Patent application number | Description | Published |
20080236878 | Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitor - There is provided a thin film capacitor and a capacitor-embedded printed board improved in leakage current characteristics. A dielectric layer is formed of a BiZnNb-based amorphous metal oxide with a predetermined dielectric constant without being heat treated at a high temperature, and metallic phase bismuth of the BiZnNb-based amorphous metal oxide is adjusted in content to attain a desired dielectric constant. Also, another dielectric layer having a different content of metallic phase bismuth may be formed. The thin film capacitor including: a first electrode; a dielectric layer including a first dielectric film formed on the first electrode, the dielectric layer comprising a BiZnNb-based amorphous metal oxide; and a second electrode formed on the dielectric layer, wherein the BiZnNb-based amorphous metal oxide contains metallic phase bismuth. | 10-02-2008 |
20090152121 | THIN FILM CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same. | 06-18-2009 |
20090208640 | FABRICATION METHOD OF COMPOSITE METAL OXIDE DIELECTRIC FILM, AND COMPOSITE METAL OXIDE DIELECTRIC FILM FABRICATED THEREBY - The invention relates to a fabrication method of a composite metal oxide dielectric film containing at least two metallic elements on a substrate, and a composite metal oxide dielectric film fabricated thereby. The method includes: forming an amorphous film containing at least one of the metallic elements; preparing a hydrothermal solution where a precursor of the remaining element of the metallic elements is mixed; immersing the amorphous film into the hydrothermal solution; and hydrothermally treating the amorphous film so that the remaining one of the metallic elements is synthesized to the amorphous film, thereby forming a crystallized composite metal oxide film. | 08-20-2009 |
20090214776 | COATING SOLUTION FOR FORMING HIGH DIELECTRIC CONSTANT THIN FILM AND METHOD FOR FORMING DIELECRIC THIN FILM USING THE SAME - Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a β-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs. | 08-27-2009 |
20090219671 | COATING SOLUTION FOR FORMING HIGH DIELECTRIC CONSTANT THIN FILM AND METHOD FOR FORMING DIELECTRIC THIN FILM USING THE SAME - Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a β-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs. | 09-03-2009 |
20110034606 | COMPOSITE DIELECTRIC COMPOSITION HAVING SMALL VARIATION OF CAPACITANCE WITH TEMPERATURE AND SIGNAL-MATCHING EMBEDDED CAPACITOR PREPARED USING THE SAME - Disclosed herein is a composite dielectric composition having a small variation of capacitance with temperature, comprising a combination of a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a negative or positive variation of capacitance with temperature which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor prepared by using the same composition. Particularly, the present invention provides a composite dielectric composition comprising a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a variation of capacitance which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor formed of the same composition and having a variation of capacitance with temperature, ΔC/C×100(%), of not more than 5%. The composite dielectric composition of the present invention can be used in preparation of the signal-matching embedded capacitor due to a small variation of capacitance with temperature. | 02-10-2011 |
20140090881 | PASSIVE DEVICE EMBEDDED IN SUBSTRATE AND SUBSTRATE WITH PASSIVE DEVICE EMBEDDED THEREIN - The present invention relates to a passive device embedded in a substrate, which includes a laminate formed by alternately laminating a plurality of internal electrodes and dielectric layers; a first external electrode covering one side surface of the laminate and having a first upper cover region, which covers a part of an upper portion of the laminate, and a first lower cover region, which covers a part of a lower portion of the laminate and is smaller than the first upper cover region; and a second external electrode covering the other side surface of the laminate and having a second lower cover region, which covers a part of the lower portion of the laminate, and a second upper cover region, which covers a part of the upper portion of the laminate and is smaller than the second lower cover region, and the substrate. | 04-03-2014 |
20140116761 | MULTILAYER CERAMIC CAPACITOR AND PRINTED CIRCUIT BOARD INCLUDING THE SAME - The present invention relates to a multilayer ceramic capacitor and a printed circuit board including the same that can minimize thickness deviations of an external electrode and a multilayer ceramic. A multilayer ceramic capacitor according to an embodiment of the present invention includes a multilayer ceramic and external electrodes formed on both sides of the multilayer ceramic, wherein |T | 05-01-2014 |
20140131084 | CAPACITOR EMBEDDED SUBSTRATE - A capacitor embedded substrate that can implement low impedance over a wide frequency band and improve heat radiation performance and signal transmission performance at the same time by embedding a plurality of capacitors having different capacitances in a laminated core and connecting the capacitors in parallel. | 05-15-2014 |
20140144676 | ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF - The present invention relates to an electronic component embedded substrate including: a first insulating layer including a cavity; an electronic component inserted in the cavity; a first metal pattern formed on a lower surface of the first insulating layer to mount the electronic component thereon and including at least one guide hole for exposing a portion of the external electrode; a second insulating layer formed on the lower surface of the first insulating layer to cover the first metal pattern; a first circuit pattern formed on a lower surface of the second insulating layer; and a first via for electrically connecting the first external electrode exposed through the guide hole and the first circuit pattern, and can improve electrical connectivity between the external electrode and the via even when the size of the external electrode of the electronic component is reduced than before. | 05-29-2014 |
20140151104 | ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF - The present invention relates to an electronic component embedded substrate including: a cavity formed in at least one insulating layer provided inside the electronic component embedded substrate; an electronic component having at least a portion inserted in the cavity; and a cavity plating portion formed on a surface of the cavity opposite to at least one surface of the electronic component, and can improve electrical connectivity between an external electrode and a via even when the size of the external electrode of the electronic component is reduced than before. | 06-05-2014 |
20140177192 | CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a core substrate, a manufacturing method thereof, and a substrate with built-in electronic components and a method for manufacturing the same. In accordance with an embodiment of the present invention, a core substrate including: a first insulating layer; and a second insulating layer stacked on upper and lower surfaces of the first insulating layer and made of a material with a glass transition temperature lower than that of the first insulating layer. | 06-26-2014 |
20140182889 | MULTILAYERED SUBSTRATE - Disclosed herein is a multilayered substrate including: a second insulating layer having a fine pattern layer formed on an upper surface thereof; and a third insulating layer having a circuit pattern layer formed on an upper surface thereof and formed of a material different from the second insulating layer, the circuit pattern layer having a pattern pitch larger than that of the fine pattern layer, thereby making it possible to solve a warpage problem and perform refinement and improvement in a degree of integration of an inner wiring. | 07-03-2014 |
20140182895 | MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A multilayered substrate and a method of manufacturing the same. The multilayered substrate includes a plurality of wiring layers and reinforcing layers disposed at the outermost portions of both surfaces of the multilayered substrate, respectively, in order to decrease warpage of the multilayered substrate and has wiring patterns optimized depending on a scheme in which external electrodes are formed on an electronic component. | 07-03-2014 |
20140182896 | SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN AND METHOD OF MANUFACTURING THE SAME - A substrate having an electronic component embedded therein includes a first insulating layer including a cavity and including first and second circuit patterns provided on upper and lower surfaces thereof, respectively; the electronic component at least partially inserted into the cavity and including an external electrode; a plurality of build-up insulating layers stacked on or beneath the first insulating layer; upper and lower circuit patterns formed on the build-up insulating layers, respectively; and a plurality of vias connecting the external electrode, the upper circuit pattern, the first circuit pattern, the second circuit pattern, and the lower circuit pattern. | 07-03-2014 |
20140182897 | CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A circuit board includes an inorganic material insulating layer, a first circuit pattern layer formed on a surface of the inorganic material insulating layer, a first build-up insulating layer formed on the inorganic material insulating layer and formed of an organic material, and a second circuit pattern layer formed on a surface of the first build-up insulating layer. | 07-03-2014 |
20140182911 | PRINTED CIRCUIT BOARD INCLUDING EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a printed circuit board (PCB) including an embedded electronic component, including: a core having a cavity; an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a portion of the rough surfaces; insulating layers laminated on upper and lower portions of the core and bonded to an outer circumferential surface of the electronic component insertedly positioned in the cavity; and an external circuit pattern provided on the insulating layers. | 07-03-2014 |
20140182916 | CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a circuit board, which can miniaturize a conductor pattern formed around a via and improve current pass characteristics of the via at the same time by including a via passing through an insulating layer to be in contact with an upper conductor pattern and a lower conductor pattern and having a bent portion whose cross-sectional area or diameter changes discontinuously. | 07-03-2014 |
20140185258 | SUBSTRATE EMBEDDING PASSIVE ELEMENT - A substrate embedding a passive element includes a first conductor pattern layer disposed on a lower surface thereof and a second conductor pattern layer disposed on an upper surface thereof; a first via electrically connecting between the passive element and the first conductor pattern layer; and a second via electrically connecting between the passive element and the second conductor pattern layer, in which a volume of the first via is larger than that of the second via. | 07-03-2014 |
20140321084 | PRINTED CIRCUIT BOARD INCLUDING ELECTRONIC COMPONENT EMBEDDED THEREIN AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a printed circuit board including an electronic component embedded therein and a method for manufacturing the same. The printed circuit board including an electronic component embedded therein includes: a core formed with a cavity which is formed of a through hole and has a side wall formed with an inclined surface having a top and bottom symmetrically formed based on a central portion thereof; an electronic component embedded in the cavity; insulating layers stacked on upper and lower portions of the core including the electronic component; and external circuit layers formed on the insulating layers. | 10-30-2014 |