Patent application number | Description | Published |
20090104384 | METHOD OF MANUFACTURING BASE LAYER, INK FOR INKJET AND ELECTRONIC COMPONENTS - A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements. | 04-23-2009 |
20100039748 | CASE-MOLDED CAPACITOR AND METHOD FOR USING THE SAME - In a case-molded capacitor, an electrode of a capacitor element is connected with a busbar having an electrode terminal for external connection. The capacitor element and the busbar are placed in a metal case having an upper surface opening and are resin molded. A thermally-conductive insulator layer is provided between the capacitor element and a bottom surface of the metal case, hence providing the case-molded capacitor with a heat resistance. | 02-18-2010 |
20100091425 | ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME - The present invention provides an electronic component which can reduce the size of a capacitor and the number of constitutional parts of the capacitor without using a case. The electronic component of the present invention includes a capacitor element, an outer package made of a norbornene resin covering the capacitor element, and external connection terminal portions electrically connected to the capacitor element and protruded from the outer package. | 04-15-2010 |
20100230138 | WIRING BOARD - A wiring board includes an insulating board having a top surface arranged to have an electronic component mounted thereto, a conductor pattern formed on the top surface of the insulating board, and a heat emitting layer made of heat-emitting material covering the conductor pattern. The heat-emitting material has an emissivity not less than 0.8 for an electromagnetic wave having a wavelength λ=0.002898/T at a temperature T ranging from 293K to 473K. This wiring board suppresses the temperature rise of the electronic component. | 09-16-2010 |
20110090618 | METALIZED FILM CAPACITOR - A metalized film capacitor includes a first dielectric film, a first metal thin-film electrode provided on a surface of the first dielectric film, a second dielectric film provided on the first metal thin-film electrode, and a second metal thin-film electrode provided on the second dielectric film, such that the second metal thin-film electrode faces the first metal thin-film electrode across the second dielectric film. The surface of the first dielectric film has a surface energy ranging from 25 mN/m to 40 mN/m. The metalized film capacitor exhibits high heat resistance and a preferable self-healing effect. | 04-21-2011 |
20110102966 | MOLDED CAPACITOR AND METHOD FOR MANUFACTURING THE SAME - A molded capacitor includes a capacitor-element assembly, a package covering the capacitor-element assembly, and a supporter embedded in the package. The capacitor-element assembly includes a capacitor element having a first electrode, and a busbar joined to the electrode of the capacitor element. The busbar has a terminal. The package is made of norbornene-based resin and covers the capacitor-element assembly while exposing the terminal of the busbar. The supporter has first and second end section and is made of heat-conductive insulating material. The first end section contacts the capacitor-element assembly. The second end section is exposed from the package. This molded capacitor has high heat resistance and a small, light-weighted body, and can be manufactured inexpensively. | 05-05-2011 |
20110116658 | FINE NATURAL FIBER AND SPEAKER DIAPHRAGM COATED WITH FINE NATURAL FIBER - Natural fiber is beaten with a biaxial kneading machine. The beaten natural fiber is processed finely with a bead mill so as to allow the processed natural fiber to have a BET specific surface area not smaller than 1 m | 05-19-2011 |
20110127694 | METHOD OF MANUFACTURING RESIN MOLDED ELECTRONIC COMPONENT (AS AMENDED) - A method of manufacturing a resin molded electronic component using a first mold having a cavity with an open top surface and a second mold combined with the first mold on top includes the following steps: (A) inserting a element of the electronic component and a liquid resin precursor into the cavity of the first mold, the liquid resin precursor having viscosity of 10 Pa·s or lower at 40° C.; (B) arranging the second mold such that the element and the resin precursor are sandwiched after the step (A); and (C) pressing the element and the resin precursor between the first mold and the second mold, and curing the resin precursor by heat from the second mold after the step (B). A temperature of the second mold is set to be higher than that of the first mold. | 06-02-2011 |
20110128672 | CAPACITOR - A capacitor includes a first collector made of metal foil, a first electrode layer placed on a surface of the first collector and mainly containing a carbonaceous material, a resin layer provided on the first electrode layer, a second electrode provided on the resin layer and mainly containing a carbonaceous material, a second collector provided on the second electrode layer and made of metal foil, a case accommodating the first collector, the first electrode layer, the resin layer, the second electrode, and the second collector therein, and an electrolyte accommodated in the case. The resin layer has a non-woven fabric form of fibers made of resin irregularly bonded to one another. The fibers of the resin layer intertwine with the first electrode layer. The fibers of the resin layer intertwine with the first electrode layer. This capacitor can be thin and small. | 06-02-2011 |
20110203482 | METHOD OF MANUFACTURING BASE LAYER, INK FOR INKJET AND ELECTRONIC COMPONENTS - A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements. | 08-25-2011 |
20110205286 | METHOD OF MANUFACTURING BASE LAYER, INK FOR INKJET AND ELECTRONIC COMPONENTS - A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements. | 08-25-2011 |
20110293901 | COMBINATION OF BASE LAYER AND INK FOR INKJET FOR MANUFACTURING ELECTRONIC COMPONENT - A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements. | 12-01-2011 |
20120025132 | THERMOCONDUCTIVE COMPOSITION, HEAT DISSIPATING PLATE, HEAT DISSIPATING SUBSTRATE AND CIRCUIT MODULE USING THERMOCONDUCTIVE COMPOSITION, AND PROCESS FOR PRODUCTION OF THERMOCONDUCTIVE COMPOSITION - A thermally conductive composition is made to contain a cured thermosetting resin containing a crystalline epoxy resin component, and an inorganic filler. The content by percentage of the inorganic filler in the thermally conductive composition is 66% or more and 90% or less by volume. This thermally conductive composition has a main portion made mainly of the inorganic filler, and a surface layer portion made mainly of the crystalline epoxy component and formed on the main portion to be continuous to the main portion. | 02-02-2012 |
20120027243 | PRESSURE ADJUSTOR AND METHOD OF MANUFACTURING THE SAME, SPEAKER DEVICE USING THE PRESSURE ADJUSTOR, ELECTRONIC DEVICE, AND VEHICLE - A pressure adjustor includes a sheet-like supporter formed of unwoven fabric or woven fabric, a plurality of activated carbon powder particles attached to the supporter, and binders binding the plurality of activated carbon powder particles to each other. If this pressure adjustor is disposed inside a cabinet of a speaker device including a speaker unit provided in the cabinet, a speaker device is obtained which has an excellent bass reproduction effect even if the device is made small. | 02-02-2012 |
20120087062 | SURFACE MOUNT ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A surface mount electronic component includes an element, an anode terminal, a cathode terminal, and an outer package body. The element has a configuration including an anode, and a cathode formed on a part of the surface of the anode via a dielectric substance. An anode terminal is electrically connected to the anode, and a cathode terminal is electrically connected to the cathode. The outer package body covers an element laminated body such that a part of the anode terminal and a part of the cathode terminal are exposed. The outer package body is made of a norbornene resin. Thus, an electronic component having high reliability can be achieved. | 04-12-2012 |
20120218679 | METALLIZED FILM CAPACITOR AND CASE MOLD TYPE CAPACITOR INCLUDING SAME - A metallized film capacitor includes a dielectric film and two metal vapor-deposition electrodes facing each other across the dielectric film. At least one of the metal vapor-deposition electrodes is made of substantially only aluminum and magnesium. This metallized film capacitor has superior leak current characteristics and moisture resistant performances, and can be used for forming a case mold type capacitor with a small size. | 08-30-2012 |
20130003260 | ELECTRODE STRUCTURE FOR CAPACITOR, PROCESS FOR PRODUCING SAME, AND CAPACITOR INCLUDING THE ELECTRODE STRUCTURE - An electrode for capacitor includes a current collector having conductivity, a protective layer formed on the current collector, an anchor coat layer formed on the protective layer, and a polarizing electrode layer formed on the anchor coat layer. The protective layer contains an oxyhydroxide and the anchor coat layer contains conductive particles. | 01-03-2013 |
20130114184 | SOLID ELECTROLYTIC CAPACITOR - A silver paste layer constituting a collector layer in a solid electrolytic capacitor includes first silver particles having a peak particle size of 150 nm or less, second silver particles having a peak particle size of 500 nm or more, inorganic particles composed of material different from silver, and resin material. The inorganic particles are included at a volume ratio of 15% or more and 50% or less with respect to the total of the first silver particles and the second silver particles. | 05-09-2013 |
20130128414 | SEALING MEMBER FOR A CAPACITOR AND METHOD FOR MANUFACTURING A CAPACITOR - A sealing member for a capacitor is formed of an elastic material, and has a circular cylindrical shape extending along an axial direction. The sectional view perpendicular to the axial direction shows a circular shape. Further, a pair of through-holes is formed parallel to the axial direction. The shape of each through-hole in the sectional view perpendicular to the axial direction of the sealing member is composed of a first arc and a second arc. The first arc protrudes toward the circumference of the sealing member. The second arc protrudes toward the center of the sealing member and has a curvature smaller than that of the first arc. | 05-23-2013 |
20130149012 | MAGNET ROLL - A magnet roll for development for a printer, a copying machine, or the like. The magnet roll comprises a metal pipe provided with recesses formed on a surface thereof and portion maintaining an original metal surface, and a magnet inserted into the metal pipe. Recesses on the surface of the metal pipe are formed by etching using a resist formed by an inkjet process, and irregularities based on crystal grains of metal are formed on an inner surface of each of the recesses and can effectively carry toner that is carried by carrier to a portion of latent images. | 06-13-2013 |
20140009865 | METALLIZED FILM CAPACITOR AND CASE MOLD TYPE CAPACITOR INCLUDING SAME - A metallized film capacitor includes a dielectric film and two metal vapor-deposition electrodes facing each other across the dielectric film. At least one of the metal vapor-deposition electrodes is made of substantially only aluminum and magnesium. This metallized film capacitor has superior leak current characteristics and moisture resistant performances, and can be used for forming a case mold type capacitor with a small size. | 01-09-2014 |
20140036405 | METALIZED FILM CAPACITOR - A metalized film capacitor includes metalized films, each of which is formed of an insulating film made of dielectric, and a vapor deposited metal electrode formed on an upper surface of the insulating film. An end of the vapor deposited metal electrode extends together with an end of the insulating film, and both the ends are connected to an electrode terminal. The vapor deposited metal electrode of the metalized film includes a center region and a low resistance section that is made of Al—Zn—Mg alloy. The low resistance section is disposed at an end of the electrode and is thicker than the center region. This metalized film capacitor has high humidity resistance. | 02-06-2014 |
20140043728 | SOLID ELECTROLYTIC CAPACITOR - A silver paste layer constituting a collector layer in a solid electrolytic capacitor includes first silver particles having a peak particle size of 150 nm or less, second silver particles having a peak particle size of 500 nm or more, inorganic particles composed of material different from silver, and resin material. The inorganic particles are included at a volume ratio of 15% or more and 50% or less with respect to the total of the first silver particles and the second silver particles. | 02-13-2014 |
20140376154 | METALLIZED FILM CAPACITOR AND CASE MOLD TYPE CAPACITOR INCLUDING SAME - A metallized film capacitor includes first and second metal electrodes, a dielectric film disposed between the first and second metal electrodes, and first and second external electrodes which are connected to the first and second metal electrodes, respectively. At least one of the first metal electrode and the second metal electrode comprises magnesium. The magnesium is distributed unevenly in the at least one of the first metal electrode and the second metal electrode. | 12-25-2014 |