Patent application number | Description | Published |
20110204837 | SYSTEM AND METHOD FOR CONTROLLING DUTY CYCLE OF CPU FAN - A fan duty cycle controlling system and method are implemented by a computing device. The fan duty cycle controlling system obtains an optimum duty cycle range of a fan around a central processing unit (CPU), and controls the fan to operate at the optimum duty cycle range. By implementing the system and method, the computing device can obtain an optimum cooling efficiency of the computer system, and reduce system noise generated by the fan when the fan operates at the optimum duty cycle range. | 08-25-2011 |
20110235263 | HARD DISK BACKPLANE STRUCTURE AND HARD DISK COOLING ASSEMBLY USING THE SAME - A hard disk backplane structure includes a main body and an additional board. The hard disk backplane structure includes a first side surface and second side surface adjacent to the first side surface and a backplane connector. The additional board includes a receptacle for connection with an additional electrical component. A hard disk cooling assembly using the hard disk backplane structure is also provided in the disclosure. | 09-29-2011 |
20110235273 | CASE AND ELECTRONIC DEVICE HAVING THE SAME - A case includes a box, a top cover, a first airflow guide member, and a second airflow guide member. The box has an opening sealed by the top cover. The first airflow guide member and the second airflow guide member are fixed on at least one of the top cover and a side plate of the box. The first airflow guide member and the second airflow guide member are spaced from each other, and cooperatively define a guide channel. The box defines an inlet and an outlet communicating with the guide channel. | 09-29-2011 |
20110247796 | HEAT SINK - A heat sink includes a main body, a base formed on a bottom of the main body, and a conducting member attached to a bottom of the base. The heat exchange coefficient of the conducting member is higher than the heat exchange coefficient of the base. | 10-13-2011 |
20110292608 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes first and second heat sinks adapted for being thermally attached to first and second electronic components, respectively; and a heat pipe thermally interconnecting the first heat sink with the second heat sink. | 12-01-2011 |
20110292610 | HEAT SINK AND ELECTRONIC APPARATUS USING THE SAME - A heat sink includes a bottom plate, a plurality of fins, an extending member, and a heat conduction member. The plurality of fins is fixed on the bottom plate. The extending member extends outward from an end of the bottom plate. The heat conduction member depends from an end of the extending member. | 12-01-2011 |
20110299252 | EXPANSION CARD ASSEMBLY AND HEAT SINK THEREOF - An expansion card assembly includes an expansion card and a heat sink. The expansion card includes a board and an electronic component mounted on the board. The board has a component side on which the electronic component is mounted and an opposite solder side. The heat sink includes a U-shaped base. The base includes a heat absorbing plate, an opposite heat dissipation plate and a middle connecting plate. An end of the board adjacent to the electronic component is received in a receiving space of the base defined between the heat absorbing plate and the heat dissipation plate. The heat absorbing plate and the heat dissipation plate of the base are respectively located the component side and the solder side of the board to sandwich the end of the board therebetween. The heat absorbing plate is attached to the electronic component. | 12-08-2011 |
20110304992 | HEAT DISSIPATION DEVICE - A heat dissipation device is used to cool a storage device. The heat dissipation device includes a heat sink and two parallel conduction boards. The heat sink includes a base and a number of fins extending from a first side of the base. A guiding channel is defined between every two adjacent fins to guide airflow. The two conduction boards are attached to a second side of base opposite to the first side. A receiving space is defined between the two conduction boards for receiving the storage device therein. | 12-15-2011 |
20110305559 | HEAT DISSIPATION DEVICE AND CENTRIFUGAL FAN THEREOF - An exemplary heat dissipation device includes a centrifugal fan and a fin assembly. The centrifugal fan includes a fan frame and an impeller mounted in the fan frame. The fan frame includes a base plate, a cover plate and a side wall extending between the base plate and the cover plate. An air outlet is defined in the side wall. | 12-15-2011 |
20110310567 | HEAT SINK AND ELECTRONIC DEVICE USING THE SAME - An electronic device includes a chassis, a circuit board installed in the chassis, a memory card coupled to the circuit board, and a heat sink for cooling the memory card. The heat sink includes a first cooling plate, a second cooling plate, and a connection member connected between corresponding sides of the first cooling plate and the second cooling plate. A conducting member extends from the connection member, and contacts the chassis. | 12-22-2011 |
20110320062 | COMPUTING DEVICE AND METHOD FOR CONTROLLING TEMPERATURE THEREOF - A method for control a temperature of a computing device detects a first CPU temperature T | 12-29-2011 |
20120000625 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device, configured for dissipating heat of an electronic component, includes a first heat sink and a second heat sink detachably mounted to a lateral side of the first heat sink. The first heat sink is attached to the electronic component. The second heat sink has a smaller size than the first heat sink. | 01-05-2012 |
20120002371 | ELECTRONIC DEVICE WITH HEAT DISSIPATION APPARATUS - An electronic device includes an enclosure, a circuit board disposed within the enclosure, a heat sink, and a thermally conductive member. A heat-generating electronic component is fixed to the circuit board. The heat sink is in contact with the heat-generating electronic component. Two ends of the thermally conductive member are respectively fixed to the enclosure and the heat sink. | 01-05-2012 |
20120039040 | ELECTRONIC DEVICE AND INDUCTOR THEREOF - An electronic device includes an enclosure, a cooling fan and a circuit board received in the enclosure, and an inductor mounted on the circuit board. The cooling fan generates airflow to the inductor to dissipate heat therefrom. The inductor includes a casing and a coil assembly received in the casing. The inductor has at least one uneven outer surface. | 02-16-2012 |
20120039044 | ELECTRONIC DEVICE AND HEAT DISSIPATION APPARATUS OF THE SAME - A heat dissipation apparatus is arranged in a housing of an electronic device. The electronic device includes a motherboard mounted in the housing. The heat dissipation apparatus includes a heat dissipation block mounted to an electronic element of the motherboard, a heat sink, a number of pipes connecting the heat sink to the heat dissipation block, and a plate plugged in a socket of the motherboard. The heat sink is mounted to the plate. | 02-16-2012 |
20120057300 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a conductive board, a heat sink, and a thermo-electric cooler (TEC). The heat sink is mounted on the conductive board. The heat sink includes a base board defining a groove in a bottom of the base board. The TEC is accommodated in the groove, and a cooling surface of the TEC is coplanar with a bottom surface of the base board. A first part of the conductive board contacts the bottom surface of the base board. A second part of the conductive board contacts the cooling surface of the TEC. | 03-08-2012 |
20120057301 | HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE INCORPORATING SAME - A heat dissipation apparatus for an electronic device includes a centrifugal fan, a fin assembly, a heat pipe and an air guiding plate. The fin assembly is disposed at an air outlet of the centrifugal fan. The heat pipe includes a condensing section thermally connected to the fin assembly and an evaporating section. The air guiding plate extends from the air outlet toward a side of the centrifugal fan, and has a first end adjacent to the air outlet and a second end far from the air outlet. When the heat dissipation apparatus is mounted in a casing, a drawing passage and an exhaust passage are defined at two lateral sides of the air guiding plate. In operation, airflow in the drawing passage is blocked by the air guiding plate to circulate past the second end of the air guiding plate and enter the exhaust passage. | 03-08-2012 |
20120069510 | MOTHERBOARD - A motherboard includes a main circuit board, a CPU socket, and an interface. The main circuit board includes a holding surface and a side wall connected to the holding surface. The CPU socket is positioned on the holding surface. The interface is positioned on the side wall. The interface is electrically connected to the CPU socket. The interface provides a connection between the main circuit board and a sub-circuit board. | 03-22-2012 |
20120069515 | ELECTRONIC DEVICE WITH HEAT DISSIPATION CASING - An electronic device includes a casing, an electronic component accommodated in the casing; and a composite heat conductive layer between the casing and the electronic component. The composite heat conductive layer includes a graphite layer and a thermal pad layer between the electronic component and the graphite layer. The thermal pad layer is attached to the electronic component. The graphite layer is attached to an inner surface of the casing. The graphite layer is located between the casing and the thermal pad layer. Heat conductive efficiency of the graphite layer along a horizontal spreading direction thereof exceeds that along a vertical thickness direction thereof. A surface area of the graphite layer is not less than that of the electronic component. Heat generated by the electronic component is evenly transferred and is spread to the casing via the graphite layer of the composite heat conductive layer. | 03-22-2012 |
20120099269 | MOTHERBOARD AND ELECTRONIC DEVICE EMPLOYING THE SAME - A motherboard for an electronic device includes a main circuit board, an interface, and a sub-circuit. The main circuit board holds a plurality of heat generating element, and the sub-circuit board is electrically connected to the main circuit board through the interface. The sub-circuit board includes a connecting board and a holding board for holding heat generating elements. An end of the connecting board is electrically connected to the main circuit board through the interface, and another end of the connecting board is electrically connected to the holding board. The holding board and the main circuit board are located at opposite ends of the connecting board, and the holding board is spaced with the main circuit board in parallel. | 04-26-2012 |
20120118555 | NOISE REDUCTION APPARATUS, METHOD, AND CONTAINER DATA CENTER INCLUDING THE SAME - A noise reduction apparatus is mounted in a container data center. The container data center includes a container and a number of servers mounted inside the container. The noise reduction apparatus includes a first sensor, a number of fan adjusting systems, and a number of temperature sensors. The first sensor is mounted at an entrance of the container. When a user enters the container, the first sensor outputs a first control signal. The fan adjusting systems slow down fans in the servers according to the first control signal. When the user leaves the container, the first sensor outputs a second control signal. The fan adjusting systems speed up the fans according to the second control signal. The temperature sensors sense temperatures inside the servers respectively. The fan adjusting systems further speed up the fans when the temperatures exceed a preset temperature. | 05-17-2012 |
20120134103 | SERVER CABINET FOR SERVER SYSTEM - A server cabinet adapted for receiving servers therein includes a top plate, a bottom plate opposite to the top plate, and a front side plate disposed between the top and bottom plates. The front side plate defines through holes therein. A total area of the through holes in an upper half portion of the front side plate adjacent to the top plate is different from a total area of the through holes in a lower half portion of the front side plate adjacent to the bottom plate. | 05-31-2012 |
20120136488 | HEAT DISSIPATION APPARATUS, HEAT DISSIPATION METHOD THEREOF, AND CONTAINER DATA CENTER UTILIZING THE HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes an air conditioning unit, a plurality of temperature sensors, a plurality of adjustable air outlet boards, a plurality of actuators, and a control unit. The temperature sensors determine the temperature of server racks. The adjustable air outlet boards guide airflow from the air conditioning device to the corresponding server racks. The actuator adjusts the corresponding adjustable air outlet board to alter the airflow to the corresponding server rack. The control unit receives the temperature detected by the temperature sensors to submit corresponding control signals, altering power supplied to the air conditioning unit and adjust the adjustable air outlet boards through the actuators. The present disclosure further provides a heat dissipation method and a container data center including the heat dissipation apparatus as disclosed. | 05-31-2012 |
20120147543 | MODULAR DATA CENTER - A modular data center includes a container and a heat-dissipating control system. The container defines an opening with a cover rotatably mounted to the container to cover or uncover the opening when needed to assist in dissipating heat. The heat-dissipating control system includes a temperature sensor, a comparison unit, and a driving device. The temperature sensor is used to sense a temperature in the container, and output a sensed temperature value. The comparison unit is used to receive the sensed temperature value, and compare the sensed temperature value with a first predetermined temperature value. When the sensed temperature value is greater than or equal to the first predetermined temperature value, the comparison unit outputs a control signal. The driving device is used to open the cover to expose the opening after receiving the first control signal. | 06-14-2012 |
20120147551 | SERVER CABINET - A server cabinet for receiving a number of servers includes a top plate, a bottom plate, a left side plate, a right side plate, a front side plate, and a rear side plate cooperatively defining a receiving space for receiving the servers. The server cabinet defines a first channel and a second channel in the receiving space. The top plate defines an inlet port communicating with the first channel, and an outlet port communicating with the second channel. Cold air blows from the inlet port into the first channel of the server cabinet, flows through the servers and to the second channel, and flows out from the outlet port for dissipating heat generated by the servers. | 06-14-2012 |
20120152495 | LIQUID COOLING DEVICE - A liquid cooling device includes a heat dissipating module and a container thermally connected to the heat dissipating module. The heat dissipating module includes a chamber, a first liquid inlet accessing the chamber and a first liquid outlet accessing the chamber. The container includes a liquid feeding channel and a liquid releasing channel isolated from each other. The liquid feeding channel accesses the chamber via the first liquid inlet. The liquid releasing channel accesses the chamber via the first liquid outlet. Heat absorbed by the heat dissipating module is taken away by a coolant successively flowing through the liquid feeding channel, the first liquid inlet, the chamber, the first liquid outlet and the liquid releasing channel. | 06-21-2012 |
20120175088 | CONTAINER DATA CENTER AND WASTE HEAT UTILIZING SYSTEM THEREFOR - The disclosure relates to a waste heat utilizing system for a container data center. The waste heat utilizing system includes a first heat exchanger received in and absorbing heat from the container data center, a water inlet pipe communicated with the first heat exchanger for supplying water to the first heat exchanger to exchange heat, a second pipe communicated with the first heat exchanger for removing heated water from the first heat exchanger, a second heat exchanger connected to the second pipe for dissipating heat of the heated water removed from the first heat exchanger, and a heat utilizing device receiving the second heat exchanger therein for absorbing the heat dissipated by the second heat exchanger. A third pipe is dipped into water container and connected to an outlet of the second heat exchanger, and water is flowed back to the water container via the third pipe. | 07-12-2012 |
20120244793 | CONTAINER DATA CENTER - A container data center includes a container defining a number of inlets, a number of server systems received in the container. A cold aisle is defined between the container and the server systems. The cold aisle forms a number of commutating portions each corresponding to one of the inlets. Each commutating portion includes a ventilation plate opposite to the corresponding inlet. The ventilation plate defines a number of ventilation holes. | 09-27-2012 |
20130014532 | COOLING SYSTEMAANM TAN; ZEU-CHIAAACI Tu-ChengAACO TWAAGP TAN; ZEU-CHIA Tu-Cheng TWAANM LIN; TAI-WEIAACI Tu-ChengAACO TWAAGP LIN; TAI-WEI Tu-Cheng TW - A cooling system includes an area heat extraction hardware, a cooling device including an evaporator, a compressor and a condenser, a grounded-coupled heat exchanger connecting to the condenser and a cooling medium circularly flowing in the area heat extraction hardware, the cooling device and the grounded-coupled heat exchanger. The area heat extraction hardware extracts heat from the air and heats the cooling medium. The heated cooling medium passes through the evaporator and the evaporator extracts the heat of the heated cooling medium. The compressor transfers the heat extracted by the evaporator to the condenser. The condenser transfers the heat from the compressor to the grounded-coupled heat exchanger. The grounded-coupled heat exchanger transfers the heat of the cooling medium to the ground so the cooling medium is cooled. | 01-17-2013 |
20130063886 | ELECTRONIC DEVICE USING HEAT DISSIPATION ASSEMBLY - An electronic device includes a central processing module having a base board, a central processing unit fixed to the base board, and a heat dissipation assembly secured to the base board. The heat dissipation assembly has a first heat sink, a second heat sink and an air deflector. The air deflector blocks an opening of the channel to deflect and guide airflow flow through the first heat sink and the second heat sink. | 03-14-2013 |
20130210334 | AIR CONDUCTING COVER FOR ELECTRONIC DEVICE - An electronic device includes a chassis, a group of fans, and an air conducting cover. The air conducting cover defines a number of air entrances, and the fans respectively facing the corresponding air entrance. Each entrance including two opposite flaps. Air flow enters the air entrances. When air flow reversely passes through the air entrances, the air flow closes the flaps. | 08-15-2013 |