Patent application number | Description | Published |
20090176575 | GAME SERVER SYSTEM, GAME ELEMENT PROVIDING METHOD, GAME DEVICE, AND PROGRAM PRODUCT - There are stored in a database stored in a host server ( | 07-09-2009 |
20090280894 | Game System, Server Apparatus, Terminal, And Computer Program Product - In a game system, a server apparatus ( | 11-12-2009 |
20090298593 | Server Apparatus And Game System - In a game system, a server apparatus ( | 12-03-2009 |
20100059875 | SEMICONDUCTOR DEVICE - The reliability of a semiconductor device is improved. | 03-11-2010 |
20100123240 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device is provided with improved reliability. A semiconductor chip is mounted over a chip mounting portion of a lead frame via solder. A metal plate is arranged over a source pad of the semiconductor chip and a lead portion of a lead frame via solder. A solder reflow process is performed thereby to bond the semiconductor chip over the chip mounting portion with a solder, and to bond the metal plate to the source pad and the lead portion with the other solders. The lead frame is formed of a copper alloy, and thus has its softening temperature higher than the temperature of the solder reflow process. The metal plate is formed of oxygen-free copper, and has its softening temperature lower than the temperature of the solder reflow process, whereby the metal plate is softened in the solder reflow process. Thereafter, a gate pad electrode of the semiconductor chip is coupled to a lead portion via the wire, a sealing resin portion is formed, and then the lead frame is cut. | 05-20-2010 |
20100127683 | SEMICONDUCTOR DEVICE INCLUDING A DC-DC CONVERTER - The electrical characteristics of a semiconductor device are enhanced. In the package of the semiconductor device, there are encapsulated first and second semiconductor chips with a power MOS-FET formed therein and a third semiconductor chip with a control circuit for controlling their operation formed therein. The bonding pads for source electrode of the first semiconductor chip on the high side are electrically connected to a die pad through a metal plate. The bonding pad for source electrode of the second semiconductor chip on the low side is electrically connected to lead wiring through a metal plate. The metal plate includes a first portion in contact with the bonding pad of the second semiconductor chip, a second portion extended from a short side of the first portion to the lead wiring, and a third portion extended from a long side of the first portion to the lead wiring. | 05-27-2010 |
20100140718 | SEMICONDUCTOR DEVICE - A semiconductor device having a plurality of chips is reduced in size. In HSOP (semiconductor device) for driving a three-phase motor, a first semiconductor chip including a pMISFET and a second semiconductor chip including an nMISFET are mounted over each of a first tab, second tab, and third tab. The drains of the pMISFET and nMISFET over each tab are electrically connected with each other. Thus, two of six MISFETs can be placed over each of three tabs divided in correspondence with the number of phases of the motor, and they can be packaged in one in a compact manner. As a result, the size of the HSOP for driving a three-phase motor, having a plurality of chips can be reduced. | 06-10-2010 |
20100151947 | GAME SYSTEM, SERVER AND TERMINAL - A game system allowing a player corresponding to a terminal, from which communication has been cut, to restart the game from the game situation at the moment of communication cut. The server has a game continuation device for continuing the game except the error terminal in a case where the error terminal occurs, and a server restart device for transmitting situation information of each player after communication recovery as information for restart, and restarting the game by communication with only the error terminal. The error terminal comprises a terminal restart device for restarting the game after communication recovery based on the situation information included in the information for restart, and a virtual input operation device for functioning as a virtual player instead of players P corresponding to other terminal. | 06-17-2010 |
20100258922 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - To prevent, in a resin-sealed type semiconductor package, generation of cracks in a die bonding material used for mounting of a semiconductor chip. A semiconductor chip is mounted over the upper surface of a die pad via a die bonding material, followed by sealing with an insulating resin. The top surface of the die pad to be brought into contact with the insulating resin is surface-roughened, while the bottom surface of the die pad and an outer lead portion are not surface-roughened. | 10-14-2010 |
20110169102 | SEMICONDUCTOR DEVICE INCLUDING A DC-DC CONVERTER HAVING A METAL PLATE - The electrical characteristics of a semiconductor device are enhanced. In the package of the semiconductor device, there are encapsulated first and second semiconductor chips with a power MOS-FET formed therein and a third semiconductor chip with a control circuit for controlling their operation formed therein. The bonding pads for source electrode of the first semiconductor chip on the high side are electrically connected to a die pad through a metal plate. The bonding pad for source electrode of the second semiconductor chip on the low side is electrically connected to lead wiring through a metal plate. The metal plate includes a first portion in contact with the bonding pad of the second semiconductor chip, a second portion extended from a short side of the first portion to the lead wiring, and a third portion extended from a long side of the first portion to the lead wiring. | 07-14-2011 |
20120261825 | SEMICONDUCTOR DEVICE - It is made for the layout of the mounting wiring at the time of mounting to become efficient by changing the structure of a semiconductor device. | 10-18-2012 |
20130147064 | SEMICONDUCTOR DEVICE - The reliability of a semiconductor device is improved. | 06-13-2013 |