Zhan, TW
Chau-Jie Zhan, New Taipei City TW
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20120161336 | SEMICONDUCTOR DEVICE AND ASSEMBLING METHOD THEREOF - A semiconductor device and an assembling method thereof are provided. The semiconductor device includes a chip, a carrier, a plurality of first conductive elements and a plurality of second conductive elements. The chip has a plurality of first pads. The carrier has a plurality of second pads. The second pads correspond to the first pads. Each first conductive element is disposed between one of the first pads and one of the second pads. Each second conductive element is disposed between one of the first pads and one of the second pads. A volume ratio of intermetallic compound of the second conductive elements is greater than a volume ratio of intermetallic compound of the first conductive elements. | 06-28-2012 |
20130168851 | BUMP STRUCTURE AND ELECTRONIC PACKAGING SOLDER JOINT STRUCTURE AND FABRICATING METHOD THEREOF - A bump structure includes a substrate, a pad, an electrode and a protruding electrode. The pad is disposed on the substrate. The electrode is formed by a first metal material and disposed on the pad. The protruding electrode is formed by a second metal material and disposed on the electrode, wherein a cross-sectional area of the protruding electrode is less than a cross-sectional area of the electrode. | 07-04-2013 |
Chau-Jie Zhan, Taipei County TW
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20100163292 | PACKAGE CARRIER - A package carrier including a substrate, at least an under bump metallurgic (UBM) layer and at least a conductive bump is provided. The substrate has a conductive structure and at least a pad connected with the conductive structure. A region of the pad connected with the conductive structure is a signal source region. The UBM layer is disposed on the pad and includes a first conductive pattern and a second conductive pattern. A side wall of the second conductive pattern is directly connected to a side wall of the first conductive pattern, and the second conductive pattern is disposed close to the signal source region. The conductivity of the second conductive pattern is smaller than the conductivity of the first conductive pattern. The conductive bump is disposed on the UBM layer. | 07-01-2010 |
20100207266 | CHIP PACKAGE STRUCTURE - A chip package structure including a substrate, a plurality of electrodes, a chip, and a plurality of bumps is provided. Each of the electrodes has a bottom portion and an annular element, wherein the bottom portion is disposed on the substrate, the annular element is disposed on the bottom portion, and the bottom portion and the annular element define a containing recess. The chip is disposed above the substrate and has an active surface facing the substrate and a plurality of pads disposed on the active surface. The bumps are respectively disposed on the pads and respectively inserted into the containing recesses. The melting point of the electrodes is higher than that of the bumps. A chip package method is also provided. | 08-19-2010 |
20110156253 | MICRO-BUMP STRUCTURE - A dished micro-bump structure with self-aligning functions is provided. The micro-bump structure takes advantage of the central concavity for achieving the accurate alignment with the corresponding micro-bumps. | 06-30-2011 |
20110227190 | ELECTRONIC DEVICE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - The invention provides an electronic device package structure and method of fabrication thereof. The electronic device package structure includes a chip having an active surface and a bottom surface. A dielectric layer is disposed on the active surface of the chip. At least one trench is formed through the dielectric layer. A first protection layer covers the dielectric layer and sidewalls of the trench. A second protection layer covers the first protection layer, filling the trench. | 09-22-2011 |
20120125669 | PACKAGE CARRIER - A package carrier including a substrate, at least an under bump metallurgic (UBM) layer and at least a conductive bump is provided. The substrate has a conductive structure and at least a pad connected with the conductive structure. A region of the pad connected with the conductive structure is a signal source region. The UBM layer is disposed on the pad and includes a first conductive pattern and a second conductive pattern. A side wall of the second conductive pattern is directly connected to a side wall of the first conductive pattern, and the second conductive pattern is disposed close to the signal source region. The conductivity of the second conductive pattern is smaller than the conductivity of the first conductive pattern. The conductive bump is disposed on the UBM layer. | 05-24-2012 |
Chau-Jie Zhan, Chutung TW
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20150187737 | MOLDING PACKAGE ASSEMBLY AND MOLDING MATERIAL - A molding package assembly is provided, which includes a substrate and first and second molding packages stacked on the substrate. Each of the first and second molding packages has a semiconductor element, an anti-warping structure disposed around a periphery of the semiconductor element, a molding material encapsulating the semiconductor element and the anti-warping structure, and a protection layer formed on the semiconductor element, the molding material and the anti-warping structure. The anti-warping structure facilitates to prevent warping of the molding package assembly during a molding process. | 07-02-2015 |
Cheng-Yan Zhan, Taipei TW
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20150041966 | Methods and Systems for Dopant Activation Using Microwave Radiation - Systems and methods are provided for activating dopants in a semiconductor structure. For example, a semiconductor structure including a plurality of dopants is provided. One or more microwave-absorption materials are provided, the microwave-absorption materials being capable of increasing an electric field density associated with the semiconductor structure. Microwave radiation is applied to the microwave-absorption materials and the semiconductor structure to activate the plurality of dopants for fabricating semiconductor devices. The microwave-absorption materials are configured to increase the electric field density in response to the microwave radiation so as to increase the semiconductor structure's absorption of the microwave radiation to activate the dopants. | 02-12-2015 |
Cheng Zhou Zhan, Taipei City TW
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20140293736 | LOW COMPLEXITY MOTION COMPENSATING BEAMFORMING SYSTEM AND METHOD THEREOF - A low complexity motion compensating beamforming system utilizes a probe array to fire for beamforming by synthetic apertures. The beamforming range of each firing is a region of interest (ROI), and the common area of adjacent ROI's forms the common ROI. The central image beam of the common ROI is used to generate image beam vectors, in order to analyze the cross-correlation for the corresponding low resolution images (LRI's). The analysis result is used to compute an offset for sequentially compensating and combining the LRI's to form a high resolution image (HRI). The mechanism helps improve the quality of ultrasonic beamforming and the frame rate. | 10-02-2014 |
Cheng-Zhou Zhan, New Taipei City TW
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20130114664 | METHOD AND APPARATUS FOR PERFORMING CHANNEL SHORTENING EQUALIZATION WITH FREQUENCY NOTCH MITIGATION - A method for performing channel shortening equalization with frequency notch mitigation is provided, where the method is applied to an electronic device. The method includes: obtaining channel response information from channel estimation to determine a relaxed channel convolution matrix corresponding to the channel response information, with the relaxed channel convolution matrix being a partial matrix of a channel convolution matrix corresponding to the channel response information, wherein the relaxed channel convolution matrix is obtained from omitting a portion of matrix elements of the channel convolution matrix; and based upon the relaxed channel convolution matrix, jointly performing time domain channel shortening control and frequency domain flatness control over the TEQ to perform channel shortening equalization with frequency notch mitigation by utilizing the TEQ. In particular, the portion of matrix elements includes a plurality of rows of matrix elements within the channel convolution matrix. An associated apparatus is also provided. | 05-09-2013 |
Cheng-Zhou Zhan, Taipei County TW
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20100111213 | SINGULAR VALUE DECOMPOSING METHOD AND RELATED SINGULAR VALUE DECOMPOSING DEVICE - A method for performing a singular value decomposition (SVD) upon a matrix. The method includes the steps of: (a) simplifying the matrix to derive a simplified matrix; (b) performing an iterative matrix multiplication upon the simplified matrix to generate an iterated matrix; (c) extracting a vector of the iterated matrix according to an iteration number of the iterative matrix multiplication; (d) de-correlating the simplified matrix from the vector to update the simplified matrix; (e) repeating steps (b), (c), and (d) until a predetermined number of vectors have been derived; and (f) storing a first unitary matrix determined according to the predetermined number of vectors in the singular value decomposition. | 05-06-2010 |
Hao-Jie Zhan, Hsin-Chu TW
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20140021995 | D Flip-Flop with High-Swing Output - A D flip-flop includes a first switch, a level shifter, and a second switch therein. The first switch includes a first input and a first output. The level shifter includes a second input coupled to the first input, and a second output. The second switch includes a third input coupled to the second output, and a third output. The first input and the third output form an input and an output of the D flip-flop. | 01-23-2014 |
Hao-Jie Zhan, Hsinchu City TW
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20120169361 | BUILT IN SELF TEST FOR TRANSCEIVER - An integrated circuit (IC), comprises a receiver on an IC substrate. The receiver is configured to receive a stressed input signal. A built in self test (BIST) circuit is provided on the IC substrate for testing the receiver. The BIST circuit comprises an encoder configured for receiving an input signal and identifying whether a first condition is present, in which two or more consecutive input data bits have the same polarity as each other. An output driver circuit provides the stressed input signal corresponding to the two or more consecutive input data bits. The stressed input signal has an amplitude that is larger when the encoder identifies that the first condition is present and smaller when the encoder identifies that two or more consecutive input data bits have different polarity from each other. | 07-05-2012 |
20130029622 | SQUELCH DETECTOR CIRCUIT AND METHOD - A squelch detector includes a first circuit, a second circuit, and a comparator. The first circuit is configured to receive a first pair of differential input signals and in response output a second pair of differential signals. The second pair of differential signals have higher voltages than the first pair of differential input signals. The second circuit is coupled to the first circuit and is configured to extract first and second voltage levels from the second pair of differential signals. The comparator is configured to output a squelch level signal based on a comparison of the first voltage level and a third voltage level. The third voltage level is based on the second voltage level and a reference voltage. | 01-31-2013 |
20130127520 | TRACKING CIRCUIT - A circuit includes a switching circuit, a node, and a tracking circuit. The switching circuit has a first terminal, a second terminal, and a third terminal. The node has a node voltage. The tracking circuit is electrically coupled to the third terminal and the node, and configured to receive the node voltage and generate a control voltage at the third terminal based on the node voltage. | 05-23-2013 |
20130241615 | HIGH VOLTAGE SWING DECOMPOSITION METHOD AND APPARATUS - A voltage swing decomposition circuit includes first and second clamp circuits and a protection circuit. The first clamp circuit is configured to clamp an output node of the first clamp circuit at a first voltage level when an input node of the voltage swing decomposition circuit has a voltage higher than the first voltage level. The second clamp circuit is configured to clamp an output node of the second clamp circuit at a second voltage level, higher than the first level, when the voltage of the input node is lower than the second voltage level. The protection circuit is coupled to the output nodes of the first and second clamp circuits, and is configured to selectively set an output node of the protection circuit to the first or second voltage level. The first and second clamp circuits are coupled together by the output node of the protection circuit. | 09-19-2013 |
Jian-Hua Zhan, Taipei TW
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20140042254 | PAPER SHREDDER WITH ALLOWABLE THICKNESS WARNING FUNCTION - A paper shredder with an allowable thickness warning function is provided. The paper shredder includes a casing and an upper cover. An input tray is disposed on the casing for placing plural papers thereon. A pressing member and a thickness detecting device are installed on the upper cover. When the pressing member is contacted with the plural papers on the input tray and pushed by the plural papers, the pressing member is moved. The thickness detecting device is located near the pressing member. Moreover, in response to the movement of the pressing member, the thickness detecting device may be triggered. If an overall thickness of the plural papers exceeds an allowable thickness, the pressing member is pushed by the plural papers. Consequently, the thickness detecting device is triggered by the pressing member to generate a warning signal. | 02-13-2014 |
Jing-Hon Conan Zhan, Hsinchu City TW
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20090174491 | Mixed-Mode PLL - A mixed-mode PLL is disclosed. The mixed-mode PLL comprises an analog phase correction path and a digital frequency correction path. The analog phase correction path comprises a linear phase correction unit (LPCU). The digital frequency correction path comprises a digital integral path circuit. | 07-09-2009 |
Jing-Hong C. Zhan, Hsinchu TW
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20080219329 | Local oscillator control in radio receivers - A radio receiver measures a signal quality metric and modifies attributes of a local oscillator signal in response thereto. A digital signal processor may be used to determine a signal-to-noise-plus-distortion ratio (SNDR) of a baseband signal, and the overlap of two quadrature-related local oscillator signals may be modified. | 09-11-2008 |
20110063169 | PHASED-ARRAY TRANSCEIVER FOR MILLIMETER-WAVE FREQUENCIES - A phased-array transmitter and receiver that may be effectively implemented on a silicon substrate. The transmitter distributes to front-ends, and the receiver combines signals from front-ends, using a power distribution/combination tree that employs both passive and active elements. By monitoring the power inputs and outputs, a digital control is able to rapidly provide phase and gain correction information to the front-ends. Such a transmitter/receiver includes a plurality of radio frequency (RF) front-ends and a power splitting/combining network that includes active and passive components configured to distribute signals to/from the front-ends. | 03-17-2011 |
20140132450 | PHASED-ARRAY TRANSCEIVER FOR MILLIMETER-WAVE FREQUENCIES - A phased-array receiver that may be effectively implemented on a silicon substrate. A receiver includes multiple radio frequency (RF) front-ends, each configured to receive a signal with a given delay relative to the others such that the gain of the received signal is highest in a given direction. The receiver also includes a power combination network configured to accept an RF signal from each of the RF front-ends and to pass a combined RF signal to a down-conversion element, where the power distribution network includes a combination of active and passive components. Each RF front-end includes a phase shifter configured to delay the signal in accordance with the given direction and a variable amplifier configured to adjust the gain of the signal. | 05-15-2014 |
Jing-Hong Conan Zhan, Hsinchu City TW
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20120293362 | PHASE-ARRAYED DEVICE AND METHOD FOR CALIBRATING THE PHASE-ARRAYED DEVICE - A phase-arrayed device includes: a signal processing circuit arranged to generate a specific signal; a first phase-arrayed channel arranged to provide a first phase-arrayed signal according to the specific signal; a first conducting path arranged to conduct the specific signal to the first phase-arrayed channel; a second conducting path arranged to conduct the first phase-arrayed signal to the signal processing circuit; and a detecting circuit, arranged to detect a mismatch between the first phase-arrayed signal and a reference signal to generate a detecting signal utilized for calibrating the first phase-arrayed signal. | 11-22-2012 |
20120294338 | PHASE-ARRAYED TRANSCEIVER - A phased-array transceiver includes: a plurality of antennas; a plurality of transceiving elements respectively coupled to the plurality of antennas, at least one of the transceiving elements comprising a first transmitting circuit and a first receiving circuit; a signal processing block; and a first distributed network, coupled between the signal processing block and the transceiving elements, wherein the transceiving elements, the signal processing block, and the first distributed network are configured as a single chip, and a first path from the antenna through the first receiving circuit to the signal processing block and a second path from the signal processing block through the first transmitting circuit to the antenna share at least partial signal traces of the phased-array transceiver. | 11-22-2012 |
20130093533 | M-WAY COUPLER - An M-way coupler having a first port, M second ports, M transmission line sections, M isolation resistors and a phase shifting network is disclosed, where M is an integer number greater than 1. The M transmission line sections couple the first port to the M second ports, respectively. Each of the M isolation resistors has a first terminal and a second terminal. The first terminals of the M isolation resistors are coupled to the M second ports, respectively. The phase shifting network has M I/O terminals coupled to the second terminals of the M isolation resistors, respectively. The phase shifting network is arranged to provide a phase shift within a predetermined tolerance margin between arbitrary two I/O terminals of the M I/O terminals of the phase shifting network. | 04-18-2013 |
20130156085 | PHASED ARRAY DEVICE AND CALIBRATION METHOD THEREFOR - The calibration method, performed on a phased array device including channel elements coupled in parallel by a transmission line, has the steps of: obtaining channel responses corresponding to the channel elements through the transmission line, and each of the channel responses is obtained when one of the channel elements is turned on, and the rest of the channel elements are turned off; calculating a characteristic value corresponding to the transmission line based on the obtained channel responses of the channel elements; and adjusting a channel parameter of one of the channel elements based on the characteristic value of the transmission line. | 06-20-2013 |
Peng-Han Zhan, New Taipei City TW
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20140321700 | LIGHT SENSING MODULE AND SYSTEM - A light sensing module used in a light sensing system incorporated with a processor includes at least one first light source, for emitting light; at least one first light sensor, for sensing the light emitted by the first light source, light reflected by an ambient object or ambient light, in order to obtain a sensing result; a control unit, for performing image detecting and object identification or ambient light sensing by computing according to the sensing result, and generating a computational result; and at least one interrupt driver, for sending an interrupt signal to the processor, in order to notify the processor to receive the computational result; wherein the processor disposes a type and a number of the first light sensor, and configures the control unit accordingly, so that the control unit performs computation on the sensing result to generate the computational result. | 10-30-2014 |
20140325108 | METHOD OF INTERRUPT CONTROL AND ELECTRONIC SYSTEM USING THE SAME - A method of interrupt control for a control unit of an electronic system includes receiving digital data; determining a value of the digital data; and sending interrupt signals to a host by the following methods according to the value: when the control unit is in a second signal sending status and after the value of the digital data increases to be greater than a first threshold and remains greater than the first threshold for a first period of time, switching the control unit to a first signal sending status; and when the control unit is in the first signal sending status and after the value of the digital data decreases to be smaller than a second threshold and remains smaller than the second threshold for a second period of time, switching the control unit to the second signal sending status. The second threshold is smaller than the first threshold. | 10-30-2014 |
20140325109 | METHOD OF INTERRUPT CONTROL AND ELECTRONIC SYSTEM USING THE SAME - A method of interrupt control for an electronic system, the electronic system including a host and an electronic device, includes receiving digital data generated by the electronic device; determining a value of the digital data and dividing a possible range of the value of the digital data into a plurality of regions; and sending an interrupt signal to the host when the value of the digital data changes from a first region among the plurality of regions to a second region among the plurality of regions and remains within the second region for a specific period of time. | 10-30-2014 |
Shu-Su Zhan, Taichung City TW
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20090288516 | Control Structure for a Two-Way Ratchet Tool - A control structure for a two-way ratchet tool comprises a handle, an adjustment member, a ratchet member and a control member. The handle includes a shank portion, a drive portion and a ratchet portion including a positioning groove, a sliding surface and a protruding stop ring. The sliding surface includes an arc groove for accommodation of an elastic member, and the positioning groove includes an adjustment recess for accommodation of a push member and a spring. The adjustment member includes plural teeth on an upper end thereof and an adjustment rod at one side thereof. The ratchet member includes a smooth surface and a toothed surface on an outer periphery thereof and a wavy engaging surface on an inner periphery thereof. The control member includes a ring body with a wavy outer surface and a control end, the ring body includes a locking groove for accommodation of a C-shaped clip, and a limiting recess. | 11-26-2009 |
20100257979 | Open End Ratchet Wrench - An open end ratchet wrench is defined with a gap which allows the ratchet wrench to pass through a pipe or obstacle to carry out rotation, thus improving the operability and convenience of the wrench. Both ends of the open end ratchet wrench extend outward to form a stopping piece, respectively. The stopping pieces allow the toothed pawl to be well positioned and prevent it from disengaging, thus maintaining a stable torque and making the ratchet wrench easy to use. | 10-14-2010 |
Wei-Chen Zhan, Taichung TW
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20110058264 | Lens Module of Scanner - A lens module of a scanner is provided, including a first lens with a positive diopter, a second lens with a negative diopter, a third lens with a positive diopter, and a fourth lens with a negative diopter. The first, second, third, and fourth lenses are sequentially arranged from an object end to an image end of the lens module, and at least one of the first and fourth lenses is an aspheric lens. The fourth lens has a focal length f | 03-10-2011 |
Wentao Zhan, Taoyuan Hsien TW
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20140009982 | FEEDBACK CONTROL CIRCUIT FOR POWER CONVERTER AND POWER CONVERTER SYSTEM - A feedback control circuit for a power converter and a power converter system, includes a sampling network, configured to sample an input or output of the power converter, and output a first sampled signal; a filtering network, configured to receive the first sampled signal and output a second sampled signal, the filtering network filtering a ripple signal at a preset frequency out from the first sampled signal, so as to remain signals therein outside the preset frequency, while maintaining a phase delay between the second sampled signal and the first sampled signal within a preset range; a control and drive circuit, configured to receive the second sampled signal, and regulate in accordance with the second sampled signal a control signal outputted from the control and drive circuit to the power converter. | 01-09-2014 |
Wen-Tao Zhan, Taoyuan Hsien TW
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20130235629 | STARTER OF GRID-CONNECTED INVERTER AND CONTROL METHOD THEREOF - A starter of the grid-connected inverter and a control method thereof are disclosed. The starter comprises a controller, and a first switch and a first resistor connected in parallel. The controller includes an input end, and first and second output ends. The input end inspects the DC voltage signal from the inverter. When the DC voltage exceeds a predetermined voltage threshold, the first output end sends a first control signal to turn on the first switch, and the second output end sends a second control signal to make the grid-connected inverter enter into a chopping mode. There is a delay period between the send time of the first control signal and that of the second control signal. | 09-12-2013 |
Xiao-Bing Zhan, New District TW
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20090219587 | SCANNER AND HOMING METHOD OF SCANNING MODULE THEREOF - A scanner including a casing, a scanning platform, a scanning module and a positioning plate is provided. The scanning platform is embedded in the casing and exposes a surface to carry a to-be-scanned document. The scanning module is disposed under the scanning platform. The positioning plate disposed on an inner wall of the casing is adjacent to a top side of the scanning platform. The scanning module is for capturing images of the positioning plate and the inner wall and for identifying the image corresponding to one x-axis side of the positioning plate. The scanner defines a scanning start line according to the image corresponding to the x-axis side. The scanning module is moved from the scanning start line along a y-axis direction and captures an image of the to-be-scanned document. The x-axis side and the scanning start line are perpendicular to the y-axis direction perpendicular to the top side. | 09-03-2009 |
You-Zhong Zhan, Pingtung County TW
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20140093597 | USE OF ALCOHOL EXTRACT OF LONGAN SEEDS - The present invention provides use of alcohol extract of longan seeds for manufacturing a drug for treating kidney tissue dysfunction. Preferably, an ethyl acetate sub-fraction of the alcohol extract of longan seeds has a better effect in treating kidney tissue dysfunction. | 04-03-2014 |
Zhi-Jun Zhan, Jhuolan Township TW
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20090118580 | Image-type intubation-aiding device - An image-type intubation-aiding device comprises a small-size image sensor and a light source module both placed into an endotracheal tube to help doctors with quick intubation. Light from light emission devices in the light source module passes through a transparent housing and is reflected by a target and then focused. The optical signal is converted into a digital or analog electric signal by the image sensor for displaying on a display device after processing. Doctors can thus be helped to quickly find the position of trachea, keep an appropriate distance from a patient for reducing the possibility of infection, and lower the medical treatment cost. Disposable products are available to avoid the problem of infection. The intubation-aiding device can be used as an electronic surgical image examination instrument for penetration into a body. Moreover, a light source with tunable wavelengths can be used to increase the spot ratio of nidus. | 05-07-2009 |