Patent application number | Description | Published |
20080196695 | EVENT-BASED DIRECT INJECTION ENGINE STARTING WITH A VARIABLE NUMBER OF INJECTIONS - A method for starting an internal combustion engine having direct fuel injection into a cylinder, comprising of only for a first combustion event under selected conditions during an engine start, directly injecting fuel to the cylinder at least twice, where each of said two injections at least partially occur during a compression stroke. | 08-21-2008 |
20080196696 | DIRECT INJECTION EVENT-BASED ENGINE STARTING - A method for starting an internal combustion engine having direct fuel injection, comprising of adjusting a number of direct injections per combustion cycle based on a cylinder event number from a first cylinder event. | 08-21-2008 |
20110100314 | DIRECT INJECTION EVENT-BASED ENGINE STARTING - A method for starting an internal combustion engine having direct fuel injection, comprising of adjusting a number of direct injections per combustion cycle based on a cylinder event number from a first cylinder event. | 05-05-2011 |
20110162621 | Shallow Piston Bowl And Injector Spray Pattern For A Gasoline, Direct-Injection Engine - A combustion system for a direct-injection, spark-ignition engine is disclosed. A side-mounted fuel injector located outboard the intake valves directs multiple fuel jets into a shallow, spherical bowl formed in a domed piston. Both good mixing to facilitate good air utilization with early injection and an ignitable mixture at the spark plug with late injection to facilitate cold start are provided with such a combustion system. Because the bowl is smooth and shallow, the surface area of the combustion chamber is less than with a deeper bowl of complicated shape. Lowering surface area in the combustion chamber leads to improved fuel economy. | 07-07-2011 |
20120191328 | DIRECT INJECTION EVENT-BASED ENGINE STARTING - A method for starting an internal combustion engine having direct fuel injection, comprising of adjusting a number of direct injections per combustion cycle based on a cylinder event number from a first cylinder event. | 07-26-2012 |
20130340718 | DIRECT INJECTION EVENT-BASED ENGINE STARTING - A method for starting an internal combustion engine having direct fuel injection, comprising of adjusting a number of direct injections per combustion cycle based on a cylinder event number from a first cylinder event. | 12-26-2013 |
20140137837 | DIRECT INJECTION EVENT-BASED ENGINE STARTING - A method for starting an internal combustion engine having direct fuel injection, comprising of adjusting a number of direct injections per combustion cycle based on a cylinder event number from a first cylinder event. | 05-22-2014 |
Patent application number | Description | Published |
20090233438 | SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESPUTTERING - A magnetron sputter reactor for sputtering deposition materials such as tantalum, tantalum nitride and copper, for example, and its method of use, in which self-ionized plasma (SIP) sputtering and inductively coupled plasma (ICP) sputtering are promoted, either together or alternately, in the same or different chambers. Also, bottom coverage may be thinned or eliminated by ICP resputtering in one chamber and SIP in another. SIP is promoted by a small magnetron having poles of unequal magnetic strength and a high power applied to the target during sputtering. ICP is provided by one or more RF coils which inductively couple RF energy into a plasma. The combined SIP-ICP layers can act as a liner or barrier or seed or nucleation layer for hole. In addition, an RF coil may be sputtered to provide protective material during ICP resputtering. In another chamber an array of auxiliary magnets positioned along sidewalls of a magnetron sputter reactor on a side towards the wafer from the target. The magnetron preferably is a small, strong one having a stronger outer pole of a first magnetic polarity surrounding a weaker outer pole of a second magnetic polarity and rotates about the central axis of the chamber. The auxiliary magnets preferably have the first magnetic polarity to draw the unbalanced magnetic field component toward the wafer. The auxiliary magnets may be either permanent magnets or electromagnets. | 09-17-2009 |
20090269922 | Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate - We disclose a method of depositing a metal seed layer on a wafer substrate comprising a plurality of recessed device features. The method comprises depositing a first portion of the metal seed layer on the wafer via plasma deposition at a sufficient ratio of wafer substrate bias to DC source power that bottom coverage is achieved while resputtering of surfaces of the recessed device features is inhibited. The method also comprises depositing a second portion of the metal seed layer at a ration of substrate RF bias to DC source power such that resputtering is not inhibited. | 10-29-2009 |
20110256716 | Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features - A method of depositing a metal seed layer with underlying barrier layer on a wafer substrate comprising a plurality of recessed device features. A first portion of the barrier layer is deposited on the wafer substrate without excessive build-up of barrier layer material on the openings to the plurality of recessed device features, while obtaining bottom coverage without substantial sputtering of the bottom surface. Subsequently, a metal seed layer is deposited using the same techniques used to deposit the barrier layer, to avoid excessive build up of metal seed layer material on the openings to the features, with minimal sputtering of the barrier layer surface. | 10-20-2011 |
20130168232 | COILS FOR GENERATING A PLASMA AND FOR SPUTTERING - A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece. | 07-04-2013 |
20140305802 | SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESPUTTERING - A magnetron sputter reactor for sputtering deposition materials such as tantalum, tantalum nitride and copper, for example, and its method of use, in which self-ionized plasma (SIP) sputtering and inductively coupled plasma (ICP) sputtering are promoted, either together or alternately, in the same or different chambers. Also, bottom coverage may be thinned or eliminated by ICP resputtering in one chamber and SIP in another. SIP is promoted by a small magnetron having poles of unequal magnetic strength and a high power applied to the target during sputtering. ICP is provided by one or more RF coils which inductively couple RF energy into a plasma. The combined SIP-ICP layers can act as a liner or barrier or seed or nucleation layer for hole. In addition, an RF coil may be sputtered to provide protective material during ICP resputtering. In another chamber an array of auxiliary magnets positioned along sidewalls of a magnetron sputter reactor on a side towards the wafer from the target. The magnetron preferably is a small, strong one having a stronger outer pole of a first magnetic polarity surrounding a weaker outer pole of a second magnetic polarity and rotates about the central axis of the chamber. The auxiliary magnets preferably have the first magnetic polarity to draw the unbalanced magnetic field component toward the wafer. The auxiliary magnets may be either permanent magnets or electromagnets. | 10-16-2014 |
Patent application number | Description | Published |
20090010009 | LED FLAT-PLATE TYPE MULTI-CHIP HIGH POWER LIGHT SOURCE - The present invention provides a LED flat-plate type multi-chip high power light source comprising a heat dissipating substrate, a reflecting cover mounted on the heat dissipating substrate, LEDs mounted on the heat dissipating substrate and in the reflecting cover, a circuit board embedded in the heat dissipating substrate connecting to the LEDs, and the circuit board also connecting to a socket set in the heat dissipating substrate. The heat dissipating substrate is made of high heat conduction metal. In the present invention, the heat dissipating substrate is made of high heat conduction metal, and the heat conducting pole is abolished. Comparing with the conventional art, the present invention decreases the heat dissipating path, increases the sectional area, and eliminates the intermediate link of high thermal resistance. | 01-08-2009 |
20090010010 | LED DIRECT-PLUGGING TYPE MULTI-CHIP HIGH POWER LIGHT SOURCE - The present invention provides a LED direct-plugging type multi-chip high power light source, comprising a heat dissipating substrate, a protecting rubber ring mounted at the obverse of the heat dissipating substrate, LEDs fixed on the heat dissipating substrate and in the protecting rubber ring, the heat dissipating substrate being provided with two through holes impenetrating its obverse and inverse, in each of the two through holes separately provided with a pin connecting to the LEDs, one end of the pin inserted into the through hole and the other end of the pin led out from the inverse of the heat dissipating substrate to the outside of the heat dissipating substrate, and the part of the pins inserted in the through holes being separated from the heat dissipating substrate by a dielectric. The heat dissipating substrate is made of high heat conduction metal. In the present invention, the heat dissipating substrate is made of high heat conduction metal, and the heat conducting pole is abolished. Comparing with the conventional art, the present invention decreases the heat dissipating path, increases the sectional area, and eliminates the intermediate link of high thermal resistance. The present invention increases the power of a single light source, decreases the attenuation of light greatly, and increases the useful life greatly. | 01-08-2009 |
Patent application number | Description | Published |
20150113580 | Convergence Terminal and Method for Providing Multi-Service by Convergence Terminal - A convergence terminal, including a set top box unit, a home gateway unit, a main control board and an interconnection backplane, where the main control board establishes a communication connection with each of a multimedia device and an Internet access device, the main control board connects, in a communication manner, to each of the set top box unit and the home gateway unit through the interconnection backplane. In the present invention, an objective of implementing that a television service and an Internet access service are separately provided through a service terminal is achieved, thereby reducing the number of service terminals used by a user for enjoying different services, and also reducing frequent wiring operations of the user on connection wires for inward connection and outward connection. | 04-23-2015 |
20150121364 | Method, User Equipment, and Application Server for Downloading Application - A method for downloading an application includes, after learning an application downloaded by a second user equipment, sending, by a first user equipment that has an association relationship with the second user equipment, a downloading request for the application downloaded by the second user equipment to an application server, where the downloading request carries capability information of the first user equipment, and receiving, by the first user equipment, an application to be downloaded, where the application matches the capability information of the first user equipment and is sent by the application server. By using the foregoing technical solution, the application does not need to be manually downloaded for the user equipment, thereby saving manual operation and improving flexibility of downloading an application. | 04-30-2015 |