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Youngchul
Youngchul Kim, Yongin-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090236723 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-IN-PACKAGE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a package substrate, having a component side and a system side; mounting a first integrated circuit die on the component side of the package substrate; mounting a second integrated circuit die on the component side of the package substrate; mounting an internal package, having an internal die, over the first integrated circuit die; coupling chip interconnects between the first integrated circuit die, the second integrated circuit die, the internal die, the component side, or a combination thereof, and forming a stacked package body by encapsulating the component side, the first integrated circuit die, the second integrated circuit die, the internal package, and the chip interconnects. | 09-24-2009 |
| 20090258494 | INLINE INTEGRATED CIRCUIT SYSTEM - An integrated circuit package system including: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe. | 10-15-2009 |
| 20100244221 | INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING DUAL SIDED CONNECTION AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a device through via and a device interconnect, over a substrate with the device through via traversing the integrated circuit and the device interconnect attached to the device through via; attaching a conductive support over the substrate with the conductive support adjacent to the integrated circuit; providing a pre-formed interposer, having an interposer through via and a pre-attached interconnect, with the pre-attached interconnect attached to the interposer through via; mounting the pre-formed interposer over the integrated circuit and the conductive support with the pre-attached interconnect over the device through via; and forming an encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer. | 09-30-2010 |
| 20110244635 | METHOD FOR MANUFACTURE OF INLINE INTEGRATED CIRCUIT SYSTEM - A method for manufacture of an integrated circuit package system includes: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe. | 10-06-2011 |
Youngchul Kim, Daejeon-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090197517 | ASSEMBLING STRUCTURE OF TEMPERATURE-ADJUSTING DOOR - The present invention relates to an assembling structure of a temperature-adjusting door in an air-conditioner for vehicles, in which setting pins are formed on a gear shaft and support members having pin holes are formed on a sliding door in such a way that the gear shaft and the sliding door are temporarily assembled with each other and the temporarily assembled gear shaft and the sliding door are separated from each other when the temporarily assembled gear shaft and sliding door are mounted to an air-conditioning case, thereby preventing misassembly of the temperature-adjusting door, improving assemblability, and reducing the size of the air-conditioning case. | 08-06-2009 |
Youngchul Lee, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20090304561 | REACTOR FOR SEPARATING ALUMINIUM FROM MULTI-LAYER FILM MATERIALS - Disclosed is a reactor for separating an aluminum layer from a multi-layer film wastes to reuse a multi-layer film waste without burying or incinerating the multi-layer film waste including the aluminum. The reactor comprises a cylindrical casing which is filled with a solution to dissolve aluminum layers of the multi-layer film wastes pulverized into a pre-, determined size, a partition which divided an inner portion of the casing into a reactor tub in which the solution reacts with the aluminum layer and a separator tub which is provided at a portion of the reactor tub to decompose the pulverized multi-layer film wastes in which the aluminum is completely dissolved by the solution, and a stirrer which is installed at an upper portion of the reactor and stirs the solution in the reactor to activate the reaction between the solution and the aluminum in the reactor tub and transfer the multi-layer film wastes to the separator tub and. The partition is spaced apart from a bottom of the casing to form a passage between the bottom of the casing and the partition, and the reactor tub communicates with the separator tub through the passage. | 12-10-2009 |
Youngchul Lee, Incheon KR
| Patent application number | Description | Published |
|---|---|---|
| 20090237397 | APPARATUS AND METHOD FOR SEARCHING FOR 3-DIMENSIONAL SHAPES - Disclosed herein is an apparatus and method for searching for 3-dimensional shapes. The apparatus includes, an input means, an acquisition module, a storage means, a comparison and search module, an output means, and control means. The input means receives 3-dimensional image data. The acquisition module acquires a 2-dimensional image data group about the shape of an object represented by the 3-dimensional image data. The comparison and search module compares the respective data of the acquired 2-dimensional image data group with the respective data of the 2-dimensional image data groups that are previously stored in the storage means, and searches for 3-dimensional image data. The control means controls the modules and the means. | 09-24-2009 |
Youngchul Park, Iksan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20120322187 | ETCHANTS AND METHODS OF FABRICATING METAL WIRING AND THIN FILM TRANSISTOR SUBSTRATE USING THE SAME - An etchant includes: a persulfate; a fluoride; an inorganic acid; a cyclic amine; a sulfonic acid; and one of an organic acid and a salt thereof. | 12-20-2012 |
Youngchul Son, Gwangmyeong KR
| Patent application number | Description | Published |
|---|---|---|
| 20120231855 | CONNECTING TERMINAL AND MOBILE TERMINAL HAVING THE SAME - A mobile terminal including a main body having an accommodating chamber; a circuit board mounted at the main body; and connecting terminals disposed on the circuit board to be electrically connected to a battery having terminals. Further, when the battery is mounted in the accommodation chamber, the connecting terminals are pressed by the battery terminals to be elastically deformed. In addition, each of the connecting terminals includes a base portion electrically connected to the circuit board; an elastic portion having a first section extending from the base portion and a second section curved from the first section to have an inclination; and first and second contact portions extending from the second section to be contactable with the battery terminals. | 09-13-2012 |