Patent application number | Description | Published |
20090146301 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device capable of realizing highly reliable three-dimensional mounting, and a method of manufacturing the same, are provided. A projected electrode | 06-11-2009 |
20090283900 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE - A semiconductor device comprises: (a) a wiring board having front surface lands disposed on a front surface and rear surface lands disposed on a rear surface; (b) a semiconductor chip formed with an integrated circuit and electrode terminals electrically connected to the integrated circuit; and (c) a sealing resin that covers a front side of the wiring board when the semiconductor chip is mounted on the front side of the wiring board such that the front surface lands and the rear surface lands are electrically connected to the electrode terminals, wherein (d) holes having a shape and dimensions that allow projecting electrodes of the other semiconductor device to be inserted therein are formed in the sealing resin such that the front surface lands disposed further toward an inner side than a front surface of the semiconductor chip are exposed. | 11-19-2009 |
20100032832 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE - In this semiconductor chip | 02-11-2010 |
20100165587 | MEMORY CARD AND METHOD FOR MANUFACTURING THE SAME - A memory card includes a circuit board, semiconductor chips mounted on different areas on the circuit board, a semiconductor chip with a semiconductor electrode on its top face and being fixed such that at least a part of its bottom face faces at least a part of a top face of the semiconductor chip, a wire for connecting the semiconductor electrode and a board electrode on the circuit board to achieve a mounting state of the semiconductor chip, and a cover for covering a circuit formation area from an upper side of the circuit board. The circuit formation area includes three semiconductor chips and the wire. At least a part of each of three semiconductor chips, at least a part of the circuit board, and the wire are covered with secondary sealing resin and primary sealing resin. | 07-01-2010 |
20100181667 | SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MOUNTING METHOD, AND PRESSING TOOL - While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding use resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding use resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. In the semiconductor chip mounted structure formed in this way, entire side faces at the corner portions of the semiconductor chip are covered with the seal-bonding use resin. As a result, loads generated at corner portions of the semiconductor chip due to board flexures for thermal expansion differences and thermal contraction differences among the individual members caused by heating process and cooling process in mounting operation as well as for mechanical loads after the mounting operation so that internal breakdown of the semiconductor chip can be avoided. | 07-22-2010 |
20110102720 | LIQUID CRYSTAL DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR - A liquid crystal display device ( | 05-05-2011 |
20120026442 | LIQUID CRYSTAL DISPLAY DEVICE, METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICE, COMPOSITION FOR FORMING PHOTOPOLYMER FILM, AND COMPOSITION FOR FORMING LIQUID CRYSTAL LAYER - The present invention provides a liquid crystal display device producing less image sticking. The liquid crystal display device of the present invention comprises: a pair of substrates; and a liquid crystal layer between the substrates, wherein at least one of the substrates comprises an alignment film and a photopolymer film on the alignment film, the photopolymer film comprises polymers constituted by a photopolymerizable monomer, the photopolymerizable monomer includes two or more polymerizable functional groups, the polymerizable functional groups are bonded to each other through two or more aromatic rings, the aromatic rings include at least one naphthalene ring, and a bond between the naphthalene ring and another aromatic ring has a rotational degree of freedom. | 02-02-2012 |
20120298310 | SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MOUNTING METHOD, AND PRESSING TOOL - While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided. | 11-29-2012 |