Patent application number | Description | Published |
20110103830 | COVER AND CARTRIDGE - An electrophotographic image forming apparatus detachably mountable to a main assembly of the apparatus, includes a rotatable image bearing member on which a latent image is to be formed; charging means for contacting said image bearing member to charge a surface of said image bearing member; a frame supporting said image bearing member and said charging means; a covering member, demountably mounted to said frame, for protecting the surface of said image bearing member; and a spacer member including a spacing portion, movably provided on said covering member, for entering between said image bearing member and said charging means to space them therebetween, and a retaining portion, contacting said covering member when said spacing portion is not between said image bearing member and said charging means, for preventing said spacer member from disengaging from said covering member. | 05-05-2011 |
20110103833 | DEVELOPMENT CARTRIDGE AND IMAGE FORMING APPARATUS - An image forming apparatus includes an image bearing member, a plurality of development cartridges each having a developer bearing member bearing a developer for developing an electrostatic image and a developer container accommodating the developer, a rotary configured to rotate and move the attached development cartridges toward a development position, an opening defined in an apparatus main body and allowing the development cartridge to pass through for attachment and detachment to and from the rotary, and an indicator provided on a second development cartridge arranged adjacent to a first development cartridge passing through the opening and detached from the rotary being stopped, wherein the indicator indicates an attachment method usable to attach the first development cartridge to the rotary, and wherein the indicator is located at such a position on the second development cartridge as to be visible from outside of the apparatus main body via the opening. | 05-05-2011 |
20110103835 | DEVELOPING CARTRIDGE - A developing cartridge detachably mountable to a main assembly of an image forming apparatus includes a frame; a developer carrying member, provided on the frame, for carrying a developer for developing an electrostatic image; a first portion to be engaged provided on one side of the frame with respect to a direction crossing an axial direction of the developer carrying member; a second portion to be engaged provided on the other side of the frame with respect to the direction crossing the axial direction of the developer carrying member; and a cover member, including a first engaging portion engaging with the first portion to be engaged and including a second engaging portion engaging with the second portion to be engaged, for covering an exposed portion of the developer carrying member by being detachably mounted to the frame. The cover member is detachably mountable to the frame by engaging the first engaging portion with second portion to be engaged and by engaging the second engaging portion with the first portion to be engaged. | 05-05-2011 |
20120093523 | IMAGE FORMING APPARATUS - An image forming apparatus to which a plurality of cartridges are detachably mountable, the cartridges each having a cartridge side identification portion, the image forming apparatus includes a plurality of mounting portions to which the cartridges are demountably mountable; and a identification urging means, provided in each of the mounting portions, for permitting a cartridge to be mounted to the mounting portion when the cartridge is properly to be mounted to the mounting portion on the basis of correspondence with the cartridge side identification portion, and for urging the cartridge in a direction opposite a direction in which the cartridge is mounted when the cartridge is improper for the mounting portion. | 04-19-2012 |
20120183328 | COVER AND CARTRIDGE - An electrophotographic image forming apparatus detachably mountable to a main assembly of the apparatus, includes a rotatable image bearing member on which a latent image is to be formed; charging means for contacting said image bearing member to charge a surface of said image bearing member; a frame supporting said image bearing member and said charging means; a covering member, demountably mounted to said frame, for protecting the surface of said image bearing member; and a spacer member including a spacing portion, movably provided on said covering member, for entering between said image bearing member and said charging means to space them therebetween, and a retaining portion, contacting said covering member when said spacing portion is not between said image bearing member and said charging means, for preventing said spacer member from disengaging from said covering member. | 07-19-2012 |
20140064776 | UNIT AND IMAGE FORMING APPARATUS - A unit for use with an image forming apparatus includes: a frame; a developer accommodating portion; a sheet member, contact to a rotatable member and provided on the frame along a longitudinal direction of the rotatable member; a first end portion seal member for preventing, at a longitudinal end portion, the developer from leaking out from between the frame and the rotatable member; and a second end portion seal member for preventing the developer from leaking out from among the first end portion seal member, the sheet member and the frame. The second end portion seal member is formed by injecting, on the frame, a resin material having an elastic modulus smaller than an elastic modulus of the frame so as to contact with the first end portion seal member and the sheet member. | 03-06-2014 |
20140086627 | IMAGE FORMING APPARATUS, CARTRIDGE AND IMAGE FORMING APPARATUS SYSTEM - A cartridge for an image forming apparatus including a movable member is provided with a first engaging portion and a second engaging portion movable between a first position and a second position, the cartridge includes a first engaged portion engageable with the first engaging portion; and a second engaged portion engageable with the second engaging portion, wherein by the first engaged portion being engaged with the first engaging portion in the process of mounting, the movable member is moved from the first position to the second position to permit the second engaged to pass the second engaging portion in a mounting direction. | 03-27-2014 |
20140086628 | IMAGE FORMING APPARATUS, CARTRIDGE AND IMAGE FORMING APPARATUS SYSTEM - A process cartridge detachably mountable to an image forming apparatus includes a contact portion contactable to a first movable member of the apparatus in the process of mounting the cartridge to the image forming apparatus, wherein the contact portion passes the first movable member in the inserting direction, and the first movable member moves from the retracted position to the projection position, and then the second movable member moves from the blocking position to the open position, and the contact portion passes the second movable member in the inserting direction, by which the process cartridge can be mounted to a proper image forming apparatus. | 03-27-2014 |
20140212181 | CARTRIDGE, DEVELOPING CARTRIDGE, PROCESS CARTRIDGE AND IMAGE FORMING APPARATUS - A cartridge detachably mountable to a main assembly of an image forming apparatus includes: a frame; a flexible developer bag, provided with an opening and provided inside the frame, for containing a developer; and an elastic member for discharging the developer through the opening by acting on the developer bag. The elastic member is extended from a free state by contact with the developer bag, and elastic energy accumulated by extension of the elastic member acts on the developer bag to discharge the developer through the opening. | 07-31-2014 |
Patent application number | Description | Published |
20100112783 | ADHESIVE FILM FOR SEMICONDUCTOR, COMPOSITE SHEET, AND METHOD FOR PRODUCING SEMICONDUCTOR CHIP USING THEM - There is provided an adhesive film for a semiconductor, which can be attached to a semiconductor wafer at low temperature and which allows semiconductor chips to be obtained at high yield from the semiconductor wafer while sufficiently inhibiting generation of chip cracks and burrs. The adhesive film for a semiconductor comprises a polyimide resin that can be obtained by reaction between a tetracarboxylic dianhydride containing 4,4′-oxydiphthalic dianhydride represented by chemical formula (I) below and a diamine containing a siloxanediamine represented by the following general formula (II) below, and that can be attached to a semiconductor wafer at 100° C. or below. | 05-06-2010 |
20100120229 | METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, ADHESIVE FILM FOR SEMICONDUCTOR, AND COMPOSITE SHEET USING THE FILM - There is provided a method that allows semiconductor chips to be obtained from a semiconductor wafer at high yield, while sufficiently inhibiting generation of chip cracks and burrs. The method for manufacturing a semiconductor chip comprises a step of preparing a laminated body having a semiconductor wafer, an adhesive film for a semiconductor and dicing tape laminated in that order, the semiconductor wafer being partitioned into multiple semiconductor chips and notches being formed from the semiconductor wafer side so that at least a portion of the adhesive film for a semiconductor remains uncut in its thickness direction, and a step of stretching out the dicing tape in a direction so that the multiple semiconductor chips are separated apart, to separate the adhesive film for a semiconductor along the notches. The adhesive film for a semiconductor has a tensile breaking elongation of less than 5% and the tensile breaking elongation of less than 110% of the elongation at maximum load. | 05-13-2010 |
20100267199 | METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIVE FILM FOR SEMICONDUCTOR USED IN THE METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE - The method for producing a semiconductor chip with an adhesive film of the present invention comprises steps of: preparing a laminate in which a semiconductor wafer, an adhesive film for a semiconductor and a dicing tape are laminated in that order, the adhesive film for a semiconductor having a thickness in the range of 1 to 15 μm and a tensile elongation at break of less than 5%, and the tensile elongation at break being less than 110% of the elongation at a maximum load, and the semiconductor wafer having a reformed section for dividing the semiconductor wafer into the plurality of semiconductor chips, which is formed by irradiating with laser light; dividing the semiconductor wafer into the plurality of semiconductor chips without dividing the adhesive film for a semiconductor by expanding the dicing tape in a direction in which the plurality of semiconductor chips are each separated; and dividing the adhesive film for a semiconductor by picking up the plurality of semiconductor chips in a laminating direction of the laminate, thereby preparing a semiconductor chip with an adhesive film. | 10-21-2010 |
20100311227 | METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIVE FILM FOR SEMICONDUCTOR USED IN THE METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE - The method for producing a semiconductor chip with an adhesive film of the present invention comprises steps of preparing a laminate in which at least a divided semiconductor wafer comprising a plurality of semiconductor chips, obtained by forming a cut which separates the semiconductor wafer into a plurality of semiconductor chips on one side of the semiconductor wafer in a thickness less than that of the semiconductor wafer and by grinding the other side of the semiconductor wafer on which no cut is formed to reach the cut, an adhesive film for a semiconductor and a dicing tape are laminated, the adhesive film for a semiconductor having a thickness in the range of 1 to 15 μm and a tensile elongation at break of less than 5%, and the tensile elongation at break being less than 110% of the elongation at a maximum load; and dividing the adhesive film for a semiconductor by picking up the plurality of semiconductor chips in a laminating direction of the laminate, thereby preparing a semiconductor chip with an adhesive film. | 12-09-2010 |
20110210407 | DOUBLE-FACED ADHESIVE FILM AND ELECTRONIC COMPONENT MODULE USING SAME - A double-faced adhesive film including: a supporting film; a first adhesive layer laminated on one surface of the supporting film; and a second adhesive layer laminated on the other surface of the supporting film, wherein the glass transition temperatures, after curing, of the first adhesive layer and the second adhesive layer are each 100° C. or lower, and the first adhesive layer and the second adhesive layer are the layers capable of being formed by a method including the steps of directly applying a varnish to the supporting film and drying the applied varnish. | 09-01-2011 |
20140015149 | SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENCAPSULATION FILM-LIKE ADHESIVE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant. | 01-16-2014 |
20140206148 | SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING FILM-FORM ADHESIVE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator. | 07-24-2014 |
Patent application number | Description | Published |
20080292331 | DEVELOPING APPARATUS, PROCESS CARTRIDGE AND IMAGE FORMING APPARATUS - A developing apparatus usable with an electrophotographic image forming apparatus, the apparatus including a developer accommodating container, a developer chamber including a developer carrying member carrying and feeding a developer supplied from the container to develop an electrostatic latent image formed on an electrophotographic photosensitive member, a stirrer stirring the developer in the chamber and supplying the developer from the container into the chamber through an opening in the container, a wall surface, provided in the container, for being contacted by a free end portion of the stirrer while the stirrer moves, and a detector detecting a remaining amount of the developer. The position where the free end portion of the stirrer separates from the wall surface is above the detector and inside the container. | 11-27-2008 |
20100054796 | CARTRIDGE - A cartridge detachably mountable to a main assembly of an image forming apparatus, the main assembly including a main assembly electrical contact, includes a roller including an electroconductive shaft, the roller being rotatable with the shaft; and a supporting member rotatably supporting the shaft and provided with a hole portion for exposing a part of a surface of a longitudinal end of the shaft to directly contact the part to the main assembly electrical contact and an end surface positioning portion for determining a position of the end surface with respect to a longitudinal direction of the shaft by contacting another part of the end surface. | 03-04-2010 |
20100054797 | DRUM CARTRIDGE AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS - A drum cartridge detachably mountable to an electrophotographic image forming apparatus, which apparatus including a main assembly, and a supporting member, swingably mounted to the main assembly, for supporting a plurality of developing devices and for bring the developing devices sequentially to a developing position by rotation thereof, the apparatus comprising: an electrophotographic photosensitive member drum; and a detachable spacer member for moving the supporting member away from the electrophotographic photosensitive member drum by contacting to the supporting member when the drum cartridge is mounted to the main assembly. | 03-04-2010 |
20100054799 | COVERING MEMBER AND CARTRIDGE - A cartridge detachably mountable to a main assembly of an electrophotographic image forming apparatus, includes an image bearing member; a frame; process means contactable to and actable on the image bearing member; a covering member detachably mounted to the frame to protect a surface of the image bearing member; and a spacing portion provided on the covering member and inserted between the image bearing member and the process means to space the image bearing member and the process means from each other, the spacing portion being movable relative to the covering member while being interposed between the image bearing member and the process means when the covering member is removed from the frame. | 03-04-2010 |
20100054804 | CARTRIDGE AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS - A cartridge detachably mountable to a main assembly of an electrophotographic image forming apparatus includes a developer carrying member for developing an electrostatic latent image formed on an image bearing member, and an electroconductive developer layer thickness regulating member for regulating a layer thickness of a developer deposited on the developer carrying member. A part of the developer layer thickness regulating member is directly contactable to the main assembly electrical contact. | 03-04-2010 |
20120315062 | CARTRIDGE AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS - A cartridge detachably mountable to a main assembly of an electrophotographic image forming apparatus includes a developer carrying member for developing an electrostatic latent image formed on an image bearing member, and an electroconductive developer layer thickness regulating member for regulating a layer thickness of a developer deposited on the developer carrying member. A part of the developer layer thickness regulating member is directly contactable to the main assembly electrical contact. | 12-13-2012 |
Patent application number | Description | Published |
20110291260 | SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENCAPSULATION FILM-LIKE ADHESIVE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant. | 12-01-2011 |
20110318879 | METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIVE FILM FOR SEMICONDUCTOR USED IN THE METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE - A method for producing a semiconductor chip with an adhesive film, which includes: preparing a laminate in which a semiconductor wafer, an adhesive film and a dicing tape are laminated in that order, the adhesive film having a thickness in the range of 1 to 15 μm and a tensile elongation at break of less than 5%, and the tensile elongation at break being less than 110% of the elongation at a maximum load, and the semiconductor wafer having a section, for dividing the semiconductor wafer into a plurality of semiconductor chips, which is formed by irradiating with laser light; dividing the semiconductor wafer into a plurality of semiconductor chips without dividing the adhesive film, by expanding the dicing tape; and dividing the adhesive film by picking up the plurality of semiconductor chips. | 12-29-2011 |
20120012999 | SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING FILM-FORM ADHESIVE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator. | 01-19-2012 |
20120244347 | METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, ADHESIVE FILM FOR SEMICONDUCTOR, AND COMPOSITE SHEET USING THE FILM - There is an adhesive film for a semiconductor for use in a method for manufacturing a semiconductor chip. The method includes preparing a laminated body having a semiconductor wafer, an adhesive film for a semiconductor and dicing tape laminated in that order. The adhesive film for a semiconductor has a tensile breaking elongation of less than 5%, and the tensile breaking elongation is less than 110% of the elongation at maximum load. The semiconductor wafer is partitioned into multiple semiconductor chips and notches are formed from the semiconductor wafer side so that at least a portion of the adhesive film for a semiconductor remains uncut in its thickness direction. The method also includes stretching out the dicing tape in a direction so that the multiple semiconductor chips are separated apart, to separate the adhesive film for a semiconductor along the notches. | 09-27-2012 |
20120295400 | METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIVE FILM FOR SEMICONDUCTOR USED IN THE METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE - The method for producing a semiconductor chip with an adhesive film includes preparing a laminate of a divided semiconductor wafer, an adhesive film and a dicing tape, the adhesive film having a thickness in the range of 1 to 15 μm and a tensile elongation at break of less than 5%, and the tensile elongation at break being less than 110% of the elongation at a maximum load; and dividing the adhesive film for a semiconductor by picking up the plurality of semiconductor chips in a laminating direction of the laminate. The divided semiconductor wafer has been obtained by cutting the semiconductor wafer in a thickness less than that of the semiconductor wafer and by grinding the other side of the semiconductor wafer on which no cut is formed to reach the cut. | 11-22-2012 |