Yung Ching
Yung Ching Chang, Hsinchu TW
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20090261904 | MULTI-INPUT OPERATIONAL AMPLIFIER AND METHOD FOR REDUCING INPUT OFFSET THEREOF - A multi-input operational amplifier comprises two transconductors, two current mirrors, and a current source. Each transconductor generates a current according to a corresponding voltage difference. When the voltage difference is less than or equal to zero, the current is a constant. When the voltage difference exceeds zero, the current is proportional to the voltage difference. | 10-22-2009 |
Yung Ching Chang, Taichung City TW
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20130046154 | PPG IMAGING DEVICE AND PPG MEASURING METHOD - The present invention discloses a PPG imaging device and a PPG measuring method. The PPG imaging device comprises a light emitting unit, a collimator unit, a beam splitter unit, an image sensing unit, and an image analysis unit. The light emitting unit provides an incident light signal. The collimator unit receives the incident light signal and transforms the incident light signal into a parallel light signal. The beam splitter unit receives the parallel light signal and reflects it to a tested region. The image sensing unit receives a reflected light signal reflected from the tested region and converts it into image signals. The image analysis unit connects with the image sensing unit and analyzes the image signals to obtain PPG signals of the tested region. The PPG imaging device may be arranged in an anti-light pollution unit, whereby to prevent from optical interference and obtain higher measurement precision. | 02-21-2013 |
20130046192 | IMAGE-BASED PWV MEASUREMENT DEVICE AND METHOD - An image-based PWV measurement device and method are provided. The measurement device comprises at least two light emitting units respectively projecting light beams to at least two detected regions on body surface; at least two light transmitting units respectively receiving and transmitting light signals measured at the different detected regions; an image sensing unit converting the light signals measured at the detected regions into image signals; a length measurement unit used to measure the distance between the detected regions; and an image analysis unit analyzing the image signals to obtain PPG signals for the detected regions. According to the PPG signals, the image analysis unit calculates the physiological parameters, including the perfusion index, respiration rate, pulse rate, stiffness index, reflection index, and PWV between the detected regions, which is derived according to the distance and the pulse transit time from the PPG signals of the two detected regions. | 02-21-2013 |
Yung Ching Chang, Hsinchu City TW
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20080225034 | Image sticking erasing circuit and method for using the same - The image sticking erasing circuit includes a detection circuit and a switching circuit connected to the detection circuit. The detection circuit is for use in detecting a first voltage signal, which closely follows the variation of the voltage source, and a reference voltage, which loosely follows the variation of the voltage source. When the detection circuit determines that the first voltage signal is lower than a first threshold value, the switching circuit switches the gate of a driving transistor to a second voltage signal, which loosely follows the voltage source. When the detection circuit determines that the reference voltage signal is lower than a second threshold value, the switching circuit switches the gate of a driving transistor to a low voltage state. | 09-18-2008 |
Yung Ching Chen, Taichung County TW
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20160035563 | APPARATUS AND METHOD FOR PROCESSING SEMICONDUCTOR WAFERS - An apparatus for processing a semiconductor wafer includes a factory interface configured to couple with a manufacturing chamber. The factory interface includes a robot; an orienter adjacent to the robot; and a particle remover above the orienter and facing toward a wafer. The particle remover is configured to blow ionized gas on a surface of the wafer so as to remove particles. | 02-04-2016 |
Yung Ching Chen, Dali City TW
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20130241058 | Wire Bonding Structures for Integrated Circuits - A device includes a substrate, and a bond pad over the substrate. A protection layer is disposed over the bond pad. The protection layer and the bond pad include different materials. A bond ball is disposed onto the protection layer. A bond wire is joined to the bond ball. | 09-19-2013 |
20130277841 | Rigid Interconnect Structures in Package-on-Package Assemblies - System and method are disclosed for creating a rigid interconnect between two substrate mounted packages to create a package-on-package assembly. A solid interconnect may have a predetermined length configured to provide a predetermined package separation, may be cylindrical, conical or stepped, may be formed by extrusion, casting, drawing or milling and may have an anti-oxidation coating. The interconnect may be attached to mounting pads on the top and bottom packages via an electrically conductive adhesive, including, but not limited to solder and solder paste. A solder preservative or other anti-oxidation coating may be applied to the mounting pad. A package-on-package assembly with solid interconnects may have a top package configured to accept at least one electronic device, with the solid interconnects mounted between the top package and a bottom package to rigidly hold the package about parallel to each other. | 10-24-2013 |
20140004660 | System and Method for Forming Uniform Rigid Interconnect Structures | 01-02-2014 |
20140015086 | Interconnect Structure for CIS Flip-Chip Bonding and Methods for Forming the Same - A device includes a metal pad at a surface of an image sensor chip, wherein the image sensor chip includes an image sensor. A stud bump is disposed over, and electrically connected to, the metal pad. The stud bump includes a bump region, and a tail region connected to the bump region. The tail region includes a metal wire portion substantially perpendicular to a top surface of the metal pad. The tail region is short enough to support itself against gravity. | 01-16-2014 |
20140021605 | Package on Package Devices and Methods of Packaging Semiconductor Dies - Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal stud bumps are disposed between the first packaged die and the second packaged die. The metal stud bumps include a stick region, a first ball region coupled to a first end of the stick region, and a second ball region coupled to a second end of the stick region. The metal stud bumps include a portion that is partially embedded in a solder joint. | 01-23-2014 |
20140041918 | Looped Interconnect Structure - Disclosed herein is a system and method for mounting packages by forming one or more wire loop interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a first substrate. A first and second stud ball may each have at least one flat surface be disposed on a single mounting pad, and a wire having a bend region and forming a loop may be disposed between the stud balls. The stud balls may be formed from a deformed mouthing node formed on a wire. The loop may be mounted on a mounting pad on a first substrate and a second substrate may be mounted on the loop via a conductive material such as solder. | 02-13-2014 |
20140042621 | Package on Package Devices and Methods of Forming Same - An embodiment is a package-on-package (PoP) device comprising a first package on a first substrate and a second package over the first package. A plurality of wire sticks disposed between the first package and the second package and the plurality of wire sticks couple the first package to the second package. Each of the plurality of wire sticks comprise a conductive wire of a first height affixed to a bond pad on the first substrate and each of the plurality of wire sticks is embedded in a solder joint. | 02-13-2014 |
20140124916 | Molded Underfilling for Package on Package Devices - Presented herein are a package-on-package device having a molded underfill and a method for forming the same, the method comprising applying a package mount mounting a die to the first side of a carrier package. A molded underfill may be applied first side of the carrier package, and be in contact with a portion of the package mount a portion of a sidewall of the die. A top package having at least one land may be mounted to the first side of the carrier package above the die, and, optionally separated from the top of the die. The package mount may be coined prior to, during or after applying the molded underfill to optionally be level with the underfill surface. The underfill region contacting the package mount may be below or above the surface of the underfill region contacting the die sidewall. | 05-08-2014 |
20150056737 | Interconnect Structure for CIS Flip-Chip Bonding and Methods for Forming the Same - A device includes a metal pad at a surface of an image sensor chip, wherein the image sensor chip includes an image sensor. A stud bump is disposed over, and electrically connected to, the metal pad. The stud bump includes a bump region, and a tail region connected to the bump region. The tail region includes a metal wire portion substantially perpendicular to a top surface of the metal pad. The tail region is short enough to support itself against gravity. | 02-26-2015 |
20160035709 | Package on Package Devices and Methods of Packaging Semiconductor Dies - Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal stud bumps are disposed between the first packaged die and the second packaged die. The metal stud bumps include a stick region, a first ball region coupled to a first end of the stick region, and a second ball region coupled to a second end of the stick region. The metal stud bumps include a portion that is partially embedded in a solder joint. | 02-04-2016 |
Yung Ching Lee, Hsinchu TW
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20100289834 | FIELD COLOR SEQUENTIAL DISPLAY CONTROL SYSTEM - Field color sequential (FCS) control system applied for an FCS display device is provided. The FCS control system includes an input system, a memory and an output system. The input system, including a plurality of buffers respectively corresponding to different color channels, receives different color channel components of pixels in parallel such that components of a same color channel are stored in a same buffer. The memory, including a plurality of partitions respectively corresponding to different color channels, stores components of a same color channel to a same partition in association with triggering of rising and falling edges of a clock, respectively. The output system sequentially buffers and outputs color channel components of corresponding partitions. | 11-18-2010 |
Yung Ching Yang, Luzhu Township TW
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20120236660 | TEST SYSTEM AND TEST METHOD FOR MEMORY - The test system for memory includes a controlling device, an address generating device, a data disturbing device and a comparing device. The controlling device is used for writing a first data into a memory. The address generating device is used for generating a plurality of first addresses and a plurality of second addresses corresponding to the memory. The data disturbing device is used for disturbing the first data using the first addresses to obtain a second data, and disturbing the second data using the second addresses to obtain a third data. The comparing device is used to for comparing the third data and the first data. | 09-20-2012 |
Yung-Ching Chang, Taipei City TW
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20120088074 | WORKPIECE WITH THREE-DIMENSIONAL PATTERN - A workpiece with three-dimensional pattern having a three-dimensional surface and suitable for an electronic device is provided. A multiple three-dimensional micro patterns formed on the three-dimensional surface reflects an environment light to form images with a visual effect. The workpiece with three-dimensional pattern includes a workpiece and an adhesive layer. The adhesive layer is disposed on the workpiece and impressed to form the multiple three-dimensional micro patterns, and the workpiece is punched to form the three-dimensional surface. A first part of the multiple three-dimensional micro patterns on the three-dimensional surface reflects the environment light to form a first reflecting light beam. A second part of the multiple three-dimensional micro patterns on the three-dimensional surface reflects the environment light to form a second reflecting light beam. The images with visual effect includes at least the first reflecting light beam, the second reflecting light beam, and the multiple three-dimensional micro patterns. | 04-12-2012 |
20130265799 | ELECTRONIC DEVICE - An electronic device includes a display module, a base and a keyboard module. The display module is pivoted on the base. The keyboard module is disposed on the base. The keyboard module has a plurality of keys. Each of the keys includes a main body and an imprinted structure. The main body has a top surface. The imprinted structure is disposed on the top surface of the main body and includes a light guiding portion and a light scattering portion. A light emitted by the display module illuminates the keyboard module. The light is guided towards a specific direction when the light passes through the light guiding portion, and the light is scattered in other directions when the light passes through the light scattering portion. | 10-10-2013 |
Yung-Ching Chen, Chunan Township TW
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20150177745 | GAS-SUPPLY SYSTEM AND METHOD - A gas-supply system includes a gas container filled with gas, a gas flow controller coupled to the gas container, and an operation device electrically connected to the gas flow controller. The gas-supply system further includes a buffer tank coupled to the gas flow controller and configured to receive the gas from the gas container via the gas flow controller. Furthermore, a pressure transducer disposed on the buffer tank and configured to generate a pressure signal to the operation device according to the pressure of the gas in the buffer tank. The operation device is configured to generate a control signal to the gas flow controller according the pressure signal, and the gas flow controller is configured to adjust the flow rate of the gas according to the control signal to keep the pressure of the gas in the buffer tank in a predetermined pressure range. | 06-25-2015 |
Yung-Ching Chen, Taichung TW
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20080197461 | Apparatus for wire bonding and integrated circuit chip package - An apparatus for wire bonding and a capillary tool thereof are provided. An exemplary embodiment of a capillary tool capable of a wire bonding comprises a body having a first internal channel of a first diameter for accommodating a flow of a conductive wire. A compressible head is connected to the body, having a second internal channel of a second diameter for accommodating the flow of the conductive wire, wherein the first diameter is fixed and the second diameter is variable, the second diameter is not more than the first diameter and a diameter the conductive wire flowed through the compressible head is adjustable. An integrated circuit (IC) package is also provided. | 08-21-2008 |
Yung-Ching Cheng, Tainan City TW
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20140362337 | ADJUSTABLE EYEGLASSES CORD - An adjustable eyeglasses cord structure is provided, which mainly comprises two temple sleeves, two spherical plugs, two retaining buckles and a cord. The open end of each temple sleeve has an accommodation space for receiving the temple and the tail end has a spherical chamber corresponding to the spherical plug. Both ends of the cord are inserted and fixed in the retaining buckles which are then disposed within the spherical plugs. Each spherical plug is disposed in the spherical chamber of the temple sleeve. A slot is provided in the spherical chamber for the cord to pass through. In this manner, a cord having stiffness can be deflected to adjust an angle adaptable to use. Temple sleeve with flexibility can facilitate the in-out of the spherical plug so as to enable the function of adjusting the cord angle and the convenience for both assembly and disassembly. | 12-11-2014 |
Yung-Ching Hu US
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20130264970 | LIGHT EMITTING DIODE (LED) COMPONENTS AND METHODS FOR IMPROVED LIGHT EXTRACTION - Light emitter components with improved light extraction and related methods are disclosed. In one embodiment, the light emitter component can include a submount, at least one light emitting chip disposed over the submount, and a lens disposed over a portion of the light emitting chip. The lens can include an optical element. The optical element can be configured to affect light output from the at least one light emitting chip. | 10-10-2013 |
Yung-Ching Hu, Pingtung TW
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20120296904 | GRID-BASED DATA CLUSTERING METHOD - A grid-based data clustering method is disclosed. A parameter setting step sets a grid parameter and a threshold parameter. A diving step divides a space having a plurality of data points according to the grid parameter. A categorizing step determines whether a number of the data points contained in each grid is larger than or equal to a value of the threshold parameter. The grid is categorized as a valid grid if the number of the data points contained therein is larger than or equal to the value of the threshold parameter, and the grid is categorized as an invalid grid if the number of the data points contained therein is smaller than the value of the threshold parameter. The clustering step retrieves one of the valid grids. If the retrieved valid grid is not yet clustered, the clustering step performs horizontal and vertical searching/merging operations on the valid grid. | 11-22-2012 |
Yung-Ching Huang, Linkou Township TW
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20080200327 | BARIUM TITANATE SINGLE CRYSTAL AND PREPARATION METHOD THEREOF - The present invention provides a method of producing the barium titanate solid solution single crystals. The crystalline phase of the single crystal is hexagonal. The method of the present invention, a small quantity of metal oxide is added and dissolved into the barium titanate to form a solid solution. The metal oxides are used as single crystal growth aid; and the barium titanate single crystal can be prepared by using a pressureless sintering process composing of one or two stages of heat treatments that require no special expensive equipments, and thus the method can be used for the mass production of the single crystals. | 08-21-2008 |
Yung-Ching Huang, Taipei TW
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20110143332 | METHOD FOR IDENTIFYING MICROORGANISM OR DETECTING ITS MORPHOLOGY ALTERATION USING SURFACE ENHANCED RAMAN SCATTERING (SERS) - The present invention relates to a method for producing a profile identifying a microorganism based on surface enhanced Raman scattering (SERS) and an apparatus thereof. The method comprises: (1) placing the microorganism on a SERS-active substrate; (2) mounting the microorganism with a mounting solution; (3) obtaining a SERS spectrum of the microorganism in step (2); and (4) analyzing the SERS spectrum to produce the profile. | 06-16-2011 |
20130120935 | HEAT DISSIPATING MODULE - A heat dissipating module includes a housing, a first fan and a second fan. The housing has a partition. The first fan is disposed at a side of the partition, and the second fan is disposed at the other side of the partition. The second fan has a plurality of wind deflectors, which are disposed higher than the partition. | 05-16-2013 |
20130259667 | IMPELLER AND FAN - An impeller applied to a fan is disclosed. The impeller includes a hub, a plurality of centrifugal blades and a plurality of axial blades. One end of each of the centrifugal blades is disposed around the circumference of the hub. The axial blades are respectively connected to the other end of a part of the centrifugal blades. A fan applying the impeller is also disclosed. | 10-03-2013 |
Yung-Ching Huang, Hsinchu TW
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20120330441 | CONTROL SYSTEM AND CONTROL METHOD FOR IDENTIFYING CORRESPONDING POSITION - The disclosed exemplary embodiments relates to a control system and a control method for identifying corresponding position. The control system includes a plurality of electronic control modules, each electronic control module having a microcontroller electrically coupled to at least one joint, and the joint is configured for connecting to a joint of neighboring electronic control module. The electronic control modules include a main-control-terminal electronic control module, an assembling electronic control module and at least one detecting electronic control module. The main-control-terminal electronic control module is configured for assigning one of the electronic control modules to be the assembling electronic control module, and assigning the rest of the electronic control modules to be the detecting electronic control module. The assembling electronic control module is configured for obtaining an identifying signal of the neighboring electronic control module so as to recognize the corresponding position of the electronic control modules. | 12-27-2012 |
Yung-Ching Huang, Taipei City TW
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20090161678 | METHOD AND APPARATUS OF TRANSMITTING DATA VIA A MULTI-PROTOCOL SINGLE-MEDIUM NETWORK - The present invention relates to a method and an apparatus of transmitting data via a multi-protocol single-medium network. The method includes initializing a network; transmitting messages in the network; setting up the size and the protocol of the messages and assigning the messages to a multi-protocol stack of the PHY layer based on a network time sharing multitasking principle; assigning each of the messages to a proper time slot; checking whether or not all messages are assigned to the proper time slots; if yes, transmitting the messages; and receiving the messages by a network device and transmitting the messages to another network device via a single-medium network. | 06-25-2009 |
20100099193 | SYSTEM AND METHOD FOR MONITORING AND CONTROLLING QUALITY OF CULTURE WATER AND INTEGRATED WATER QUALITY ANALYZER THEREOF - A system and a method for monitoring and controlling the quality of a culture water are provided. The system includes a plurality of smart culture nodes having integrated water quality analyzers, a culture gateway and a terminal host. In the present method, each of the smart culture nodes detects the quality of the culture water through the integrated water quality analyzer thereof and activates corresponding culture equipments to adjust the quality of the culture water. Besides, the terminal host groups the smart culture nodes through the culture gateway and synchronously controls the smart culture nodes in the same group according to a water quality information collected by the smart culture nodes in the same group so as to activate the corresponding culture equipments to adjust the quality of the culture water. Thereby, the quality of the culture water can be efficiently monitored and controlled. | 04-22-2010 |
20120166006 | CONTROL SYSTEM AND METHOD FOR INITIALIZING THE CONTROL SYSTEM - A control system and a method for initializing the control system are provided. The control system includes a control platform and a plurality of target modules SM | 06-28-2012 |
20130165813 | SENSOR FOR ACQUIRING MUSCLE PARAMETERS - A sensor for acquiring EMG and MMG signals is provided, including a substrate, an inertial sensing element received in a hole of the substrate, a circuit element disposed on the substrate, a plurality of electrical connecting members connecting the inertial sensing element with the substrate, and a sensing ring disposed on the substrate and surrounding the hole. The electrical connecting members are flexible, and the circuit element and the sensing ring are disposed on opposite sides of the substrate. | 06-27-2013 |
20140187995 | ELECTRODE PATCH MODULE AND CHRONIC PAIN DETECTION METHOD AND APPARATUS THEREOF - An electrode patch module, a chronic pain detection method and an apparatus thereof are provided. The electrode patch module affixed at a zone to be tested contains at least three electrode pads. The chronic pain detection apparatus selects multiple electrode pairs from the electrode pads and uses the electrode pairs to measure the zone to be tested so as to obtain multiple characteristic values of different muscle areas. The chronic pain detection apparatus receives the characteristic values for performing comparison operations to produce a result for assistant judging where the chronic pain may have in the zone to be tested. | 07-03-2014 |
Yung-Ching Huang, New Taipei TW
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20160088128 | HOUSING, ELECTRONIC DEVICE USING THE HOUSING, AND METHOD FOR MAKING THE HOUSING - A housing includes a ceramic layer for decoration, an intermediate layer formed on at least one surface of the ceramic layer, and a substrate coupled on the intermediate layer. The surface of the intermediate layer coupled to the substrate is rough and/or porous for improving the bonding of the substrate to the intermediate layer. | 03-24-2016 |
Yung-Ching Lai, Singang Township TW
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20110194895 | SAFETY CONNECTION ASSEMBLY FOR A CURTAIN CORD - A safety connection assembly for a curtain cord divided into two segments has a male connection member and a female connection member. The male connection member is securely mounted on one end of one segment and has an insert formed on one side thereof, and a protruding engagement part formed on an outer wall of the insert; the female connection member is securely mounted on one end of the other segment to be connected and has a cavity formed in one side thereof to hold and engage the insert of the male connection member, and a recessed engagement part annularly formed in an inner wall of the cavity. When a child's neck is strangled by the curtain cord, the male connection member and the female connection member can be easily detached from each other by the child or others when pulled by a force. | 08-11-2011 |
20150300082 | AUTOMATIC CORD COLLECTOR OF A WINDOW BLIND - An automatic cord collector of a window blind has a housing, a holding assembly mounted inside the housing with one end of each pull cord fastened therein, an adjusting assembly mounted inside the housing and extending into the holding assembly, and a spiral spring mounted inside the holding assembly. The adjusting assembly can be turned for the holding assembly to be unlocked or rotatable such that the spiral spring automatically drives the holding assembly to rotate for winding and collecting the pull cords. Users can pull the pull cords to rotate the holding assembly. When the pull cords need to be positioned, the adjusting assembly can be turned to abut against the holding assembly so that the holding assembly is unable to be rotated and the pull cords can be positioned. Accordingly, the automatic cord collector ensures operational convenience, cord safety and accident prevention. | 10-22-2015 |
Yung-Ching Lin, Taipei TW
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20100248085 | Flow field plate of a fuel cell with airflow guiding gaskets - The present invention relates to a flow field plate of a fuel cell with airflow guiding gaskets, comprising a flat plate and airflow guiding gaskets. Each side of the flat plate has a reaction area, which includes a plurality of ribs and a plurality of grooves. Two airflow guiding gasket are respectively covered on the two sides of the flat plate, and a central hollowed region of each airflow guiding gasket is corresponding to the reaction area. An inlet hole of the flat plate communicates with the hollowed region and each inlet of the grooves through an inlet trough of the airflow guiding gasket. An outlet hole of the flat plate communicates with the hollowed region and each outlet of the grooves through an outlet trough of the airflow guiding gasket. Thus, the present invention is capable of significantly reducing the volume of the fuel cell and lowering the weight. | 09-30-2010 |
Yung-Ching Lin, Taoyuan TW
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20140201992 | CIRCUIT BOARD STRUCTURE HAVING EMBEDDED ELECTRONIC ELEMENT AND FABRICATION METHOD THEREOF - A method for fabricating a circuit board structure having at least an embedded electronic element is disclosed, which includes the steps of: providing a substrate and embedding at least an electronic element in the substrate with an active surface and a plurality of electrode pads of the electronic element exposed from a surface of the substrate; forming a plurality of conductive bumps on the electrode pads of the electronic element; and covering the surface of the substrate and the active surface of the electronic element with a dielectric layer and a metal layer stacked on the dielectric layer, wherein the conductive bumps penetrate the dielectric layer so as to be in contact with the metal layer, thereby simplifying the fabrication process, reducing the fabrication cost and saving the fabrication time. | 07-24-2014 |
Yung-Ching Wang, Taipei TW
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20080265798 | Method and System of Controlling a Color Lighting Device - A method for adjusting a color lighting device, comprising the following steps: (a) selecting in a user interface to generate a control instruction having various colors with different mixing ratios; (b) transmitting the control instruction to the color lighting device, and storing the control instruction in a memory of the color lighting device; and (c) adjustably emitting color lighting according to the control instruction of step (b). The present invention provides the users the capability of adjusting the color lighting device, thereby furnishing atmosphere of enjoyment to the life of the users. | 10-30-2008 |