Patent application number | Description | Published |
20100025569 | SOLID-STATE IMAGING DEVICE, METHOD OF PRODUCING THE SAME, AND IMAGING DEVICE - A solid-state imaging device includes a semiconductor substrate including a pixel portion having a photoelectric conversion portion and a peripheral circuit portion; a first sidewall composed of a sidewall film and disposed on each sidewall of gate electrodes of MOS transistors in the pixel portion; a second sidewall composed of the sidewall film and disposed on each sidewall of gate electrodes of MOS transistors in the peripheral circuit portion; a first silicide blocking film composed of the sidewall film and disposed on the photoelectric conversion portion and a part of the MOS transistors in the pixel portion; and a second silicide blocking film disposed on the MOS transistors in the pixel portion so as to overlap with a part of the first silicide blocking film, wherein the MOS transistors in the pixel portion are covered with the first and second silicide blocking films. | 02-04-2010 |
20100176273 | Image pickup element and image pickup device - An image pickup element includes a light-receiving portion having a matrix arrangement formed by disposing first-direction arrays, each having photoelectric conversion portions arranged in a first direction with a predetermined gap maintained therebetween, in a second direction orthogonal to the first direction, and micro-lenses provided above the light-receiving portion. A certain first-direction array in the matrix arrangement is provided with a pair of photoelectric conversion portions that optically receive, via a pair of micro-lenses, photographic-subject light beams passing through a pair of segmental regions in an exit pupil of a photographic optical system, the pair of segmental regions being disposed biasedly in opposite directions from each other in the first direction. The pair of micro-lenses is disposed such that light axes thereof extend through vicinities of edges of the pair of photoelectric conversion portions, the edges being the farthest edges from each other in the first direction. | 07-15-2010 |
20100177205 | Image pickup element and image pickup device - An image pickup element includes a light receiver having a matrix arrangement formed by disposing first-direction arrays, each having photoelectric converters arranged in a first direction with a gap therebetween, in a second direction orthogonal thereto, and micro-lenses above the light receiver. In the matrix arrangement, a certain first-direction array has two first photoelectric converters receiving, via two micro-lenses, photographic-subject light passing through two segmental regions in an exit pupil of a photographic optical system, and a certain second-direction array has two second photoelectric converters receiving photographic-subject light passing through two segmental regions in the exit pupil. Light axes of the two micro-lenses extend through vicinities of edges, farthest from each other in the first direction, of the first photoelectric converters. The first photoelectric converters include two photoelectric converters that flank one photoelectric converter, disposed at an intersection between the certain first-direction and second-direction arrays, in the certain first-direction array. | 07-15-2010 |
20100224951 | Solid-state imaging device, method for producing the same, and electronic apparatus - A solid-state imaging device includes: a peripheral circuit element formed on a semiconductor substrate having an image sensing area where an image sensing element that captures an image of an object is provided and a peripheral area located on the periphery of the image sensing area, the peripheral circuit element being in the peripheral area; a plurality of insulation films formed to cover at least the peripheral circuit element; and a contact plug formed in a contact hole through the plurality of insulation films and above the peripheral circuit element in such a manner that the contact plug is electrically connected to the peripheral circuit element; the plurality of insulation films including a first insulation film, and a second insulation film formed to cover the first insulation film, the contact hole being formed by etching the second insulation film so as to remove a portion thereof where the contact hole is to be formed, and then etching the first insulation film so as to remove a portion thereof where the contact hole is to be formed, the first insulation film being formed to serve as an etching stopper layer during etching of the second insulation film, the first insulation film also being formed to cover a portion where the contact hole is to be formed above the peripheral circuit element, with portions other than the portion where the contact hole is to be formed above the peripheral circuit element being exposed. | 09-09-2010 |
20100245656 | Imaging device and focus detecting method - An imaging device includes an image pickup device having an arrangement of photoelectric converting units, the arrangement in which a plurality of pairs of photoelectric converting units are arranged along a predetermined direction, each pair of photoelectric converting units receiving light beams of a subject passing through partial areas in a pair that are lopsided in reverse to each other along the predetermined direction in an exit pupil of a shooting optical system, and a focus detector for performing focus detection of a phase-difference detecting technique according to data obtained from the pair of photoelectric converting units in the arrangement of the photoelectric converting units. The focus detector corrects the data according to a correction amount corresponding to a positional shift amount from the normalized position, and performs focus detection of the phase-difference detecting technique according to the corrected data. | 09-30-2010 |
20110273581 | IMAGE PICKUP ELEMENT AND IMAGE PICKUP DEVICE - A technology of a phase-difference detecting image pickup element that can precisely detect a focus by a phase difference detection method and that can be properly produced even if pixels are becoming finer is provided. An image pickup element of an image pickup device includes an AF pixel pair | 11-10-2011 |
20120104479 | SOLID-STATE IMAGING DEVICE, METHOD OF PRODUCING THE SAME, AND IMAGING DEVICE - A solid-state imaging device includes a semiconductor substrate including a pixel portion having a photoelectric conversion portion and a peripheral circuit portion; a first sidewall composed of a sidewall film and disposed on each sidewall of gate electrodes of MOS transistors in the pixel portion; a second sidewall composed of the sidewall film and disposed on each sidewall of gate electrodes of MOS transistors in the peripheral circuit portion; a first silicide blocking film composed of the sidewall film and disposed on the photoelectric conversion portion and a part of the MOS transistors in the pixel portion; and a second silicide blocking film disposed on the MOS transistors in the pixel portion so as to overlap with a part of the first silicide blocking film, wherein the MOS transistors in the pixel portion are covered with the first and second silicide blocking films. | 05-03-2012 |
20130021499 | IMAGE PICKUP APPARATUS, SOLID-STATE IMAGE PICKUP DEVICE, AND IMAGE PICKUP METHOD - A solid-state image pickup device includes a lens, a first light receiving element, a second light receiving element, and an element separation area. The first light receiving element is configured to receive light from the lens. The second light receiving element is configured to receive light from the lens. The element separation area is between the first light receiving element and the second light receiving element. The lens has an optical axis, which is offset from a center of the element separation area. | 01-24-2013 |
20130021517 | IMAGE PICKUP APPARATUS, SOLID-STATE IMAGE PICKUP ELEMENT, AND IMAGE PICKUP METHOD - A solid-state image pickup device includes a first unit to convert light into an electrical signal and a second unit to convert light into an electrical signal. The first unit includes a first lens and a first pair of light receiving elements to receive light from the first lens. The second unit includes a second lens and a second pair of light receiving elements to receive light from the second lens. A profile of the second pair of light receiving elements is different in plan view than a profile of the first pair of light receiving elements. | 01-24-2013 |
20130113982 | IMAGE PICKUP ELEMENT AND IMAGE PICKUP DEVICE - An image pickup element includes a light-receiving portion having a matrix arrangement formed by disposing first-direction arrays, each having photoelectric conversion portions arranged in a first direction with a predetermined gap maintained therebetween, in a second direction orthogonal to the first direction, and micro-lenses provided above the light-receiving portion. A certain first-direction array in the matrix arrangement is provided with a pair of photoelectric conversion portions that optically receive, via a pair of micro-lenses, photographic-subject light beams passing through a pair of segmental regions in an exit pupil of a photographic optical system, the pair of segmental regions being disposed biasedly in opposite directions from each other in the first direction. The pair of micro-lenses is disposed such that light axes thereof extend through vicinities of edges of the pair of photoelectric conversion portions, the edges being the farthest edges from each other in the first direction. | 05-09-2013 |