through the windows of the window clamp, the die may be affixed to the substrate and the epoxy cured in one or more curing steps. The system may further include a clean-up follower for cleaning epoxy off of the window clamp, and a window cleaning mechanism for cleaning epoxy off of the sidewalls of the windows of the window clamp. | 11-08-2012 |
20130015589 | CHIP-ON-PACKAGE STRUCTURE FOR MULTIPLE DIE STACKSAANM Liao; Chih-ChinAACI Changhua CountyAACO TWAAGP Liao; Chih-Chin Changhua County TWAANM Chiu; Chin-TienAACI Taichung CityAACO TWAAGP Chiu; Chin-Tien Taichung City TWAANM Yu; CheemanAACI FremontAAST CAAACO USAAGP Yu; Cheeman Fremont CA USAANM Upadhyayula; Suresh KumarAACI San JoseAAST CAAACO USAAGP Upadhyayula; Suresh Kumar San Jose CA USAANM Li; Wen ChengAACI Taichung CityAACO TWAAGP Li; Wen Cheng Taichung City TWAANM Lu; ZhongAACI ShanghaiAACO CNAAGP Lu; Zhong Shanghai CN - A multi-die semiconductor device is disclosed. The device may include one or more first-sized die on a substrate and one or more second-sized die affixed over the one or more first-sized die. The second-sized die may have a larger footprint than the first-sized die. An internal molding compound may be provided on the substrate having a footprint the same size as the second-sized die. The second-sized die may be supported on the internal molding compound. Thereafter, the first and second-sized die and the internal molding compound may be encapsulated in an external molding compound. | 01-17-2013 |
20140015116 | EMI SHIELDING AND THERMAL DISSIPATION FOR SEMICONDUCTOR DEVICE - A memory device including a metallic layer shielding electromagnetic radiation and/or dissipating heat, and a method of making the memory device, are disclosed. The metallic layer is formed on a metallic layer transfer assembly. The metallic layer transfer assembly and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the metallic layer is transferred from the shield to the encapsulated memory device. | 01-16-2014 |
20140183727 | WATERFALL WIRE BONDING - A wire bonded structure for a semiconductor device is disclosed. The wire bonded structure comprises a bonding pad; and a continuous length of wire mutually diffused with the bonding pad, the wire electrically coupling the bonding pad with a first electrical contact and a second electrical contact different from the first electrical contact. | 07-03-2014 |
20140346686 | METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVICES FORMED THEREBY - A memory device including graphical content and a method of making the memory device with graphical content are disclosed. The graphical content is formed on a release media. The release media and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the graphical content is transferred from the release media to the encapsulated memory device. | 11-27-2014 |
20150061157 | HIGH YIELD SEMICONDUCTOR DEVICE - A semiconductor device including two or more die stacks mounted to a substrate. The first die stack is mounted, at least partially encapsulated, and then tested. If the first die stack functions within predefined parameters, a second die stack is mounted on the first die stack, and then the device may undergo a second encapsulation process. Testing the first die stack before mounting the second improves yield by identifying faulty semiconductor die before all die are mounted within the semiconductor device. | 03-05-2015 |
20150115479 | SEMICONDUCTOR DIE LAMINATING DEVICE WITH INDEPENDENT DRIVES - A laminating device ( | 04-30-2015 |
20150155247 | BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIE - A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A bridge structure is also mounted to the substrate, with the semiconductor die fitting within a trench formed in a bottom surface of the bridge structure. The bridge structure may be formed from a semiconductor wafer into either a dummy bridge structure functioning as a mechanical spacer layer, or an IC bridge structure functioning as both a mechanical spacer layer and an integrated circuit semiconductor die. Memory die may also be mounted atop the bridge structure. | 06-04-2015 |