Patent application number | Description | Published |
20140084312 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package. | 03-27-2014 |
20140084313 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Front side and rear side faces of the first and second electrodes are exposed out of a front side face and a rear side face of the substrate whereby the front or rear side faces of the first and second electrodes can connect with welding pads of a printed circuit board. Circumferential side faces of the third electrode are encapsulated in the substrate. | 03-27-2014 |
20150162497 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACURING THE SAME - A light emitting diode package (LED) includes two electrodes spaced from each other, an insulating layer sandwiched between the two electrodes, an LED die arranged on the two electrodes and electrically connecting therewith, and an encapsulation layer covering the LED die and the coating layer. Each electrode includes a conductive sheet and a plurality of connecting pins connecting to the conductive sheet. A thickness of each of the connecting pins is smaller than that of the conductive sheet. A top surface of each of the connecting pins is lower than that of the conductive sheet. The LED package further includes a coating layer coating the connecting pin, part of the coating pin is sandwiched between the top surface of the connecting pin and the encapsulation layer. | 06-11-2015 |
20150162498 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode package (LED) includes two electrodes spaced from each other, an insulating layer sandwiched between the two electrodes, an LED die arranged on the two electrodes and electrically connecting therewith, and an encapsulation layer covering the LED die. Each electrode includes a conductive sheet and a plurality of connecting pins connecting to the conductive sheet. A thickness of the connecting pin is smaller than that of the conductive sheet. A top surface of the connecting pin is coplanar with that of the conductive sheet. The LED package further includes a coating layer coating the connecting pin, part of the coating pin is sandwiched between the top surface of the connecting pin and the encapsulation layer. | 06-11-2015 |
20160027983 | LEAD FRAME AND LIGHT EMITTING DIODE PACKAGE HAVING THE SAME - An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way. | 01-28-2016 |
Patent application number | Description | Published |
20140084315 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with the electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Bottom surfaces of the first and second electrodes are exposed out of a bottom surface of the substrate to connect with welding pads of a printed circuit board. A bottom surface of the third electrode is received in the substrate. | 03-27-2014 |
20140167078 | LEAD FRAME AND LIGHT EMITTING DIODE PACKAGE HAVING THE SAME - An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way. | 06-19-2014 |
20140175482 | LIGHT EMITTING DIODE PACKAGE WITH LIGHT REFLECTING CUP INTERNALLY SLANTED - An exemplary LED package includes a base, electrodes formed on the base, an LED chip electrically connecting the electrodes, and a reflecting cup mounted on the base and surrounding the LED chip therein. The reflecting cup includes a bottom surface and an inner surface recessed up from the bottom surface and slantwise oriented towards a top end of the reflecting cup. The reflecting cup is annular. The inner surface includes a reflecting portion slantwise extending from the top surface, and a transition portion extending downwardly from the reflecting portion. The transition portion defines a through hole therein. The reflecting portion defines a reflecting hole therein. An angle α is defined between the reflecting portion and an imaginary surface parallel to the bottom surface. An angle β is defined between the reflecting portion and the bottom surface. The angle β is larger than the angle α. | 06-26-2014 |
Patent application number | Description | Published |
20110115593 | TRANSFORMER AND METHOD OF MAKING THE SAME - A transformer and a method of manufacturing the same are disclosed. The transformer comprises a magnetic core, a winding coil with a primary winding coil and a secondary winding coil, a bobbin with a primary input port and a bobbin connecting member, and an insulating slipcase. The bobbin is mounted by the winding coil. The insulating slipcase includes a first opening to receive the magnetic core, the winding coil and the bobbin, and includes a first side wall, a second side wall with a slipcase connecting member which is engaged with the bobbin connecting member, and a secondary output port for dealing with the output of the transformer. The first side wall is opposite to the first opening and has a second opening for the output of the secondary winding coil. | 05-19-2011 |
20140062642 | Combined structure of hollow bobbin and conductive sheet, hollow bobbin, and conductive sheet - A combined structure of hollow bobbin and conductive sheet for a transformer includes a hollow bobbin and at least one conductive sheet. The hollow bobbin includes an outer surface and at least one positioning structure formed on the outer surface. The conductive sheet is fit on the outer surface of the hollow bobbin and includes a main body and at least one engaging structure. The main body has a hollow portion, making the main body to have an inner circumference. The engaging structure is formed on the inner circumference of the main body and is engaged with the positioning structure of the hollow bobbin. The transformer includes at least one winding disposed on the outer surface of the hollow bobbin and abutting against the conductive sheet. | 03-06-2014 |
20140125444 | Combined structure of hollow bobbin and conductive sheet, hollow bobbin, and conductive sheet - A combined structure of hollow bobbin and conductive sheet for a transformer includes a hollow bobbin and at least one conductive sheet. The hollow bobbin includes an outer surface and at least one positioning structure formed on the outer surface. The conductive sheet is fit on the outer surface of the hollow bobbin and includes a main body and at least one engaging structure. The main body has a hollow portion, making the main body to have an inner circumference. The engaging structure is formed on the inner circumference of the main body and is engaged with the positioning structure of the hollow bobbin. The transformer includes at least one winding disposed on the outer surface of the hollow bobbin and abutting against the conductive sheet. | 05-08-2014 |
20150302968 | MAGNETIC ELEMENT WITH MULTIPLE AIR GAPS - A magnetic element includes a first magnetic core, a second magnetic core, an intermediate magnetic core, a first winding coil, and a second winding coil. The intermediate magnetic core is arranged between the first magnetic core and the second magnetic core. After the first magnetic core and the intermediate magnetic core are coupled with each other, a first winding space and a first air gap are defined. After the second magnetic core and the intermediate magnetic core are coupled with each other, a second winding space and a second air gap are defined. The first winding coil is disposed within the first winding space and arranged around the first air gap. The second winding coil is disposed within the second winding space and arranged around the second air gap. The first winding coil and the second winding coil are connected with each other in series. | 10-22-2015 |
Patent application number | Description | Published |
20100285723 | POLISHING APPARATUS - A chemical mechanical polishing (CMP) device for processing a wafer is provided which includes a plate for supporting the wafer to be processed in a face-up orientation, a polishing head opposing the plate, wherein the polishing head includes a rotatable polishing pad operable to contact the wafer while the polishing pad is rotating, and a slurry coating system providing a slurry to the polishing pad for polishing the wafer. | 11-11-2010 |
20120021604 | Controlling Defects in Thin Wafer Handling - A method includes bonding a wafer on a carrier through an adhesive, and performing a thinning process on the wafer. After the step of performing the thinning process, a portion of the adhesive not covered by the wafer is removed, while the portion of the adhesive covered by the wafer is not removed. | 01-26-2012 |
20120145204 | Spin Chuck for Thin Wafer Cleaning - A device and system for thin wafer cleaning is disclosed. A preferred embodiment comprises a spin chuck having at least three holding clamps. A thin wafer with a wafer frame is mounted on the spin chuck through a tape layer. When the holding clamps are unlocked, there is no interference with the removal and placement of the wafer frame. On the other hand, when the holding clamps are locked, the holding clamps are brought into contact with the outer edge of the wafer frame so as to prevent the wafer frame from moving laterally. Furthermore, the shape of the holding clamps in a locked position is capable of preventing the wafer frame from moving vertically. | 06-14-2012 |
20140261997 | Selective Curing Method of Adhesive on Substrate - Embodiments of the present disclosure include methods of forming a semiconductor device. An embodiment is a method for forming a semiconductor device, the method including applying a substrate to a carrier with an adhesive layer between the carrier and the substrate, curing a portion of the adhesive layer, the cured portion surrounding an uncured portion of the adhesive layer, removing the carrier from adhesive layer, removing the uncured portion of the adhesive layer, and removing the cured portion of the adhesive layer. | 09-18-2014 |
20150221611 | Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices - Methods of packaging semiconductor devices and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging semiconductor devices includes coupling integrated circuit dies to a substrate, and disposing a molding material around the integrated circuit dies. A cap layer is disposed over the molding material and the plurality of integrated circuit dies. | 08-06-2015 |
20160035609 | Wafer Cassette with Electrostatic Carrier Charging Scheme - A wafer cassette includes a main body having space to hold at least one wafer assembly. Each of the at least one wafer assembly includes a wafer and an electrostatic carrier attached to the wafer. An electrical contact structure inside the main body is arranged to contact an electrical pad of the electrostatic carrier. | 02-04-2016 |
Patent application number | Description | Published |
20080256283 | Multimedia expansion module and computer device using the same - A multimedia expansion module suitable to be assembled in a computer device is provided. The multimedia expansion module includes a first group of pins, a second group of pins, a third group of pins, a first pin area and a second pin area. The first group of pins supports the transmission of universal serial bus (USB) signals. The second group of pins supports the transmission of serial disk drive interface signals. The third group of pins supports the transmission of peripheral component interconnect (PCI) express interface signal whose rate is at least 2.5 G bps. The third group of pins includes a first part of pins and a second part of pins. The first group of pins and the first part of pins are provided at the first pin area, and the second group of pins and the second part of pins are provided at the second pin area. | 10-16-2008 |
20090196032 | ILLUMINATED SIGN DISPLAY ASSEMBLY - The invention discloses an illuminated sign display assembly including a transparent substrate, a multilayer circuit structure, a light reflecting casing, and at least one light emitting unit. The multilayer circuit structure is disposed on the transparent substrate, and a hollow portion is formed on the multilayer circuit structure. The light reflecting casing is fixed on the transparent substrate by a welding process and covers the hollow portion of the multilayer circuit structure. The light emitting unit is disposed on the transparent substrate and located in the light reflecting casing. The light reflecting unit is electrically connected to the multilayer circuit structure. Once the multilayer circuit structure is powered on, the light emitted by the light emitting unit will be reflected by the light reflecting casing and then passes through the hollow portion of the multilayer circuit structure and the transparent substrate, so as to form an illuminated sign. | 08-06-2009 |
20110264095 | Assisted Positioning Device for Bone Plate - The present invention relates to an assisted positioning device for bone plate, including: a bone plate, a first positioning component and a second positioning component. The surface of the bone plate configured a number of positioning grooves in order to correspond with a number of bone screws provided for the integration. One end portion of the bone plate configures a first positioning slot, and the first positioning slot is containing a gap. When the end portion of the first positioning component combined the first positioning slot, a first positioning pin can be penetrated by a first through slot of the first positioning component, and in line with the gap. The device can actually reduce the size of incision, shorten the healing time after surgery, and have precisely positioning capabilities. | 10-27-2011 |
Patent application number | Description | Published |
20100152858 | Structure improvement of orthopaedic implant - A structure improvement of orthopaedic implant includes a tibial baseplate, a tibial insert, and a reinforcement. The tibial baseplate forms a recess having a bottom that has a central portion defining a through hole extending through the tibial baseplate. The through hole has a top circumference that defines a circumferential groove extending outward. The tibial insert has a bottom forming a projection corresponding to the recess of the tibial baseplate for press-fitting to the tibial baseplate. A support is formed on at a central portion of a top of the tibial insert and defines a bore that extends through the tibial insert. The tibial insert forms two curved surfaces on opposite sides of the support to support contact and rolling. The reinforcement is inset in the tibial insert and includes a sleeve and a bolt. | 06-17-2010 |
20130304222 | Structure Improvement Of Orthopaedic Implant - A structure improvement of orthopaedic implant for connecting a distal femur and a proximal tibia, and a stem was implanted into the proximal tibia, inwhich formed to allow inter-engagement between the stem of the tibia and the structure improvement of orthopaedic implant. The structure improvement of orthopaedic implant includes a tibial baseplate, a tibial insert, and a reinforcement. The tibial baseplate forms a recess having a bottom that has a central portion defining a through hole extending through the tibial baseplate. The tibial insert includes a support, a through region, and a projection, wherein an end of the tibial insert forming the projection corresponding to the recess of the tibial baseplate for press-fitting to the tibial baseplate. The reinforcement is inset in the tibial insert and includes a sleeve and a bolt. As such, the advantages of stable coupling includes force resistance, avoids insert loosening then extends prosthetic longevity. | 11-14-2013 |
Patent application number | Description | Published |
20150187332 | METHOD, SYSTEM, ELECTRONIC DEVICE AND PERIPHERAL DEVICE OF COMMUNICATION - The present invention discloses a communication system including a first peripheral device and an electronic device. The first peripheral device includes a touch-signal generator. The touch-signal generator is arranged to produce a predetermined touch-signal stream. The electronic device includes a touch-sensing device and a processing unit. The touch-sensing device is arranged to receive the predetermined touch-signal stream produced by the first peripheral device. The processing unit is configured to read the predetermined touch-signal stream. | 07-02-2015 |
20150190710 | INTERACTIVE GAME METHOD - The present invention provides a method of interactive gaming applied to an interactive case and a tablet, wherein the interactive case is arranged to be attached on the tablet, and the interactive case includes a transmission port arranged to communicate with the tablet and a plurality of notches. The method of interactive game includes determining whether at least one accessory medal is connected to the notch; when one of the accessory medals is connected to one of the notches, retrieving a predetermined data stored in the connected accessory medal; identifying the connected accessory medal according to the predetermined data of the connected accessory medal; and performing an application corresponding to the connected accessory medal. | 07-09-2015 |
20150196846 | INTERACTIVE SYSTEM AND INTERACTIVE METHOD - An interactive system includes a tag and an electronic device. The tag is movable by a user. The electronic device includes a camera module, a display device, and a processor. The camera module detects the tag and obtains tag information. The processor controls the display device to display a first virtual object and a second virtual object according to the tag information. The first virtual object moves to follow the movement of the tag. The processor further controls the display device to display a corresponding image according the relative positions of the first virtual object and the second virtual object. | 07-16-2015 |
Patent application number | Description | Published |
20130078611 | METHOD FOR DETECTING MICROORGANISMS AND A KIT THEREOF - The present invention provides a method for detecting microorganisms comprising steps of PCR, magbead, complex forming, blocking and washing and reporting, in which microorganisms, particular to HBV, can be easily detected via a time-saving and user-friendly process, with high sensitivity and stability. Furthermore, according to the method for detecting microorganisms, a kit for detecting microorganisms is also provided in the present invention, so that the detection of HBV can be achieved conveniently and easily. | 03-28-2013 |
20130078612 | METHOD FOR DETECTING MICROORGANISMS AND A KIT THEREOF - The present invention provides a method for detecting microorganisms comprising steps of PCR, magbead, complex forming, blocking and washing and reporting, in which microorganisms, particular to HBV, can be easily detected via a time-saving and user-friendly process, with high sensitivity and stability. Furthermore, according to the method for detecting microorganisms, a kit for detecting microorganisms is also provided in the present invention, so that the detection of HBV can be achieved conveniently and easily. | 03-28-2013 |
20140141412 | KIT FOR DETECTING MICROORGANISMS - The present invention provides a method for detecting microorganisms comprising steps of PCR, magbead, complex forming, blocking and washing and reporting, in which microorganisms, particular to HBV, can be easily detected via a time-saving and user-friendly process, with high sensitivity and stability. Furthermore, according to the method for detecting microorganisms, a kit for detecting microorganisms is also provided in the present invention, so that the detection of HBV can be achieved conveniently and easily. | 05-22-2014 |