Patent application number | Description | Published |
20120211266 | WIRING BOARD AND MANUFACTURING METHOD THEREOF - The present invention is to provide a wiring board which can prevent whitening. The wiring board is made of a fiber reinforced resin plate, and has a through hole and a whitening prevention portion. The whitening prevention portion is made only with matrix resin forming the fiber reinforced resin plate, and is integrally formed in the fiber reinforced resin plate. Furthermore, the whitening prevention portion is arranged around the through hole. | 08-23-2012 |
20140334109 | Electronic Component Module and Method of Manufacturing the Same - An electronic component module includes a wiring board on which at least one electronic component is mounted, an outer layer portion that is made of prepreg and covers the wiring board so that all of the at least one mounted electronic component is not exposed, and a terminal portion that is exposed from the outer layer portion to the outside and is configured to electrically connected to a mating connection member. | 11-13-2014 |
20140369014 | WIRING BOARD - A wiring board comprises a base substrate that is a metal core substrate, and including an opening in which an interior component that is an electric component or an electronic component is to be mounted, and a terminal placement section on which a terminal of the interior component is to be mounted, the terminal placement section being formed around the opening of the base substrate, and inwardly recessed from a surface of the base substrate so that a part of the interior component is to be placed within the opening. | 12-18-2014 |
Patent application number | Description | Published |
20120320645 | Power Converter - A power converter which has a power module allowing supply and cutoff of main current, and a driver module controlling supply and cutoff of the main current allowed by the power module includes: a high potential side semiconductor device which allows supply and cutoff of the main current on the high potential side of the power module; a low potential side semiconductor device which allows supply and cutoff of the main current on the low potential side of the power module, and is connected with the high potential side semiconductor device in series; plural power module side wirings connected with respective electrodes contained in the high potential side semiconductor device and the low potential side semiconductor device, and disposed adjacent to each other substantially on the same plane as the power module in the order of applied potentials with a connection end between the plural power module side wirings and the driver module located along the end of the power module; plural driver module side wirings provided on the driver module as wirings connected with the plural corresponding power module side wirings, and disposed adjacent to each other substantially on the same plane as the driver module in the order corresponding to the positions of the plural power module side wirings in positions along the end of the driver module; a power source transformer as a circuit which converts a signal voltage for controlling the supply and cutoff of the main current by the driver module into voltage applied to a control electrode of the high potential side semiconductor device and a control electrode of the low potential side semiconductor device, plural terminals of the power source transformer in correspondence with the plural driver module side wirings being provided in the order of the positions of the plural corresponding driver module side wirings; and conductors disposed in the vicinity of the plane on which the plural power module side wirings are provided and in the vicinity of the plane on which the plural driver module side wirings are provided, and electrically connected in such positions as to surround magnetic flux generated by current looping at least through the power source transformer, the driver module side wirings, and the power module side wirings. | 12-20-2012 |
20130062751 | Power Module and Power Module Manufacturing Method - A power module includes: a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case for housing the sealing body. The case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate. The intermediate member has a first thin section having thickness smaller than the thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate. The sealing body is pressed against and fixed to the second heat radiation plate via the first heat radiation plate by elastic force generated in the first thin section. | 03-14-2013 |
20130175678 | Power Semiconductor Module and Manufacturing Method Thereof - A power semiconductor module includes a power semiconductor element formed with a plurality of control electrodes on one main surface, a first conductor plate bonded by way of a first solder material to one of the main surfaces of the power semiconductor element, and a second conductor plate bonded by way of a second solder material on the other main surface of the power semiconductor element. A first protrusion section protruding from the base section of the applicable first conductor plate and including a first protrusion surface formed over the upper side, is formed over the first conductor plate. A second protrusion section including a second protrusion surface formed facing opposite one of the main surfaces of the power semiconductor element. The first solder material is interposed between the power semiconductor element and the first conductor plate while avoiding the plural control electrodes. If there is an projection from a perpendicular direction by one of the main surfaces of the power semiconductor element, the second protrusion section is formed so that the projecting section on a specified side of the second protrusion surface overlaps the projecting section of the step section formed between the base section of the first conductor plate and the first protrusion section. The plural control electrodes on the power semiconductor element are formed along the specified side of the second protrusion surface. | 07-11-2013 |
Patent application number | Description | Published |
20130263816 | Multi-Link Internal Combustion Engine - A multi-link internal combustion engine generally includes a cylinder block, an oil pan mounted to the undersurface of the cylinder block to define a crank chamber, the oil pan being formed with a shallow bottom portion and a deep bottom portion for storing oil. The multi-link internal combustion engine further includes a multi-link, piston-crank mechanism disposed in the crank chamber, a pivotal link member of the piston-crank mechanism pivotal about a pivotal fulcrum located on the side of oil pan; and an oil guide wall provided on the shallow bottom portion in the crank chamber for guiding the oil displaced due to the movement of the pivotal link member to the side of deep bottom portion. | 10-10-2013 |
20130306036 | VARIABLE COMPRESSION RATIO INTERNAL COMBUSTION ENGINE - A variable compression ratio internal combustion engine basically has a main engine body and a variable compression ratio mechanism. A housing is attached to an outside wall of the main engine body to support an actuator. The variable compression ratio mechanism varies an engine compression ratio according to a rotational position of a first control shaft by the actuator. A second control shaft links the actuator to the first control shaft. A bearing includes a pair of split bearing bodies that rotatably holds and supports the second control shaft on the housing. The split bearing body that is farther from the main engine body has higher in rigidity than the housing. The bearing is fixed to the side wall of the main engine body by fixing bolts that pass through both of the split bearing bodies and thread into the side wall of the main engine body. | 11-21-2013 |
20140290625 | VARIABLE COMPRESSION RATIO INTERNAL COMBUSTION ENGINE - It is an object to increase the reliability and durability by minimizing mixing/entry of foreign matter (contaminants) into a speed reducer. The speed reducer is provided for reducing rotation of an actuator of a variable compression ratio mechanism and for transmitting the reduced rotation to a control shaft of the variable compression ratio mechanism. The actuator and the speed reducer are attached to a sidewall of an engine main body with a housing therebetween. An oil filter, which removes contaminants from within lubricating oil, is attached to the housing with an oil-passage-forming body therebetween. A portion of the lubricating oil supplied from the oil filter immediately after having been filter-purified is supplied via a bypass oil passage, formed in the oil-passage-forming body and the housing, into a speed-reducer accommodation chamber of the housing. | 10-02-2014 |