Patent application number | Description | Published |
20100270664 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same - An epoxy resin composition for encapsulating a semiconductor device, the epoxy resin composition including an epoxy resin, a curing agent, and one or more inorganic fillers, the one or more inorganic fillers including prismatic cristobalite, the prismatic cristobalite being present in the epoxy resin composition in an amount of about 1 to about 50% by weight, based on the total weight of the epoxy resin composition. | 10-28-2010 |
20130310946 | ACETABULAR CUP FOR AN ARTIFICIAL HIP JOINT AND BEARING, AND ACETABULAR CUP ASSEMBLY - An acetabular cup assembly for an artificial hip joint includes an acetabular cup including a seating recess, a female taper formed on an inner wall, protrusion recesses formed to communicate with the seating recess and insertion recesses each positioned inside a corresponding one of the protrusion recesses; and a bearing including a male taper on an outer circumference thereof, protrusions inserted into the protrusion recesses, and insertion protruding portions each formed on a corresponding one of the protrusions, the insertion protruding portions being inserted into the insertion recesses. A polyethylene bearing can be firmly fixed to the acetabular cup. When a ceramic bearing made is inserted into the acetabular cup, the area where the bearing adjoins the acetabular cup is increased, thereby preventing the ceramic bearing from being broken. Since no groove is formed along the entire circumference of the acetabular cup, the strength is increased. | 11-21-2013 |
Patent application number | Description | Published |
20140374731 | SUBSTRATE FOR ORGANIC ELECTRONIC DEVICE - The present application relates to a substrate for an organic electronic device (OED), an organic electronic device, a method of manufacturing the substrate or OED and lighting device. The substrate for an OED of the present application may be improved in durability by preventing penetration of external materials such as moisture or oxygen, and thus an OED having excellent light extraction efficiency may be formed. Also, since the substrate may be stably attached to an encapsulating structure sealing the OED, the device may have excellent durability with respect to abrasion of an electrode layer or pressure applied from an external environment. In addition, a surface hardness of an external terminal of the OED may be maintained at a suitable level. | 12-25-2014 |
20140374734 | SUBSTRATE FOR ORGANIC ELECTRONIC DEVICE - Provided are a substrate for an organic electronic device (OED), an organic electronic device, a method of manufacturing the substrate or OED, and lighting. The substrate for an OED may be increased in durability by preventing penetration of external materials such as moisture or oxygen, and thus form an OED having excellent light extraction efficiency. In addition, since the substrate may be stably attached to an encapsulating structure sealing the OED, the device may have excellent durability with respect to abrasion of an electrode layer or pressure applied from an external environment. In addition, a surface hardness of an external terminal of the OED may be maintained at a suitable level. | 12-25-2014 |
20140374735 | SUBSTRATE FOR ORGANIC ELECTRONIC DEVICE - Provided are a substrate for an organic electronic device (OED), an organic electronic system, a method of manufacturing the substrate or the system, and lighting. The substrate for an OED may be increased in durability by preventing penetration of an external material such as moisture or oxygen, and thus an organic electronic system having excellent light extraction efficiency may be formed. In addition, since the substrate may be stably attached to an encapsulating structure sealing the organic electronic system, the device may have excellent durability with respect to abrasion of an electrode layer or pressure applied from an external environment. In addition, a surface hardness of an external terminal of the organic electronic system may be maintained at a suitable level. | 12-25-2014 |
20150104891 | METHOD FOR PRODUCING A SUBSTRATE FOR ORGANIC ELECTRONIC DEVICES - Provided are methods of manufacturing a substrate for an OED and an OED. According to the methods of manufacturing a substrate for forming an OED such as an OLED and an OED, a substrate for forming a device having excellent light extraction efficiency and improved reliability by preventing penetration of moisture or air into the device, or device using the same may be provided. | 04-16-2015 |
Patent application number | Description | Published |
20100023677 | SOLID STATE STORAGE SYSTEM THAT EVENLY ALLOCATES DATA WRITING/ERASING OPERATIONS AMONG BLOCKS AND METHOD OF CONTROLLING THE SAME - A solid state storage system that evenly allocates data writing/erasing operations among blocks is presented. The solid state storage system includes a controller. The controller is configured to set a representative value that becomes a block allocation reference in accordance with predetermined information of blocks in a flash memory area. The controller is also configured to calculate a data value that becomes life time information according to the predetermined information in a current state for each block. The controller is also configured to determine a block where a deviation is generated between the representative value and the data value. The controller is also configured to allocate block where the deviation is generated as a new block where data is written. | 01-28-2010 |
20110161611 | METHOD FOR CONTROLLING SEMICONDUCTOR STORAGE SYSTEM CONFIGURED TO MANAGE DUAL MEMORY AREA - A method for controlling a semiconductor storage system configured to manage dual memory areas for protecting the system against abrupt and abnormal power disruptions is presented. The semiconductor storage systems has a first physical area and a second physical area, in which first data having a first logical block address are stored in the first physical area. The method includes providing a write command so that the first data is updated to second data. The method also includes writing the second data in a second physical area in response to the write command. When writing the second data in the second physical area, a corresponding invalid logical address is allocated to the second physical area. | 06-30-2011 |
20120144145 | APPARATUS AND METHOD FOR MEASURING LIFESPAN OF MEMORY DEVICE - A method for measuring a lifespan of a memory device includes measuring an operation time of the memory device and generating lifespan information by comparing the measured operation time with a reference operation time. | 06-07-2012 |
20140101386 | DATA STORAGE DEVICE INCLUDING BUFFER MEMORY - A data storage device includes a data storage medium a micro control unit (MCU) connected to a host through a first interface method and configured to control the data storage medium in response to a request of the host; and a buffer memory connected to the host through a second interface method, connected to the MCU, and controlled by the MCU and the host, respectively. | 04-10-2014 |
Patent application number | Description | Published |
20110263770 | Method of Preparing of 60% or More CIS-DI(C4-C20)Alkyl Cyclohexane-1,4-Dicarboxylate - Provided is a method for preparing 60% or more cis-di(C4-C20)alkyl cyclohexane-1,4-dicarboxy-late which exhibits superior plasticizing property for PVC resin. Instead of a phthalate- or terephthalate-based aromatic ester derivative, 60% or more cis-dimethyl cyclo-hexane-1,4-dicarboxylate is used as a starting material. The 60% or more cis-dimethyl cyclohexane-1,4-dicarboxylate is subjected to transesterification with (C4-C20) primary alcohol to prepare 60% or more cis-di(C4-C20)alkyl cyclohexane-1,4-dicarboxylate. Methanol produced as a byproduct during the transesterification is removed and some of the primary alcohol, which is evaporated, is recycled. Thus prepared 60% or more cis-di(C4-C20)alkyl cyclohexane-1,4-dicarboxylate exhibits superior plasticizer characteristics, including good plasticizing efficiency for PVC resin, high absorption rate, good product transparency after gelling, less bleeding toward the surface upon long-term use, and the like. | 10-27-2011 |
20130053492 | Polyvinylchloride Composition with a DI(C4-C20)Alkyl Cyclohexane-1,4-Dicarboxylate Having High CIS Content - Provided is a cis-di(C4-C20)alkyl cyclohexane-1,4-dicarboxylate which exhibits superior plasticizing property for PVC resin. Instead of a phthalate- or terephthalate-based aromatic ester derivative, 60% or more cis-dimethyl cyclohexane-1,4-dicarboxylate is used as a starting material. The 60% or more cis-dimethyl cyclohexane-1,4-dicarboxylate is subjected to transesterification with (C4-C20) primary alcohol to prepare 60% or more cis-di(C4-C20)alkyl cyclohexane-1,4-dicarboxylate. | 02-28-2013 |