Patent application number | Description | Published |
20090066876 | PHOTOSENSOR CIRCUIT, LIQUID CRYSTAL DISPLAY HAVING THE SAME AND METHOD OF DRIVING THE LIQUID CRYSTAL DISPLAY - A photosensor circuit includes a read-out circuit and a determiner. The read-out circuit includes: a first photosensor which outputs a first reference current corresponding to an intensity of a first reference light; a second photosensor which outputs a second reference current corresponding to an intensity of a second reference light; a third photosensor which outputs an external light current corresponding to an intensity of an external light; a first current memory which senses the first reference current; a second current memory which senses a difference between the first and second reference currents; and a storage capacitor which charges during a first period of time and discharges during a second period of time. The determiner calculates the intensity of the external light based on the intensities of the first and second reference lights and durations of the first and second periods of time. | 03-12-2009 |
20090147165 | DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME - A display panel includes a gate line dividing a pixel region into a first region and a second region and including a gate electrode, a data line crossing the gate line and including a source electrode, a thin film transistor connected to the gate line and the data line and including the gate electrode, the source electrode, and a drain electrode facing the source electrode, a protective layer disposed on the thin film transistor and comprising a first contact hole and a second contact hole, and first and second sub-pixel electrodes disposed on the first and second regions of the divided pixel region, respectively. The drain electrode is directly connected to the first sub-pixel electrode through the first contact hole, and the drain electrode is directly connected to the second sub-pixel electrode through the second contact hole. | 06-11-2009 |
20090262270 | LIQUID CRYSTAL DISPLAY DEVICE - A display device includes a substrate; a gate line disposed on the substrate; a data line disposed on the substrate; a driving voltage line disposed on the substrate; a first thin film transistor disposed on the substrate; a second thin film transistor disposed on the substrate; a first semiconductor having an extending region of a storage electrode connected between an output terminal of the first thin film transistor and an control terminal of the second thin film transistor; a transparent conductor of a storage electrode connected to the driving voltage line and overlaps the extending region of the storage electrode; and a pixel electrode connected to an output terminal of the second thin film transistor and overlaps the transparent conductor of the storage electrode. Accordingly, an aperture ratio of the display device may be increased. | 10-22-2009 |
20090315815 | DISPLAY DEVICE AND DRIVING METHOD THEREOF - The present invention relates to a display device and a driving method thereof. The display device includes a light emitting device, a capacitor connected between a first electrical contact and a second electrical contact, a driving transistor, a switching transistor being controlled by a scanning signal to be connected between a data voltage and the first electrical contact, a first compensation transistor being controlled by a first compensation signal to be connected between the first electrical contact and a first voltage, and a second compensation transistor being controlled by a second compensation signal to be connected between the second electrical contact and a second voltage. The driving transistor includes an input terminal that is connected to a driving voltage, an output terminal that is connected to the second electrical contact, and a control terminal that is connected to the first electrical contact. | 12-24-2009 |
20100052517 | ORGANIC LIGHT EMITTING DEVICE - An organic light emitting device, according to an exemplary embodiment of the present invention, includes a thin film transistor array panel including a pixel electrode, an organic light emitting member formed on the pixel electrode, a common electrode formed on the organic light emitting member, and a storage capacitor including a first conductive layer and a second conductive layer overlapping each other via the organic light emitting member. The first conductive layer may be formed with the same layer as the pixel electrode, and the second conductive layer may be formed with the same layer as the common electrode. | 03-04-2010 |
20100072482 | ORGANIC LIGHT EMITTING DISPLAY AND METHOD OF MANUFACTURING THE SAME - Disclosed are an organic light emitting display and a method of manufacturing the same. The organic light emitting includes a first substrate, a first electrode, an organic light emitting layer, and a second electrode. The first substrate includes a pixel region showing an image and a peripheral region surrounding the pixel region. The first electrode is formed in the pixel region of the first substrate. The organic light emitting layer is formed on the first electrode. The second electrode is formed on the organic light emitting layer and extends to the peripheral region. An auxiliary electrode is formed on the second electrode to contact the second electrode on an entire surface of the first substrate, thereby applying a voltage having the same voltage level as that of the second electrode. | 03-25-2010 |
20110020140 | MICRO PUMP - Provided is a micro pump having a simple structure. The micro pump includes a pump chamber including inflow and outflow passages through which a drive fluid flows, a first valve configured to open or close the inflow passage, a second valve configured to open or close the outflow passage, and a pump chamber heating and cooling unit configured to heat or cool the pump chamber. | 01-27-2011 |
20110085476 | Communication Apparatus to Support Multiband Communication - A communication apparatus to support multiband communication is provided. The communication apparatus may be applicable to, for example, a duplexer module for the multiband communication. The communication apparatus may be manufactured to be small and light by simplifying a circuit structure of the duplexer module. | 04-14-2011 |
20110279188 | RESONATOR USING CARBON NANO SUBSTANCE AND METHOD OF MANUFACTURING RESONATOR - A resonator and a method of manufacturing a resonator are provided. The resonator includes a sacrificial layer formed on a substrate, and a resonant structure formed on the sacrificial layer, the resonant structure comprising a carbon nano-substance layer and a silicon carbide layer. | 11-17-2011 |
20120063106 | RF LAYERED MODULE USING THREE DIMENSIONAL VERTICAL WIRING AND DISPOSING METHOD THEREOF - Provided is a structure and disposing method of a radio frequency (RF) layered module using three dimensional (3D) vertical wiring. A first wafer in the RF layered module having the 3D vertical wiring may include a first RF device and at least one first via- hole. A second wafer may include a second RF device and at least one second via-hole disposed at a location corresponding to the at least one first via-hole. A vertical wiring may connect the at least one first via-hole and the at least one second via-hole. The vertical wiring may be configured to be connected to an external device through a bottom surface of the at least one first via-hole or a top surface of the at least one second via-hole. | 03-15-2012 |
20120112850 | MATCHING SEGMENT CIRCUIT TO WHICH RADIO FREQUENCY IS APPLIED AND RADIO FREQUENCY INTEGRATED DEVICES USING THE MATCHING SEGMENT CIRCUIT - Provided are a matching segment circuit, to which a radio frequency (RF) is applied, and an RF integrated device using the matching segment circuit. The matching segment circuit to which an RF is applied may include an input end connected to a first RF device, a parallel segment having a first capacitor and a first inductor connected in parallel, a second inductor connected to the parallel segment in series, and an output end connected to a second RF device. The first capacitor, the first inductor, and the second inductor may be configured so that an impedance of the first RF device and an impedance of the second RF device may match. | 05-10-2012 |
20120139664 | LOW PASS FILTER USING BULK ACOUSTIC WAVE RESONATOR (BAWR) - Provided are low pass filters using a bulk acoustic wave resonator (BAWR). A low pass filter may include an input terminal configured to be connected with a first radio frequency (RF) device, an output terminal configured to be connected with a second RF device, a parallel segment including a first BAWR, a third BAWR, and a fifth BAWR that may be connected in parallel with each other to a reference potential, a first series segment having a second BAWR and a first inductor, and a second series segment having a fourth BAWR and a second inductor, and connected in series with the first series segment. | 06-07-2012 |
20130027153 | BULK ACOUSTIC WAVE RESONATOR AND DUPLEXER USING BULK ACOUSTIC WAVE RESONATOR - A bulk acoustic wave resonator (BAWR) includes a bulk acoustic resonance unit and at least one compensation layer. The bulk acoustic resonance unit includes a first electrode, a second electrode, and a piezoelectric layer disposed between the first electrode and the second electrode. The first electrode, the second electrode, and the piezoelectric layer each include a material that modifies a resonance frequency based on a temperature, and the at least one compensation layer includes a material that adjusts the resonance frequency modified based on the temperature in a direction opposite to a direction of the modification. | 01-31-2013 |
20130226000 | APPARATUS AND METHOD FOR GENERATING ULTRASONIC IMAGE - Provided is an ultrasonic image generating apparatus that may generate an ultrasonic image by using an ultrasonic transducer which has a wideband frequency transfer characteristic or an ultra-wideband frequency transfer characteristic, such as a micromachined ultrasonic transducer (MUT). A pulse generator of the ultrasonic image generating apparatus may generate a first ultrasonic pulse having a first center frequency and a first bandwidth and a second ultrasonic pulse having a second center frequency and a second bandwidth. The ultrasonic transducer may simultaneously transmit the first ultrasonic pulse and the second ultrasonic pulse. | 08-29-2013 |
20130242705 | MULTI-ARRAY ULTRASONIC PROBE APPARATUS AND METHOD FOR MANUFACTURING MULTI-ARRAY PROBE APPARATUS - A multi-array type ultrasonic probe apparatus includes n tiles which transmit and receive an ultrasonic beam; and a substrate having n guide portions on which the n tiles are mounted, respectively, to be aligned in a multi-array. The multi-array ultrasonic probe apparatus may align tiles in identical directions and at identical levels to control a direction and a time for transmitting and receiving an ultrasonic beam to be transmitted and received at the tiles, thereby providing a stable ultrasonic beam. | 09-19-2013 |
20130286593 | ULTRASONIC PROBE - An ultrasonic probe, from which heat generated in an integrated circuit which is bonded to a cMUT is released, is provided. The ultrasonic probe includes a transducer which is configured to generate ultrasound radiation, an integrated circuit which is installed on the rear surface of the transducer, a printed circuit board which is installed on the rear surface of the integrated circuit and has an opening via which the rear surface of the integrated circuit is at least partially exposed, a heat spreader which has a protrusion inserted into the opening of the printed circuit board and is configured to absorb heat generated in the integrated circuit, and a heat dissipation module which is configured to release heat absorbed by the heat spreader to the outside. | 10-31-2013 |
20130341303 | JIG, MANUFACTURING METHOD THEREOF, AND FLIP CHIP BONDING METHOD FOR CHIPS OF ULTRASOUND PROBE USING JIG - A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove. | 12-26-2013 |
20140013850 | TRANSDUCER MODULE INCLUDING CURVED SURFACE FRAME, ULTRASONIC PROBE INCLUDING TRANSDUCER MODULE, AND METHOD OF PRODUCING CURVED SURFACE FRAME - A transducer module includes a curved surface frame which is formed from a flexible material in a curved shape and includes a front surface and a rear surface; a transducer which is disposed on the front surface; and a support frame which is mounted on the rear surface and supports the curved surface frame. | 01-16-2014 |
20140360274 | PORTABLE ULTRASONIC PROBE - A portable ultrasonic probe includes a main body including a transducer to generate an ultrasonic wave and a folder portion including a display portion and pivotally coupled to an end portion of the main body, the main body includes a first heat radiation module configured to absorb and emit heat generated by the transducer, and the folder portion includes a second heat radiation module thermally coupled to the first heat radiation module when the folder portion is in a first position and configured to emit heat transmitted from the first heat radiation module. | 12-11-2014 |
20140364741 | PORTABLE ULTRASONIC PROBE - Provided is a portable ultrasonic probe including a main body comprising a transducer configured to generate an ultrasonic wave, and a folder part comprising a display and rotatably coupled to an end portion of the main body, wherein the main body further comprises an analog to digital (AD) converter and a beamformer, the AD converter and the beamformer being provided in a chip. | 12-11-2014 |
20140364742 | ULTRASONIC PROBE AND MANUFACTURING METHOD THEREOF - Disclosed herein is an ultrasonic probe capable of emitting heat generated by a transducer outside the ultrasonic probe using a heat radiation plate. The ultrasonic probe includes a transducer configured to generate an ultrasonic wave, a heat spreader provided on a surface of the transducer, the heat spreader being configured to absorb heat generated by the transducer, at least one heat radiation plate which contacts at least one side of the heat spreader, and at least one board installed on the at least one heat radiation plate so as to transfer heat generated by the at least one board to the at least one heat radiation plate. | 12-11-2014 |