Patent application number | Description | Published |
20090263153 | CLEANING SHEET, TRANSFER MEMBER PROVIDED WITH CLEANING FUNCTION, AND METHOD FOR CLEANING SUBSTRATE PROCESSING APPARATUS - There are provided a transfer member provided with a cleaning function, which have excellent foreign matter removing performance and transfer performance, and which can remove foreign matters having a predetermined particle diameter with especially high efficiency. | 10-22-2009 |
20100119757 | HEAT-PEELABLE DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET - Provided is a heat-peelable double-sided pressure-sensitive adhesive sheet that is advantageously usable in the step of cutting a multilayer ceramic sheet performed in a high-temperature atmosphere. Also provided is a process for the cutting of a multilayer ceramic sheet using the above-mentioned sheet. | 05-13-2010 |
20100119791 | HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET - Disclosed is a heat-peelable pressure-sensitive adhesive sheet which satisfactorily fits a rough surface, develops a sufficient adhesive strength even when a bonding face of adherend is rough, less causes chip scattering when used for holding, during dicing, a semiconductor substrate having a rough surface typically of an encapsulation resin, and, after the completion of working, can be smoothly peeled off from the adherend by heating, without applying stress on the adherend. Also disclosed are a method for working an adherend and a method for producing an electronic component using the heat-peelable pressure-sensitive adhesive sheet. The heat-peelable pressure-sensitive adhesive sheet includes a base material, an organic rubber-like elastic layer and a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres. The base material, the organic rubber-like elastic layer and the heat-expandable pressure-sensitive adhesive layer are arranged in the above-described order on or above at least one side of the base material. A thickness of the organic rubber-like elastic layer is 1.5 to 42 times a thickness of the heat-expandable pressure-sensitive adhesive layer. | 05-13-2010 |
20100119816 | HEAT-PEELABE PRESSURE-SENSITIVE ADHESIVE SHEET CONTAINING LAYERED SILICATE AND PROCESS FOR THE PRODUCTION FOR ELECTRONIC COMPONENTS BY THE USE OF THE SHEET - Provided is a heat-peelable pressure-sensitive adhesive sheet which is resistant to deformation caused by pressurization, excels in cohesive strength, maintains an adequate adhesive strength until the temperature reaches a heating-peeling treatment temperature, and can be easily removed by heating. Also provided is a process for the production of electronic components using the above-mentioned sheet. | 05-13-2010 |
20100215882 | HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET FOR CUTTING LAMINATED CERAMIC SHEET AND METHOD FOR CUT-PROCESSING LAMINATED CERAMIC SHEET - The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive, a foaming agent and a tackifying resin, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the base polymer of the pressure-sensitive adhesive forming the heat-expandable pressure-sensitive adhesive layer has an acid value of 350 mg-KOH/g or less and the tackifying resin contained in the heat-expandable pressure-sensitive adhesive layer has an acid value of 80 mg-KOH/g or less. | 08-26-2010 |
20100224316 | HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET FOR CUTTING LAMINATED CERAMIC SHEET AND METHOD FOR CUT-PROCESSING LAMINATED CERAMIC SHEET - The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive and a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the heat-expandable pressure-sensitive adhesive layer has a glass transition temperature of −40° C. to 30° C. | 09-09-2010 |
20110088721 | CLEANING SHEET, TRANSFER MEMBER PROVIDED WITH CLEANING FUNCTION, AND METHOD FOR CLEANING SUBSTRATE PROCESSING APPARATUS - A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 μm or less and a maximum height Rz of 1.0 μm or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus. | 04-21-2011 |
20110094675 | Electronic paper manufacturing method and double-sided adhesive tape for electronic paper formation process - [Object] To provide an electronic paper manufacturing method which allows formation of an electronic paper by forming thin film transistors on a support film and affixing a display layer thereto without causing wrinkling of the support film, even when the support film is thin, and which is in no need of an extra cleaning step after the formation of the electronic paper. | 04-28-2011 |
20110151625 | HEAT-RESISTANT ADHESIVE SHEET FOR SUBSTRATELESS SEMICONDUCTOR PACKAGE FABRICATION AND METHOD FOR FABRICATING SUBSTRATELESS SEMICONDUCTOR PACKAGE USING THE ADHESIVE SHEET - The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step. To solve these problems, the present invention provides an adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer has a specific adhesion strength and peel strength. | 06-23-2011 |
20110200744 | ADHESIVE SHEET, PROCESS FOR PRODUCING THE SAME, AND METHOD OF CUTTING MULTILAYERED CERAMIC SHEET - The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 μm, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 μm. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity. | 08-18-2011 |
20130186565 | POLYMER FOR PRESSURE SENSITIVE ADHESIVE, PRESSURE SENSITIVE ADHESIVE COMPOSITION AND HEAT-PEELABLE PRESSURE SENSITIVE ADHESIVE SHEET - A pressure sensitive adhesive having tackiness sufficient for fixing an article even when heated and having adhesive strength that may be lowered when heated to a higher temperature is provided. The pressure sensitive adhesive polymer comprises a copolymer of a (meth)acrylic monomer represented by a general formula, CH | 07-25-2013 |
20130237017 | PRESSURE-SENSITIVE ADHESIVE TAPE FOR RESIN ENCAPSULATION AND METHOD FOR PRODUCING RESIN ENCAPSULATION TYPE SEMICONDUCTOR DEVICE - The present invention provides a pressure-sensitive adhesive tape for resin encapsulation in production of a resin encapsulation type semiconductor device, which includes a base material layer which does not have a glass transition temperature in a temperature region of 260° C. or lower and a pressure-sensitive adhesive layer laminated on the base material layer, and a method for producing a resin encapsulation type semiconductor device using the pressure-sensitive adhesive tape. The pressure-sensitive adhesive tape according to the present invention highly prevents resin leakage even under severe conditions as in MAP-QFN production process, does not affect certainty of wire bonding and has excellent peelability after resin encapsulation. | 09-12-2013 |
20130244377 | HEAT-RESISTANT PRESSURE-SENSITIVE ADHESIVE TAPE FOR PRODUCTION OF SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE TAPE - The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, which includes a base material layer having a glass transition temperature exceeding 180° C., and a pressure-sensitive adhesive layer having an elastic modulus at 180° C. of 1.0×10 | 09-19-2013 |
20130335879 | DOUBLE-SIDED ADHESIVE TAPE OR SHEET, AND ADHEREND PROCESSING METHOD - The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet, containing a heat-releasable pressure-sensitive adhesive layer containing a heat-expandable microsphere on one side of a substrate and a pressure-sensitive adhesive layer for temporary fixing on another side of the substrate, in which the pressure-sensitive adhesive layer for temporary fixing has a shear pressure-sensitive adhesive strength of 2.0 N/200 mm | 12-19-2013 |
20130344274 | PRESSURE-SENSITIVE ADHESIVE TAPE FOR PROTECTING SURFACE OF SEMICONDUCTOR PARTS - The present invention is for providing a pressure-sensitive adhesive tape for protecting the surface of semiconductor parts which transfers little foreign matter to an object (part) to be adhered in a manufacturing process, the pressure-sensitive adhesive tape comprising at least a base material film, a pressure-sensitive adhesive layer, and a peeling liner, the base material film having the pressure-sensitive adhesive layer on one surface thereof, and the peeling liner using an unprocessed plastic film which does not contain a releasing layer being formed on the pressure-sensitive adhesive layer. | 12-26-2013 |
20140002953 | DOUBLE-SIDED ADHESIVE TAPE OR SHEET, AND ADHEREND PROCESSING METHOD | 01-02-2014 |