Yuuko
Yuuko Hino, Hitachi JP
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20080307827 | METHOD OF REFINING NATURAL GAS AND NATURAL GAS REFINING SYSTEM - A method and system of refining natural gas that improves the quality of liquefied natural gas and enables separation and recovery of hydrocarbons other than methane. The method of refining natural gas containing methane; any other hydrocarbon selected from the group consisting of ethane, ethylene, propane, propylene, n-butane, isobutane, 1-butene, n-pentane, and isopentane; carbon dioxide; and hydrogen sulfide, includes adjusting a pressure and temperature of the natural gas so that the methane is in the gas phase, the other hydrocarbon in the liquid phase, and the carbon dioxide and the hydrogen sulfide in the solid phase, respectively; separating the natural gas, of which the pressure and temperature has been adjusted, into a gas containing the methane and a suspension liquid; and separating the separated suspension liquid into a liquid containing the other hydrocarbon and a solid containing the carbon dioxide and the hydrogen sulfide. | 12-18-2008 |
Yuuko Jimma, Mie JP
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20120202323 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - According to one embodiment, a silicon film, in which an impurity density of a center portion is higher than that of an upper portion and a lower portion, is formed above a base layer, a mask pattern is formed above the silicon film, a recess is formed in the silicon film by selectively etching the silicon film through the mask pattern, a silicon oxide film is formed on a surface of the recess by an oxidation process of the silicon film, and the silicon film under the recess is etched through the mask pattern after the oxidation process. attern. | 08-09-2012 |
Yuuko Matsubara, Gunma JP
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20100224664 | COMPRESSOR - A compressor mounted on a vehicle-side mounting section by using through bolts. The area of a first mounting surface of the compressor at which the compressor is mounted on the vehicle-side mounting section is set greater than the area of a second mounting surface where a seat surface for a head of each through bolt is formed. Because both the mounting surfaces have different areas, vibration is suppressed when the compressor is mounted in place. Thus, the simple improvement can effectively reduce vibration when the compressor is mounted on the vehicle-side mounting section using through bolts. | 09-09-2010 |
Yuuko Matsumoto, Tokyo JP
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20140175412 | ORGANIC LUMINESCENT DISPLAY DEVICE AND METHOD OF MANUFACTURING AT ORGANIC LUMINESCENT DISPLAY DEVICE - A method of manufacturing an organic electroluminescent display device includes the steps of: forming transistors on an element substrate; and forming organic electroluminescent light emitting elements on the respective transistors, in which the step of forming the organic electroluminescent light emitting elements includes the steps of: forming anodes in correspondence with pixels; forming a polymer organic layer made of a polymer material by attaching the polymer material onto upper surfaces and end surfaces of the anodes; forming an organic layer having at least a light emitting layer on the polymer organic layer; and forming a cathode on the organic layer. | 06-26-2014 |
Yuuko Nakamura, Kariya-City JP
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20110102163 | Movable object periphery monitoring system and method for controlling data transmission in the same - A transmission device includes a transmitter and a receiver and transmits an image signal of an image of a periphery of a movable object from an imaging device to a display device near a driver of the movable object. The transmitter transmits an image signal to the receiver through a first transmission path and a second transmission path. The transmitter adds error detection information to each unit data item of a screen of the display device to generate an image signal. The receiver detects an error in the first transmission path using the error detection information. When continuously detecting an error in multiple transmitted unit data items, the receiver determines that malfunction occurs in a transmission state of the first transmission path and selects an image signal transmitted through the second transmission path instead of an image signal transmitted through the first transmission path. | 05-05-2011 |
20130111403 | IN-VEHICLE DISPLAY APPARATUS | 05-02-2013 |
Yuuko Shimizu, Tokyo JP
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20080317535 | Image forming apparatus, image forming system, and control method therefor - An image forming apparatus, an image forming system, and a control method therefor. The image forming apparatus includes at least one tray, a manual feed tray, a setting unit to set the at least one tray and the manual feed tray to be out of search, an acquiring unit to acquire tray information of the at least one tray when the at least one tray is set to be subject to the search and of the manual feed tray irrespective of whether the manual feed tray is set to be out of search upon receipt of an acquisition request from a request source, and a reporting unit to report the tray information to the request source. | 12-25-2008 |
20090175633 | Image forming apparatus, tray ID management method, and computer-readable recording medium - An image forming apparatus includes an accumulating unit that accumulates therein a correspondence of tray classification information that represents a classification of each of sheet trays and tray identifiers that are information for identifying each of the sheet trays; a determining unit that determines whether there are overlapping tray identifiers in the accumulating unit, the overlapping tray identifiers being tray identifiers that are common for same tray classification information or different tray classification information; and a changing unit that, when the determining unit determines that there are overlapping tray identifiers, changes the overlapping tray identifiers in the accumulating unit so that there are no overlapping tray identifiers. | 07-09-2009 |
Yuuko Tanaka, Shimotsuma-Shi JP
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20090186955 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE - The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; | 07-23-2009 |
20110021005 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE - Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor. | 01-27-2011 |
20110187006 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE - Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor. | 08-04-2011 |
20120080808 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE - Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor. | 04-05-2012 |
20140332984 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE - Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor. | 11-13-2014 |
Yuuko Toyoda, Toyama JP
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20150044559 | COMPOSITE PARTICLES FOR NEGATIVE ELECTRODES OF SECONDARY BATTERIES, USE OF SAME, METHOD FOR PRODUCING SAME, AND BINDER COMPOSITION - A secondary battery negative electrode composite particle including a negative electrode active material and a particulate polymer, wherein the particulate polymer include 10% by weight to 60% by weight of a (meth)acrylonitrile monomer unit and 35% by weight to 85% by weight of an aliphatic conjugated diene monomer unit; and a residual amount of an organic compound having an unsaturated bond and a boiling point of 150° C. to 300° C. is 500 ppm or less as a ratio relative to an amount of the particulate polymer. | 02-12-2015 |
Yuuko Watanabe, Kizugawa-Shi JP
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20090035439 | Method and Ball Mill Apparatus for Manufacturing Powdered Tea - A method capable of manufacturing, by using a ball mill apparatus, powdered tea having the same quality as that manufactured by using a millstone. By using the ball mill apparatus having synthetic resin pots, a powdered tea material and synthetic resin balls are sealed in the pot, and the pot is revolved or revolved and rotated on its axis to crush the powdered tea material. | 02-05-2009 |
Yuuko Yokota, Kyoto JP
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20080238572 | Surface acoustic wave device and duplexer and communication device using the same - A surface acoustic wave device includes a first surface acoustic wave filter forming a ladder filter circuit; and a second surface acoustic wave filter having a passband at a frequency range higher than that of the first surface acoustic wave filter. The first surface acoustic wave filter includes a series-arm surface acoustic wave resonator, a parallel-arm surface acoustic wave resonator and an additional surface acoustic wave resonator. The series-arm surface acoustic wave resonator is on a series arm of the ladder filter circuit and includes an IDT electrode. The parallel-arm surface acoustic wave resonator is on a parallel arm of the ladder filter circuit and includes an IDT electrode. The additional surface acoustic wave resonator includes an IDT electrode, is connected in parallel with the series-arm surface acoustic wave resonator, and has a resonance frequency higher than the frequency range of the passband of the second surface acoustic wave filter. | 10-02-2008 |
20090243430 | Surface Acoustic Wave Element and Communication Device - An IDT electrode ( | 10-01-2009 |
20110109400 | Electronic Device - To provide a branching filter enabling sharing of the same mounting substrate between the normal arrangement and the mirror arrangement that is symmetric to the normal arrangement of an electrode group formed on a main surface of a piezoelectric substrate and a method for manufacturing the same. The branching filter | 05-12-2011 |
20110193650 | Duplexer, Communication Module Component, and Communication Device - [Problem] To provide a duplexer able to improve the isolation characteristic and the attenuation characteristic and a communication device using the same. | 08-11-2011 |