Patent application number | Description | Published |
20080245558 | VIA STRUCTURE OF PRINTED CIRCUIT BOARD - A printed circuit board ( | 10-09-2008 |
20090044968 | FLEXIBLE PRINTED CIRCUIT BOARD - An exemplary FPCB includes a signal layer having a differential pair consisting of two transmission lines arranged therein, a ground layer, and a dielectric layer lying between the signal layer and the ground layer. Two sheets made of conductive materials are respectively arranged at opposite sides of the differential pair, and both connected to ground. The sheets are apart from and parallel to the transmission lines. The ground layer has a void defined therein, and the void is located under the two transmission lines. | 02-19-2009 |
20090046418 | MOTHERBOARD FOR SUPPORTING DIFFERENT TYPES OF MEMORIES - An exemplary motherboard includes a first slot arranged for mounting a first type of memory, a second slot arranged for mounting a second type of memory, and a voltage regulator electronically connected to the first slot and the second slot. The first memory and the second memory are alternatively mounted on the motherboard, the voltage regulator detects which type memory is currently mounted on the motherboard and outputs voltages suitable for the type of the memory mounted on the motherboard accordingly. | 02-19-2009 |
20090056983 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes first and second signal layers sandwiching a dielectric layer therebetween and a first differential pair and a second differential pair each having a positive differential trace and a negative differential trace. The positive differential traces of the two differential pairs are disposed within the first signal layer. The negative differential traces of the two differential pairs are disposed within the second signal layer. The positive differential trace of the first differential pair is defined at the left side of the positive differential trace of the second differential pair. The negative differential trace of the first differential pair is defined at the right side of the negative differential trace of the second differential pair. | 03-05-2009 |
20090065241 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes first and second signal layers sandwiching a dielectric layer therebetween, and a differential pair having two differential traces respectively disposed within the first and second signal layers. Two ground parts are respectively arranged at opposite sides of each of the two differential traces. | 03-12-2009 |
20090078452 | FLEXIBLE PRINTED CIRCUIT BOARD - An exemplary FPCB includes a differential pair consisting of a first transmission line and a second transmission line, a signal layer with the first transmission line arranged therein, a ground layer having a void which includes the area beneath the first transmission line, and a dielectric layer lying between the signal layer and the ground layer. The second transmission line is arranged in the ground layer offset from the first transmission line in the horizontal direction. The FPCB can transmit high speed signals. | 03-26-2009 |
20090086452 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes parallel first and second signal layers sandwiching a dielectric layer therebetween, and a differential pair having two differential traces respectively disposed within the first and second signal layers at least partially overlapping in vertical alignment. Horizontal distance between midlines of the two differential traces is less than the width of either of the two differential traces. | 04-02-2009 |
20090102535 | CLOCK SIGNAL CIRCUIT FOR MULTIPLE LOADS - A clock signal circuit for multiple loads includes a clock generator and M loads. The clock generator includes N clock generator pins which output clock signals having a same frequency. The N clock generator pins are all connected to a connection point. The connection point is connected to M loads via M transmitting lines respectively, wherein M is larger than N, M and N each is an integer greater than 2. | 04-23-2009 |
20090146759 | CIRCUIT TOPOLOGY FOR MULTIPLE LOADS - A circuit topology for multiple loads includes a driving terminal, a first node coupled to the driving terminal via a main transmission line, a second node coupled to the first node via a first branch transmission line, a first receiving terminal coupled to the first node via a second branch transmission line, a third node coupled to the second node via a third branch transmission line, and a second receiving terminal coupled to the second node via a fourth branch transmission line. The second branch transmission line is longer than the first transmission line, and a first resistor is connected in the second branch transmission line. The third branch transmission line is longer than the fourth branch transmission line, and a second resistor is connected in the third branch transmission line. | 06-11-2009 |
20090166058 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a power layer having a base portion, and at least two extending portions. The at least two extending portions are extended from edges near at least one corner of the base portion for preventing the PCB from forming constructive interferences and lowering the resonance magnitude thereof. | 07-02-2009 |
20090260859 | FLEXIBLE PRINTED CIRCUIT BOARD - A flexible printed circuit board (FPCB) includes a signal layer comprising a differential pair, a ground layer comprising a grounded sheet made of conductive material, and a dielectric layer located between the signal layer and the ground layer. A void is located on the two opposite sides of the grounded sheet in the ground layer. The differential pair comprises two transmission lines and each transmission line is capable of transmitting a differential signal. The distances between the middle line of the grounded sheet and the middle line of each of the two transmission lines are equal. | 10-22-2009 |
20090260860 | FLEXIBLE PRINTED CIRCUIT BOARD - An exemplary FPCB includes two or more dielectric layers. Each dielectric layer is located between a signal layer and a ground layer. A differential pair including two transmission lines is arranged in each signal layer. Each ground layer includes one or more voids defined therein. Each void is opposite and adjacent to a differential pair. | 10-22-2009 |
20090294168 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first layout layer, a second layout layer, a copper foil layer, a first via and a second via. The first layout layer has a first signal line and a second signal line, each of which has a curved first portion. The second layout layer has a third signal line and a fourth signal line, each of which also has a curved first portion. The curved first portions of the first signal line, the second signal line, the third signal line and the fourth signal line are coupled to the first via and the second via. In this case, the curved first portions of the first signal line, the second signal line, the third signal line and the fourth signal line cooperatively generate spiral inductance characteristic. | 12-03-2009 |
20100012365 | PRINTED CIRCUIT BOARD - A printed circuit board includes first and second connector pads, first and second connection components, and first, second, and third transmission lines. A method for supporting two connectors on the printed circuit board is also provided. The printed circuit board is capable of supporting different types of connectors by setting the first and second connection components on the printed circuit board. | 01-21-2010 |
20100237961 | DIFFERENTIAL SIGNAL TRANSMISSION CABLE AND METHOD FOR COMPENSATING LENGTH OFFSET THEREOF - A compensation method compensates for a length offset between a first transmission line and a second transmission line of a differential signal transmission. The compensation method includes calculating a transmission speed of a first signal in the first transmission line, measuring lengths of the first and second transmission lines, calculating a transmission time of the first signal in the first transmission line, and calculating a relationship between permittivity values of the first and second transmission lines. The compensation method further changes the permittivity values of the first and second transmission lines according to the relationship. | 09-23-2010 |
20100243310 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a power layer, a ground layer, a through hole, and a conductor. The through hole goes through the power layer and the ground layer. The conductor includes a hollow columnar main body and an extending portion. The main body is formed in a bounding wall of the through hole, and is conductively connected to one of the power layer and the ground layer, and insulated from the other one of the power layer and the ground layer by an insulation area. The extending portion extends out from the circumferential surface of the main body. The extending portion extends into the insulation area and is insulated from the other one of the power layer and the ground layer, to increase an area of the power layer facing the ground layer. | 09-30-2010 |
20100271149 | HIGH-FREQUECY MODULE FOR WIRELESS COMMUNICATIONS - A high-frequency module includes an antenna, an impedance matching circuit, and a transmission wire. The transmission wire is connected between the antenna and the impedance matching circuit. The transmission wire includes a dielectric layer, a signal layer, and two ground layers. The signal layer and the ground layers are located on the dielectric layer. The ground layers are located at opposite sides of the signal layer respectively. A space is formed between a signal and each ground layer. | 10-28-2010 |
20100283697 | ELECTRONIC DEVICE AND MULTI-FREQUENCY ANTENNA THEREOF - An electronic device includes a multi-frequency antenna. The multi-frequency antenna includes a ground portion, a support body, a radiation portion, and a strap. The ground portion defines a gap, and two grooves communicating with the gap and located at opposite ends of the gap. The radiation portion resists against a sidewall bounding the gap, and is connected to the strap. The radiation portion is accommodated in the gap and substantially coplanar with the ground portion. The radiation portion defines a slot. The support body is located in the gap and on the radiation portion, to support the strap. | 11-11-2010 |
20100289601 | OVERDRIVE TOPOLOGY STRUCTURE FOR TRANSMISSION OF RGB SIGNAL - An overdrive topology structure for transmission of a RGB signal includes a signal sending terminal, a signal receiving terminal, and a transmission line to transmit the RGB signal from the signal sending terminal to the signal receiving terminal. The transmission line is divided into a number of section transmission lines. A node is formed between every two section transmission lines. An impedance of a first section transmission line approaching to the signal sending terminal is less than an impedance of a second section transmission line approaching to the first section transmission line to overdrive the RGB signal at a first node between the first and second section transmission lines. At least one node except the first node is grounded via a resistor. An equivalent resistance of the resistor is equal to a resistance of the first resistor. | 11-18-2010 |
20100328181 | SIGNAL TRANSMISSION APPARATUS - A signal transmission apparatus includes two circuit layers. First and second ground sheets are arranged in the two circuit layers respectively. A third ground sheet is arranged between the two circuit layers. A differential pair includes a transmission line arranged between the first and third ground sheets and a transmission line arranged between the second and third ground sheets. The first to third ground sheets have same electric potential. Projections of the first and second ground sheets on the third ground sheet superpose a border of the third ground sheet. The third ground sheet is formed by extending the border along a signal transmission direction. A vertical distance between the first and second transmission lines is twice as each of a vertical distance from the first ground sheet to the first transmission line and a vertical distance from the second ground sheet to the second transmission line | 12-30-2010 |
20110025434 | SIGNAL TRANSMISSION APPARATUS - A signal transmission apparatus includes two circuit layers. First and second ground sheets each has a rectangular area are arranged in the two circuit layers respectively. A third ground sheet is arranged between the two circuit layers. A differential pair includes a transmission line arranged between the first and third ground sheets and a transmission line arranged between the second and third ground sheets. The first to third ground sheets have same electric potential. Projections of the two rectangular areas on a surface where the third ground sheet in only have one common border with the third ground sheet. The third ground sheet is formed by extending the common border along a signal transmission direction. The differential pair includes a number of section pairs each composed of two sections arranged in the two transmission lines symmetrically. Every two adjacent section pairs are equivalent to a capacitor and an inductor. | 02-03-2011 |
20110032055 | PRINTED CIRCUIT BOARD AND SIGNAL TRANSMISSION APPARATUS THEREOF - A signal transmission apparatus used in a printed circuit board (PCB). The apparatus includes a differential pair composed of two transmission lines arranged side by side in the PCB. The differential pair includes a filter section arranged therein to filter noise of transmission signals of the differential pair. The filter includes a number of section pairs connected in series. Each section pair includes two sections arranged in the two transmission lines symmetrically. Every two adjacent sections are different in line width. A distance between the two transmission lines, and the line width of each of the sections are predetermined according to desired frequency bandwidth, and desired frequency response of the differential pair. | 02-10-2011 |
20110037556 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first layer, a second layer, a number of vias each passing through the first and second layers, and a number of transmission lines. Each transmission line is connected between bonding pads of the two of the number of vias to form a helical-shaped transmission path by the vias and the transmission lines. As a result, the printed circuit board can generate inductive effect. | 02-17-2011 |
20110050365 | SIGNAL TRANSMISSION APPARATUS - A signal transmission apparatus includes a first ground layer, a second ground layer and a band pass filter. The band pass filter includes a first transmission line positioned in a void defined in the first ground layer and a second transmission line positioned in a void defined in the second ground layer. Each of the first transmission line and the second transmission line includes a coil with a plurality of turns spirally extending in the same plane, a gasket extending from the coil and located in the center of the coil, and a signal terminal extending from extremity of the coil. According to employing the band pass filter, the signal transmission apparatus has filtering function, therefore, quality of signals transmitted through the signal transmission apparatus is improved. | 03-03-2011 |
20110051793 | SYSTEM AND METHOD FOR EVALUATING PERFORMANCE OF A MIMO ANTENNA SYSTEM - A performance evaluation system for a multiple-input multiple-output (MIMO) antenna system receives simulation parameters from an input device, and simulates a MIMO antenna system accordingly. A method, also provided, further evaluates performance of the simulated MIMO antenna system when a series of radio frequency (RF) signals are transmitted through the MIMO antenna system, and displays a performance analysis result of the MIMO antenna system on a display device for evaluation of the performance of the simulated MIMO antenna system. | 03-03-2011 |
20110094786 | PRINTED CIRCUIT BOARD - A printed circuit board includes a number of signal layers, a number of ground layers, a first transmission line, a second transmission line, a first via, and a second via. The first transmission is located on one of the number of signal layers. The second transmission line is located on another of the number of signal layers. The first and second vias pass through the printed circuit board. The first via is electrically coupled to the first and second transmission lines, and is isolated from the number of ground layers. The second via is electrically coupled to one or more of the number of ground layers, and is isolated from the other of the number of ground layers to increase an inductance, thus compensating capacitive nature of an open stub and improving signal integrity. | 04-28-2011 |
20110094787 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board includes a layer. A layer of copper is covered on a surface of the layer. A through hole passes through the printed circuit board. A number of thermal engravings are defined in the layer around the through hole. Each thermal engraving is a groove defined in the surface of the layer, without covered with the layer of copper. The number of thermal engravings are not in contact with each other. | 04-28-2011 |
20110266046 | ENCLOSURE OF ELECTRONIC DEVICE - An enclosure of an electronic device includes a plate. The plate defines a number of through holes. A number of shields extend from the plate corresponding to the through holes. Each shield extends outwards from the outer surface of the plate, surrounding and partly covering a corresponding through hole. The enclosure with the shields can shield the electronic device from EMI. | 11-03-2011 |
20110266047 | ENCLOSURE OF ELECTRONIC DEVICE - An enclosure includes a plate. The plate defines a number of through holes. A first shield extends from an edge bounding each through hole. A second shield extends from the edge bounding each through hole, opposite to the first shields. Each through hole is partially covered by a corresponding first shield and a corresponding second shield. The enclosure with the shields can shield the electronic device from electromagnetic interference. | 11-03-2011 |
20110273245 | PRINTED CIRCUIT BOARD AND COMMON MODE FILTER THEREOF - A printed circuit board includes a signal layer and a ground layer adjacent to the signal layer. The signal layer includes a pair of differential transmitting lines. The ground layer includes a common mode filter formed by hollowing patterns on the ground layer. The common mode filter includes two filter portions respectively arranged at opposite sides of a projection of the pair of differential transmitting lines on the ground layer. Each of the two filter portions includes a number of long narrow parallel strips connected in a snake like pattern. Hollowed areas of the two filter portions are bridged through a void. | 11-10-2011 |
20110297413 | ENCLOSURE OF ELECTRONIC DEVICE - An enclosure of an electronic device includes a plate. The plate defines a number of through holes. Each through hole has a pair of tabs connected to each other and with the through hole. Each pair of tabs are slantingly bent towards an inside of the enclosure. The enclosure with the shields can shield the electronic device from electro-magnetic interference. | 12-08-2011 |
20110297435 | ENCLOSURE OF ELECTRONIC DEVICE - An enclosure includes a ventilation plate. The ventilation plate defines a number of through holes. Two hollow bulges extend from an edge bounding each of the through holes at two opposite sides of the plate. A top of each of the bulges defines an opening. The openings of the two bulges and the corresponding through hole define a passage for ventilation and elongate a path that electromagnetic signals must travel to pass through the ventilation plate. The enclosure can better shield the electronic device from EMI. | 12-08-2011 |
20110297438 | ENCLOSURE OF ELECTRONIC DEVICE - An enclosure of an electronic device includes a ventilation plate. The ventilation plate is a grid including a number of crisscrossed connection bars and a number of through holes defined by the connection bars. A tab is formed at each of the connection bars bounding each of the through holes. The tabs are substantially angled from a plane of the grid to elongate a path electromagnetic signals must travel to pass through the ventilation plate. The enclosure with the shields can shield the electronic device from EMI. | 12-08-2011 |
20110298341 | ENCLOSURE OF ELECTRONIC DEVICE - An enclosure of an electronic device includes a plate. The plate defines a number of through holes with a number of shields. Each shield includes a tab apart from the plate. At least two spaced connection pieces connect the tab to a corresponding through hole in such a way that the tab is substantially aligned with and spaced from the corresponding through hole. | 12-08-2011 |
20110298563 | PRINTED CIRCUIT BOARD - A printed circuit board includes a signal layer and a ground layer adjacent to the signal layer. The signal layer includes a pair of differential transmission lines. The ground layer includes a first void, a second void, a third void, and a common mode filter. The first void and the second void are respectively arranged at opposite sides of a projection of the pair of differential transmission lines on the ground layer, and are bridged with the third void. The common mode filter includes a first filter portion positioned in the first void, and a second filter portion positioned in the second void. Each of the first and second filter portions includes a number of coils arranged side by side along a direction parallel to the projection of the pair of differential transmission lines. | 12-08-2011 |
20110299263 | ENCLOSURE OF ELECTRONIC DEVICE - An enclosure includes a plate. The plate defines a number of through holes. A hollow shield extends from the edges bounding each through hole. A top side of the shield opposite to the plate is smaller than a bottom side of the shield which is connected to the edges of the through hole. The enclosure can better shield electromagnetic interference (EMI) from the electronic device. | 12-08-2011 |
20110301922 | EQUIVALENT CIRCUIT SIMULATION SYSTEM AND METHOD - A simulation system for producing equivalent circuits reads data corresponding to a tabular W element format in a storage device, and adds data of the tabular W element format file using interpolation algorithm. A frequency-dependent transmission matrix is transformed into an N-port network matrix describing electrical properties of a multi-input and multi-output network. An N-port network matrix is transformed into a S-parameter matrix. A range of frequency of a s-parameter is determined and numbers of pole-residue, times for recursion and durable maximum system errors in the equivalent circuit is also determined. A a vector fitting algorithm is performed and a rational function matrix composed with s-parameters is produced, to produce a general SPICE equivalent circuit based on the generated rational function matrix. | 12-08-2011 |
20110301923 | EQUIVALENT CIRCUIT SIMULATION SYSTEM AND METHOD FOR HSPICE - A simulation system and method for generating equivalent circuits compatible with HSPICE reads data corresponding to N-port network system format in a storage device, and obtains S-parameter matrixes from the N-port network system. S-parameters in the S-parameter matrix that satisfy passivity are checked, and an interpolation algorithm to supplement S-parameters with passivity when some S-parameters not satisfy passivity is performed. Numbers of pole-residue, times for recursion and a tolerant system error of a rational function are generated for determining S-parameters. A rational function matrix composed of S-parameters is generated by performing a vector fitting algorithm, and an equivalent circuit is generated compatible with HSPICE format based on the generated rational function matrix. | 12-08-2011 |
20110309898 | PRINTED CIRCUIT BOARD - A printed circuit board includes a signal layer and a ground layer adjacent to the signal layer. The signal layer includes a pair of differential transmitting lines. The ground layer includes a common mode filter formed by hollow spiral patterns in the ground layer. The common mode filter includes two filter portions respectively arranged at opposite sides of a projection of the pair of differential transmitting lines onto the ground layer. Hollowed areas of the two filter portions are bridged by a void. | 12-22-2011 |
20110320183 | COMPUTING DEVICE AND METHOD FOR ANALYZING DIFFERENTIAL TRANSMISSION LINES PORT RELATIONSHIPS - A computing device and a method determines port relationships of a differential transmission line of a circuit board according to an original scattering parameters file, which records scattering parameter values measured from ports of the differential transmission line under different signal frequencies. The computing device generates a new scattering parameters file matching a scattering parameters model predefined for the differential transmission line according to the determined port relationships. Design of the differential transmission line is analyzed to determine if the differential transmission line is qualified according to the new scattering parameters file and the scattering parameters model. | 12-29-2011 |
20120000700 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first signal layer, a second signal layer, and a dielectric layer sandwiched between the first signal layer and the second signal layer. The first signal layer includes two pads. The second signal layer includes two conducting pieces connected to two signal traces. The shape and material of the pads are the same as the shape and material of the conducting pieces. The projections of the pads on the second signal layer are overlapping with the conducting pieces. | 01-05-2012 |
20120005388 | HIGH SPEED DATA STORAGE SYSTEM - An exemplary high speed data storage system includes hard disks, a first control panel, a second control panel and a midplane interconnected between each of the first and second control panels and the hard disks. Each of the first and second control panels includes a control chip and a connector. First and second printed circuit wires corresponding to the hard disks are layered on the first and second control panels for electrically connecting the control chip with the connector, respectively. The first printed circuit wires of the first control panel and the second printed circuit wires of the second control panel are arranged symmetrically with respect to each other, and an order of stacking circuit layers of the first printed circuit wires of the first control panel is the reverse of an order of stacking of circuit layers of the second printed circuit wires of the second control panel. | 01-05-2012 |
20120016620 | SYSTEM AND METHOD FOR TESTING AN OBJECT USING A MECHANICAL ARM - A system and method for testing objects using a mechanical arm includes establishing coordinate system based on a work area of the mechanical arm, and obtaining test parameters from a storage system. The method further includes controlling the mechanical arm to get an object and position the object to the position of a test platform according to the test parameters, controlling the mechanical arm to get test tool from a tool shelf and position the test tool to a position of test point on the object to test the object according to the test parameters. The method also includes controlling the mechanical arm to get the object from the test platform and position the object to the location reserved for the object according to the test parameters. | 01-19-2012 |
20120016920 | DIRECT CURRENT COMPENSATION SYSTEM AND METHOD FOR SCATTERING PARAMETER RATIONAL FUNCTIONS - A direct current compensation method for S-parameter rational functions reads S-parameters f(sk), which are generated at given frequency sk, from a storage unit. An S-parameter, which is generated at frequency sk=0 is supplemented into the S-parameters f(sk), upon the condition that there is no S-parameter which is generated at the frequency sk=0. An S-parameter ration function is generated according to the S-parameters f(sk). A DC level of the S-parameter rational function is compensated to generate a compensated S-parameter rational function. | 01-19-2012 |
20120018199 | PRINTED CIRCUIT BOARD - A printed circuit board includes a layer. A layer of copper is covered on a surface of the layer. A through hole passes through the printed circuit board. An approximately C-shaped thermal engraving is defined in the surface of the layers, surrounding the through hole and without being covered by the layer of copper. An opening of the thermal engraving faces an output terminal of the power supply. | 01-26-2012 |
20120025857 | MANIPULATOR OF ROBOT - An exemplary manipulator of a robot includes a fastening seat defining two guiding grooves, a driving mechanism disposed on the fastening seat, two transmitting plates respectively received in the two guiding grooves and cooperating with the driving mechanism, and two detecting bars each fixedly connecting with a corresponding transmitting plate. A detecting pin is fixed on each of the detecting bars. Under a driving action of the driving mechanism on the transmitting plates, the transmitting plates are activated to slide in the guiding grooves to cause the detecting bars to move close to or apart from each other, whereby a distance between the two detecting pins is automatically regulated. | 02-02-2012 |
20120032385 | CLAMPING MECHANISM - A clamping mechanism for holding a workpiece includes an end executor, a driving member, and a contact member detachably mounted on the end executor. The end executor includes a plurality of claws arranged in matrix. The contact member includes a mounting board and a plurality of contact sleeves corresponding to the claws. The driving member is capable of driving the mounting board, moving the contact sleeves to extend the claws, and hold the workpiece. | 02-09-2012 |
20120095716 | ELECTRONIC DEVICE AND METHOD FOR CONTROLLING MODULATIONS OF MULTIPLE-INSTRUMENTS AND SENSORS - A method for modulating multiple-instruments and multiple-sensors using an electronic device. The electronic device controls an instrument to measure the working parameters of an object, and controls a sensor to detect the working temperature of the object. By comparing the working parameters against a predefined range, and comparing the working temperature against a predefined temperature value, the electronic device determines whether the instrument and the sensor need to be modulated. If any of the working parameters is not within the predefined range or if the working temperature is greater than the predefined temperature value, the electronic device controls the instrument and the sensor to be modulated by using a modulation transfer function and a predetermined direction. | 04-19-2012 |
20120097436 | PRINTED CIRCUIT BOARD - A printed circuit board includes a layer. A layer of copper is covered on a surface of the layer. A through hole extends through the printed circuit board. A thermal engraving is defined in the surface of the layer, surrounding the through hole and without being covered by the layer of copper. The thermal engraving includes a first opening and a second opening. The first opening of the thermal engraving faces an output terminal of the power supply, and is non-contiguous with the second opening. | 04-26-2012 |
20120143584 | COMPUTING DEVICE AND METHOD FOR ENFORCING PASSIVITY OF SCATTERING PARAMETER EQUIVALENT CIRCUIT - A computing device and a method for scattering parameter equivalent circuit reads a scattering parameter file from a storage device. A non-common-pole rational function of the scattering parameters in the scattering parameter file is created by applying a vector fitting algorithm to the scattering parameters. Passivity of the non-common-pole rational function is enforced if the non-common-pole rational function does not satisfy a determined passivity requirement. | 06-07-2012 |
20120152602 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a top layer, a memory controller, a gap, and a connector. The memory controller is located on the top layer. A number of first golden fingers are set on the top layer near the gap and electrically connected to the memory controller. A connector includes a first slot to hold the first golden fingers and a second slot to hold a number of second golden fingers of a memory chip. The first slot is electrically connected to the second slot. The memory chip and the PCB are coplanar. | 06-21-2012 |
20120188737 | MOTHERBOARD AND MEMORY CONNECTOR THEREOF - A motherboard includes a printed circuit board (PCB) and a memory connector. The PCB includes top and bottom layers. A number of pads are set on the sides of the top and bottom layers and connected to a memory controller. A number of metal pins are set on a first sidewall of the memory connector. A socket slot is defined in a second sidewall opposite to the first sidewall. Top and bottom sidewalls bounding the socket slot define a number of grooves. First ends of the metal pins are soldered on the pads of the top layer and the bottom layer of the PCB. Second ends of the metal pins are extended to the socket slot through the memory connector and exposed through the grooves of the memory connector, to be electrically connected to the golden fingers of a memory when the memory is inserted in the socket slot. | 07-26-2012 |
20120190219 | MOTHERBOARD AND MEMORY CONNECTOR THEREOF - A motherboard includes a printed circuit board (PCB) and a memory connector. A number of golden fingers are set on corresponding sides of a top layer and a bottom layer of the PCB and connected to a memory controller. First and second socket slots are defined in two opposite sides of the memory connector. A number of grooves are defined in top and bottom sidewalls bounding the first and the second socket slots. A number of metal pins are exposed through the grooves of the first socket slot for connection to the golden fingers of the PCB. The metal pins are extended to the second socket slot to be exposed through the grooves of the second socket opening for connection to the golden fingers of a memory. | 07-26-2012 |
20120197583 | ELECTRONIC DEVICE AND METHOD FOR AUTOMATICALLY TESTING PRINTED CIRCUIT BOARDS - A method of testing a printed circuit board (PCB) acquires test points from a wiring diagram of the PCB. Frequency domain tested items for each test point and a standard value of each frequency domain tested item are preset. A distance between a preset fiducial point and each test point is computed to create a testing order of the test points according to the distances. The frequency domain tested items of each test point are computed according to the testing order. A pass or a failure of each test point is displayed according to a determination of if each of the computed frequency domain tested items within the corresponding standard value, and a test result of the PCB is output according to the passes or the failures. | 08-02-2012 |
20120327550 | ANTISTATIC DEVICE AND METHOD OF REMOVING STATIC ELECTRICITY OF TESTING SYSTEM USING THE SAME - An exemplary antistatic device includes an electricity receiving part and an electricity discharging part. Guiding portions protrude from the electricity receiving part. The electricity discharging part is located at a side of the electricity receiving part, and oriented toward and spaced from the guiding portions of the electricity receiving part. The electricity discharging part is electrically conductive and capable of being grounded. Static electricity accumulated on the electricity receiving part is removable to the electricity discharging part via the guiding portions. | 12-27-2012 |