Patent application number | Description | Published |
20110312884 | Noggin-Derived Peptide and Use Thereof - Disclosed are a noggin-derived peptide and a composition containing the same for promoting hair growth, improving skin conditions, providing anti-inflammatory function, or preventing or treating bone diseases. The disclosed noggin-derived peptide performs a function identical or similar to that of natural human noggin and is superior in stability and skin permeability as compared thereto. The composition containing the peptide of the present disclosure as an active ingredient exhibits remarkably superior effects in treating, preventing or improving growth factor-related symptoms, e.g. hair loss, skin conditions or cut, or treating, preventing or improving growth factor overexpression-related symptoms. Therefore, the superior activity and stability of the peptide of the present disclosure are greatly advantageous in application to medicine, quasi-drugs and cosmetics. | 12-22-2011 |
20120114577 | Peptide Having Activity of Transforming Growth Factor and Production Method Therefor - The present invention relates to a transforming growth factor-beta (TGF-β)-mimicking peptide containing a particular amino acid sequence and a composition for preventing or treating TGF-β-effective disorders or conditions using the same. The peptide of the present invention may be much higher stability than natural-occurring TGF-β and improve drawbacks caused by high molecular weight of natural-occurring TGF-β. The peptide of this invention can be advantageously applied to treatment or improvement of TGF-β-effective disorders or conditions and have excellent efficacies on skin whitening and wrinkle improvement. | 05-10-2012 |
20140328782 | PEPTIDE INHIBITING MATRIX METALLOPROTEANASES ACTIVITY AND USE THEREOF - The present invention relates to a peptide inhibiting a matrix metalloproteanases activity and use thereof. The peptide inhibiting a matrix metalloproteanases activity exhibits an excellent efficacy of improving the condition of skin by directly inhibiting the matrix metalloproteanases activity. In addition, a composition containing the peptide of the invention has excellent bioactivities of inhibiting the activity of hyaluronic acid degrading enzymes, adipogenesis in fat cells, angiogenesis, and the like, thereby being useful for the treatment of various disease such as anti-obesity, anti-cancer, anti-inflammation, and the like, and skin permeability is excellent due to the small size of the peptide, thereby being useful in various fields. The peptide of the invention having excellent activity and safety can be advantageously applied to drugs, quasi-drugs, and cosmetics. | 11-06-2014 |
Patent application number | Description | Published |
20110095425 | Ball grid array substrate, semiconductor chip package and method of manufacturing the same - Provided is a ball grid array substrate, a semiconductor chip package, and a method of manufacturing the same. The ball grid array substrate includes an insulating layer having a first surface providing a mounting region for a semiconductor chip, a second surface opposing the first surface, and an opening connecting the second surface with the mounting region of the semiconductor chip, and a circuit pattern buried in the second surface. Since the ball grid array substrate is manufactured by a method of stacking two insulating layers, existing devices can be used, and the ball grid array substrate can be manufactured as an ultra thin plate. In addition, since the circuit pattern is buried in the insulating layer, a high-density circuit pattern can be formed. | 04-28-2011 |
20120244662 | BOARD ON CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF - A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the single-layer board on chip package substrate includes an insulator, a circuit pattern and a flip-chip bonding pad, which are formed on an upper surface of the insulator, a conductive bump, which is in contact with a lower surface of the circuit pattern and penetrates through the insulator, a solder resist layer, which is formed on the upper surface of the insulator such that at least a portion of the flip-chip bonding pad is exposed, and a flip-chip bonding bump, which is formed on an upper surface of the flip-chip bonding pad in order to make a flip-chip connection with an electronic component. | 09-27-2012 |
20140017855 | METHOD OF MANUFACTURING A BALL GRID ARRAY SUBSTRATE OR A SEMICONDUCTOR CHIP PACKAGE - A method of manufacturing a ball grid array substrate includes: forming a first circuit pattern and a second circuit pattern on a first metal carrier and a second metal carrier, respectively; stacking a first insulating layer and a second insulating layer with a separable material interposed therebetween, wherein each of the first and second insulating layers has first and second surfaces opposing each other, and the first surface contacts the separable material; burying the first and second circuit patterns in the second surfaces of the first and second insulating layers, respectively; removing the first and second metal carriers; removing the separable material to separate the first and second insulating layers from each other; and forming an opening in each of the first and second insulating layers to connect the first and second surfaces with each other. The method may also be part of a process for manufacturing a semiconductor package. | 01-16-2014 |