Patent application number | Description | Published |
20080283159 | Soft copper alloy, and soft copper wire or plate material - A method of fabricating soft copper alloy wire having flexure resistance and heat resistance, includes casting a molten alloy of a copper alloy including 10 mass ppm or less of oxygen, and 0.005 mass % to 0.6 mass % of indium, at a predetermined temperature, to provide a cast bar of the copper alloy having equiaxed crystal, rolling the cast bar of the copper alloy having equiaxed crystal to provide a rolled copper alloy, and conducting a cold drawing and annealing on the rolled copper alloy. | 11-20-2008 |
20090255710 | Solar cell lead wire and production method therefor and solar cell using same - A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto. | 10-15-2009 |
20090260689 | Solar cell lead wire, method of making the same, and solar cell - A solar cell lead wire includes a conducting material, and a molten solder plated layer formed on the conducting material. The conducting material includes a concave-convex conducting material that includes a concavity on top and under surfaces thereof, respectively, and a convexity on a side surface thereof, and that is formed by die processing a strip-shaped conducting material, and the molten solder plated layer comprises a flat surface formed by supplying a molten solder to the concavity of the concave-convex conducting material. | 10-22-2009 |
20110220196 | LEAD WIRE FOR SOLAR CELL, MANUFACTURING METHOD AND STORAGE METHOD THEREOF, AND SOLAR CELL - Disclosed is a lead wire for a solar cell having excellent bondability with a solar cell. The solar cell lead wire ( | 09-15-2011 |
20120145433 | RESIN COMPOSITION AND FOAM INSULATED WIRE - A resin composition includes a polyolefin resin. A viscosity of the resin composition is within a range of not less than 500 Pa·s and not more than 2300 Pa·s under measurement conditions of a measurement temperature of 170° C. and a measurement frequency of 1 Hz. A strain hardening rate of the resin composition in uniaxial elongational viscosity measured under measurement conditions of a measurement temperature of 150° C. and a strain rate of 3.0 s | 06-14-2012 |
20130122345 | ELECTRODE LEAD CONNECTION BODY, NONAQUEOUS ELECTROLYTE ELECTRICITY STORING DEVICE AND METHOD OF MANUFACTURING THE SAME - An electrode lead connection body includes a first member that includes a same material as the positive electrode lead and is configured to be connected the positive electrode lead, a second member that includes a same material as the negative electrode lead and is configured to be connected the negative electrode lead, the first and second members being joined to each other at a portion excluding a positive electrode joint as a portion to be joined to the positive electrode lead and a negative electrode joint as a portion to be joined to the negative electrode lead, and an insulating material at a position between the first and second members and near a joint portion to join the first and second members so as to prevent a contact between the first and second members. | 05-16-2013 |
20130192887 | FLAT WIRING MATERIAL AND MOUNTING BODY USING THE SAME - A flat wiring material includes a plurality of conductors arranged in parallel, an insulating covering member covering collectively the plurality of conductors while allowing both end portions of the plurality of conductors to be exposed, an engaging member disposed at a position on the covering member and close to at least one of the exposed both end portions of the plurality of conductors and including an insertion portion that is formed at an end portion extending in the width direction for being inserted into and engaged with a through-hole formed on a mounting substrate, and a fixing member fixing the engaging member to the covering member. The insertion portion of the engaging member includes an opening allowing an elastic deformation thereof upon the insertion into the through-hole and a protruding portion for preventing disengagement in a direction opposite to the insertion direction after being inserted into the through-hole. | 08-01-2013 |
20140205491 | COPPER ALLOY MATERIAL - A copper alloy material includes an additional element M including Ti, and a balance having copper and an inevitable impurity. An atomic ratio of the additional element M to oxygen is in a range of 0.33≦M/O≦1.5. | 07-24-2014 |