Patent application number | Description | Published |
20090161189 | METHOD OF MANUFACTURING A STRUCTURE BASED ON ANISOTROPIC ETCHING, AND SILICON SUBSTRATE WITH ETCHING MASK - A method of manufacturing a structure that includes a mask forming step for forming, on a monocrystal silicon substrate, a base etching mask corresponding to a target shape and a correction etching mask having a joint connecting to the base etching mask, and a target shape forming step for forming the target shape by anisotropically etching the silicon substrate, wherein, in the mask forming step, a lowered-strength portion where a mechanical strength is locally decreased is formed at least in a portion of the joint of the correction etching mask. | 06-25-2009 |
20110052800 | PROCESS OF PRODUCING GRATING FOR X-RAY IMAGE PICKUP APPARATUS - A process of producing a grating to be used in an X-ray image pickup apparatus includes the steps of preparing a grating having a plurality of protrusions periodically arranged, curving the grating in the direction in which the plurality of protrusions is arranged, and filling spaces between the protrusions with a metal in a state that the grating is curved. | 03-03-2011 |
20110168908 | MICROSTRUCTURE MANUFACTURING METHOD - A microstructure manufacturing method includes forming a first insulating film on an Si substrate, exposing an Si surface by removing a part of the first insulating film, forming a recessed portion by etching the Si substrate from the exposed Si surface, forming a second insulating film on a sidewall and a bottom of the recessed portion, forming an Si exposed surface by removing at least a part of the second insulating film formed on the bottom of the recessed portion, and filling the recessed portion with a metal from the Si exposed surface by electrolytic plating. | 07-14-2011 |
20110194673 | MICROSTRUCTURE MANUFACTURING METHOD AND MICROSTRUCTURE - A microstructure manufacturing method includes: preparing a mold having on a front side thereof a plurality of fine structures, with conductivity being imparted to a bottom portion between the plurality of fine structures; forming a first plating layer between the plurality of fine structures by plating the bottom portion; and forming a second plating layer of larger stress than the first plating layer on the first plating layer between the plurality of fine structures, wherein the stress of the second plating layer is used to curve a back side surface of the mold. | 08-11-2011 |
20120207275 | STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND IMAGING APPARATUS - A method of manufacturing a structure includes a step of preparing a substrate including a silicon section, recessed sections and protruding sections formed by etching the silicon section, and a first insulating layer disposed on top portions of the protruding sections; a step of forming second insulating layers on sidewalls and bottom portions of the recessed sections; a step of forming seed layers containing metal above the bottom portions of the recessed sections; and a step of forming plating layers in such a manner that the recessed sections are filled with metal by electroplating. The second insulating layers contain an organopolysiloxane having at least one of a partial structure represented by the following formula (1) and a partial structure represented by the following formula (2): | 08-16-2012 |
20120219916 | MICROSTRUCTURE MANUFACTURING METHOD - A microstructure manufacturing method includes forming a layer of a photosensitive resin on a substrate surface having an electrical conductivity, forming a structure of the photosensitive resin by exposing the layer of the photosensitive resin to light and developing the layer of the photosensitive resin to expose a part of the substrate surface, forming a first plated layer on the exposed part of the substrate surface by soaking the structure of the photosensitive resin in a first plating solution, curing the structure of the photosensitive resin after forming the first plated layer, removing at least part of the first plated layer after curing the structure of the photosensitive resin, and forming a second plated layer on a part where the first plated layer is removed, by soaking the structure of the photosensitive resin in a second plating solution different from the first plating solution. | 08-30-2012 |
20130118793 | METHOD FOR FILLING THROUGH HOLE OF SUBSTRATE WITH METAL AND SUBSTRATE - The present invention relates to a method for filling a through hole of a substrate with a metal. The method includes a step of preparing a bonded substrate including a first substrate having conductivity in at least a surface thereof and a second substrate having a through hole, both substrates being bonded to each other through a nonionic surfactant; a step of exposing, in the bonded surface of the bonded substrate, the conductive surface of the first substrate, which is positioned at the bottom of the through hole, by removing the nonionic surfactant positioned at the bottom of the through hole of the second substrate; and a step of filling the through hole with a metal by applying an electric field to the conductive surface of the first substrate. | 05-16-2013 |
20140145080 | STRUCTURE, METHOD FOR MANUFACTURING THE SAME, AND IMAGE PICKUP APPARATUS INCLUDING THE STRUCTURE - The present invention relates to a method for manufacturing a structure, including the steps of forming a recessed section in a first surface of a substrate; filling the recessed section with metal to form a metal structure; exposing the metal structure from the substrate; and applying resin onto the exposed metal structure and solidifying the resin to form a resin layer. | 05-29-2014 |
20140151570 | CHARGED PARTICLE BEAM LENS AND EXPOSURE APPARATUS USING THE SAME - An electrostatic charged particle beam lens includes an electrode including a flat plate having a first surface having a normal line extending in a direction of an optical axis and a second surface opposite to the first surface, the electrode having a through-hole extending from the first surface to the second surface. When an opening cross section is defined as a cross section of the through-hole taken along a plane perpendicular to the normal line and a representative diameter is defined as a diameter of a circle obtained by performing regression analysis of the opening cross section, a representative diameter of the opening cross section in a first region that is on the first surface side and a representative diameter of the opening cross section in a second region that is on the second surface side are smaller than a representative diameter of the opening cross section in a third region that is a region in the electrode disposed between the first surface and the second surface. | 06-05-2014 |
20140151571 | CHARGED PARTICLE BEAM LENS AND EXPOSURE APPARATUS USING THE SAME - In a charged particle beam lens according to the present invention, the orientations of through-holes formed in electrodes and precision of forming the through-holes are determined in accordance with the degree of influences of the surfaces of the electrodes on the aberration of the lens. | 06-05-2014 |
20140166894 | CHARGED PARTICLE BEAM LENS AND EXPOSURE APPARATUS USING THE SAME - An electrostatic charged particle beam lens includes an electrode including a flat plate having a first surface having a normal line extending in a direction of an optical axis and a second surface opposite to the first surface, the electrode having a through-hole extending from the first surface to the second surface. A circularity in a first region that is on the first surface side and a circularity in a second region that is on the second surface side are each better than a circularity in a third region that is a region in the electrode disposed between the first surface and the second surface. | 06-19-2014 |
20140190006 | METHOD FOR MANUFACTURING CHARGED PARTICLE BEAM LENS - There is provided a method for manufacturing a charged particle beam lens having a bonded electrode obtained by bonding at least a first conductive substrate having a first through-hole and a second conductive substrate having a second through-hole. The above method includes: forming the first through-hole in the first conductive substrate; forming the second through-hole in the second conductive substrate; and bonding the first conductive substrate and the second conductive substrate so that the first through-hole and the second through-hole communicate with each other. | 07-10-2014 |
20140197325 | CHARGED PARTICLE BEAM LENS AND EXPOSURE APPARATUS USING THE SAME - An electrostatic charged particle beam lens includes an electrode including a flat plate having a first surface having a normal line extending in a direction of an optical axis and a second surface opposite to the first surface, the electrode having a through-hole extending from the first surface to the second surface. When an opening cross section is defined as a cross section of the through-hole taken along a plane perpendicular to the normal line and a representative diameter is defined as a diameter of a circle obtained by performing regression analysis of the opening cross section, a representative diameter of the opening cross section in a first region that is on the first surface side and a representative diameter of the opening cross section in a second region that is on the second surface side are each larger than a representative diameter of the opening cross section in a third region that is a region in the electrode disposed between the first surface and the second surface. | 07-17-2014 |
20140211920 | STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a structure by using a silicon mold, in which disturbances in arrangement due to charges are reduced, can be provided. | 07-31-2014 |
20150072521 | MICROSTRUCTURE MANUFACTURING METHOD - A microstructure manufacturing method includes forming a first insulating film on an Si substrate, exposing an Si surface by removing a part of the first insulating film, forming a recessed portion by etching the Si substrate from the exposed Si surface, forming a second insulating film on a sidewall and a bottom of the recessed portion, forming an Si exposed surface by removing at least a part of the second insulating film formed on the bottom of the recessed portion, and filling the recessed portion with a metal from the Si exposed surface by electrolytic plating. | 03-12-2015 |