Patent application number | Description | Published |
20090066315 | DYNAMIC MODULATION FOR MULTIPLEXATION OF MICROFLUIDIC AND NANOFLUIDIC BASED BIOSENSORS - The present invention generally relates to a method for rapidly counting micron and/or submicron particles by passing such particles through any of a plurality of microfluidic channels simultaneously with an ion current and measuring the signal generated thereby. The present invention also generally relates to a device for practicing the method of the present invention. Some embodiments can include methods and/or devices for distinguishing between and counting particles in mixtures. Still other embodiments can include methods and/or devices for identifying and/or counting bioparticles and/or bioactive particles such as pollen. | 03-12-2009 |
20100109686 | METAL WEAR DETECTION APPARATUS AND METHOD EMPLOYING MICROFLUIDIC ELECTRONIC DEVICE - An apparatus and a method for detection of wear particles in a lubricant are disclosed. The apparatus includes a microfluidic device including a microchannel sized for a lubricant containing wear particles to pass therethrough and first and second electrodes extending into the microchannel. A detection system is coupled with the electrodes for detection of wear particles passing through the microchannel, based on a change in capacitance of the electrodes. | 05-06-2010 |
20110005931 | APPARATUS AND METHOD FOR MANIPULATING MICRO COMPONENT - In one embodiment, a system for manipulation of a micro component includes a gripper subsystem for lifting, holding, and releasing a micro component. The gripper subsystem includes a base substrate having a work side and an opposing side, a positive electrode secured to the work side of the base substrate, a negative electrode suitably spaced from the positive electrode and secured to the work side of the base substrate, a dielectric layer formed over the work side of the base substrate and the positive and negative electrodes, and a hydrophobic layer comprising a hydrophobic material with predictable electrowetting behavior formed over the dielectric layer such that the dielectric layer is between the work side of the base substrate and the hydrophobic layer. A method for manipulation of a micro component is also provided as well as a method of manufacturing the system for manipulation of a micro component. | 01-13-2011 |
20140144216 | INTEGRATED ULTRASONIC-INDUCTIVE PULSE SENSOR FOR WEAR DEBRIS DETECTION - An apparatus for detecting wear particles in a fluid includes an inlet channel and an outlet channel. An ultrasonic transducer creating an acoustic wave that defines an acoustic focal zone is located between the inlet and outlet channels. A flow path located between the inlet and outlet channel is shaped to restrict the flow of the fluid to be within the acoustic focal zone. An inductive pulse sensor includes a plurality of flow channels receiving the fluid and a plurality of planar coils wound around the flow channels. The inductive pulse sensor includes a detection system for the detection of wear particles passing through the flow channels based on a change in an electrical property of the planar coils. A single combined excitation signal is sent to all the planar coils at once and the detection system measures one single output measurement for the plurality of flow channels. | 05-29-2014 |
20150233776 | WEARABLE INDUCTIVE-FORCE SENSOR - A wearable inductive-force sensor, which provides high-sensitivity dynamic measurements of both normal force and shear force, utilizes three spiral planar force sensing coils. These spiral planar coils allow the measurement of shear force in the x and y directions and the measurement of a normal force in the z direction. The force sensor is configured to be mounted in various locations, such as an insole of a shoe, so as to provide real-time force sensing of forces that are applied to a patient's feet as they move. In addition, force-measurement electronics used with the force sensor are configured to use resonance-frequency division signal multiplexing to monitor the response of the force sensing coils, which allows the sensor to have minimal complexity, while still being highly sensitive. | 08-20-2015 |
20150323301 | HIGH SENSITIVITY INDUCTIVE SENSOR FOR MEASURING BLADE TIP CLEARANCE - A high sensitivity inductive sensor for measuring clearance of a rotating blade tip includes a one or more of sensing coils. The sensing coils are formed of magnet wire, which is wound to form planar spiral coils. Each of the coils are coupled in series with a function generator, which applies an excitation signal thereto. Accordingly, based on the change in impedance of the coils, a clearance measurement, which identifies the distance between the coil and the tip of the rotating blade can be obtained using predetermined calibration curve values. | 11-12-2015 |
20160081822 | LOW-POWER METHOD AND DEVICE FOR COOLING PROSTHETIC LIMB SOCKET BASED ON PHASE CHANGE - A prosthesis includes a socket for receiving a residual limb, the socket having a socket wall defining a limb-receiving surface; a heat pipe including a working fluid and a wicking structure, the heat pipe having a socket section and a heat sink section, the heat pipe extending along its length through the socket wall proximate to or exposed at the limb-receiving surface, wherein the working fluid has a boiling point of from about 0° C. to 90° C. such that the working fluid is adapted to evaporate to form vapor under the influence of the heat of a residual limb in the socket thus drawing heat from and cooling the residual limb. A heat sink section of the heat pipe passes through the heat sink, the heat sink reducing the temperature of the working fluid. | 03-24-2016 |
Patent application number | Description | Published |
20090092273 | Silicon microphone with enhanced impact proof structure using bonding wires - A backplateless silicon microphone and a wire protection method for improved impact resistance are disclosed. A circular diaphragm is surrounded by a circular spring having a plurality of slots and perforations to facilitate air damping reduction, release of in-plane stress, and improve out-plane flexibility. Anchored at a substrate, the circular spring holds the silicon microphone suspended over a backside hole in the substrate but allows the diaphragm to vibrate perpendicular to the substrate. A microphone variable capacitor is formed between the perforated spring and substrate. Slot size is minimized to prevent particles from entering an underlying air gap. A plurality of “n” bonding pads near the outer edge of the circular spring are connected by “n/2” bonding wires that serve as a stopper to restrict an upward motion of the diaphragm. The bonding wires may cross each other to enable lower loop height for more effective resistance to impact. | 04-09-2009 |
20090208037 | Silicon microphone without dedicated backplate - Various embodiments of a silicon microphone sensing element without dedicated backplate are disclosed. The microphone sensing element has a circular or polygonal diaphragm with a plurality of perforated springs suspended above the front side of a conductive substrate. The diaphragm is aligned above one or more back holes in the substrate having a front opening smaller than the diaphragm. In one embodiment, a continuous perforated spring surrounds the diaphragm and has a shape that conforms to the diaphragm. A plurality of perforated beams connects the spring to rigid pads that anchor the movable diaphragm and spring. In another embodiment, there is a plurality of perforated springs having double or triple folding configurations and a plurality of perforated beams connecting the diaphragm to rigid pads. Also disclosed is a scheme to integrate the silicon microphone sensing element with CMOS devices on a single chip. | 08-20-2009 |
20090218668 | Double-side mountable MEMS package - The MEMS package has a mounting substrate on which one or more transducer chips are mounted wherein the mounting substrate has an opening. A top cover is attached to and separated from the mounting substrate by a spacer forming a housing enclosed by the top cover, the spacer, and the mounting substrate and accessed by the opening. Electrical connections are made between the one or more transducer chips and the mounting substrate and/or between the one or more transducer chips and the top cover. A bottom cover can be mounted on a bottom surface of the mounting substrate wherein a hollow chamber is formed between the mounting substrate and the bottom cover, wherein a second opening in the bottom cover is not aligned with the first opening. Pads on outside surfaces of the top and bottom covers can be used for further attachment to printed circuit boards. The top and bottom covers can be a flexible printed circuit board folded under the mounting substrate. | 09-03-2009 |
20100090295 | Folded lead-frame packages for MEMS devices - The MEMS package comprises a first and a second pre-molded lead-frame substrate, at least one of them having a cavity formed by plastic sidewalls along its periphery. The first and second pre-molded lead-frame substrates are interconnected with metal leads. At least one MEMS device is attached to one of the substrates. The first pre-molded lead-frame substrate is folded over and joined to the second pre-molded lead-frame substrate to house the at least one MEMS device. In one embodiment, the first pre-molded lead-frame substrate has metal leads extending outside of sidewalls of the cavities. The extended metal leads are folded over the top of the second pre-molded lead-frame substrate to form surface mounting pads. In some embodiments, extended metal leads are folded along the sidewalls and connected to ground for electromagnetic interference (EMI) shielding. | 04-15-2010 |
20100108478 | MEMS G-switch device - A Micro Electro Mechanical Systems (MEMS) G-switch includes one or more actuators formed between fixed driving stages and moveable driving stages. A proof mass is attached to the moveable driving stages and flexibly attached to a substrate through one or more spring members. A voltage control circuit applies working voltages to the driving stages. With a first working voltage applied between the moveable and the fixed driving stages, moving of the driving stages' sensing direction towards gravity at a first critical angle will cause moveable driving stages to collapse and touch the fixed driving stage on the substrate and thus turn on the MEMS G-switch. After turning on the G-switch, a second working voltage is applied and moving of the driving stages' sensing direction away from gravity at a second critical angle will cause moveable electrodes to deviate from the fixed electrodes and thus turn off the MEMS G-switch. | 05-06-2010 |
20110062573 | Double-side mountable MEMS package - The MEMS package has a mounting substrate on which one or more transducer chips are mounted wherein the mounting substrate has an opening. A top cover is attached to and separated from the mounting substrate by a spacer forming a housing enclosed by the top cover, the spacer, and the mounting substrate and accessed by the opening. Electrical connections are made between the one or more transducer chips and the mounting substrate and/or between the one or more transducer chips and the top cover. A bottom cover can be mounted on a bottom surface of the mounting substrate wherein a hollow chamber is formed between the mounting substrate and the bottom cover, wherein a second opening in the bottom cover is not aligned with the first opening. Pads on outside surfaces of the top and bottom covers can be used for further attachment to printed circuit boards. The top and bottom covers can be a flexible printed circuit board folded under the mounting substrate. | 03-17-2011 |