Patent application number | Description | Published |
20090271037 | METHOD OF GENERATING A WALKING PATTERN FOR A HUMANOID ROBOT - The present invention may provide a method of generating a walking pattern for a humanoid robot. The method of generating the walking pattern for the humanoid includes determining a position of a next Zero Moment Point (ZMP) along a moving direction of the humanoid robot, obtaining a first condition for generating a walking pattern based on the determined ZMP by using a periodic step module, generating trajectories of a ZMP and a Center of Mass (CoM) in an initial step based on the first condition and an initial value obtained from an initial state of the humanoid robot by using a transient step module, generating trajectories of a ZMP and a CoM in a steady step based on the ZMP of two steps by using a steady step module, and generating trajectories of a ZMP and a CoM in a final step by using the transient step module. | 10-29-2009 |
20110196532 | APPARATUS AND METHOD FOR BALANCING AND DAMPING CONTROL IN WHOLE BODY COORDINATION FRAMEWORK FOR BIPED HUMANOID ROBOT - Apparatus and a method for balancing and damping control in whole body coordination framework for a biped humanoid robot. The method comprises the steps of: (a) damping the structural vibration of the main body of the robot caused when the robot walks; (b) compensating for the trajectories of the zero moment position (ZMP) and the center of mass (COM) of the robot which change in accordance with the damping of the structural vibration; and (c) compensating for the body orientation of the robot which changes in accordance with the damping of the structural vibration and the trajectory of the COM. | 08-11-2011 |
20140240365 | SEMICONDUCTOR DEVICE CONTROLLING SOURCE DRIVER AND DISPLAY DEVICE INCLUDING THE SEMICONDUCTOR DEVICE THE SAME - A semiconductor device includes: a transmitter transforming n data into first serial data and transmitting the first serial data through a first transmission line and transforming m data into second serial data and transmitting the second serial data through a second transmission line, where n and m are natural numbers at least one of which is greater than 1; a first driver integrated circuit (IC) group including n driver ICs; and a second driver IC group including m driver ICs, wherein each of the n driver ICs receives the first serial data through the first transmission line and is driven by part of the first serial data, each of the m driver ICs receives the second serial data through the second transmission line and is driven by part of the second serial data, and each of the n data and the m data includes identification information about a driver IC. | 08-28-2014 |
20140240371 | Phase Locked Loop for Preventing Harmonic Lock, Method of Operating the Same, and Devices Including the Same - A phase locked loop includes a voltage controlled oscillator including a plurality of delay cells configured to respectively generate a plurality of clock signals having different phases and a harmonic lock detector configured to detect harmonic lock in the voltage controlled oscillator and to generate a reset signal in response. Remaining ones of the delay cells other than a first delay cell among the plurality of delay cells are reset in response to the reset signal. | 08-28-2014 |
Patent application number | Description | Published |
20120155477 | MULTI HOP ROUTING APPARATUS AND MULTI HOP ROUTING METHOD - Disclosed is a multi hop routing apparatus, including: a receiving unit that receives multi hop routing messages; a parsing unit that parses the received multi hop routing messages; and a control unit that performs a control to determine a routing path using a hop count value and a link quality indicator (LQI) value included in the parsed multi hop routing message. | 06-21-2012 |
20130107696 | LOCATION-BASED ROUTING APPARATUS AND METHOD USING LQI | 05-02-2013 |
20130136060 | METADATA BASED ID INTERPRETATION APPARATUS AND METHOD - Disclosed is a metadata based identifier (ID) interpretation apparatus and method for communication between two nodes present in heterogeneous networks having different ID systems. All of the IDs may be integrally managed using an application layer ID, and communication between nodes having different ID systems may be performed through ID interaction. | 05-30-2013 |
20140310384 | APPARATUS AND METHOD FOR IDENTIFYING INTEROPERABILITY BETWEEN OBJECT IDENTIFIER-BASED HETEROGENEOUS IDENTIFIER NODES FOR NEXT GENERATION NETWORK - Disclosed herein are an apparatus and method for identifying interoperability between object-identifier-based heterogeneous identifier nodes for a next generation network. The apparatus includes a plurality of identifier registry servers located in a plurality of unit networks connected to an open network, and configured to receive and store identifiers and locators of nodes of corresponding unit networks, and also configured to, as identifiers of destination nodes that are communication target nodes are input from nodes of the unit networks, return locators of the destination nodes, wherein unique object identifiers are assigned to the identifier registry servers. An object identifier resolution server is located in the open network, and is configured to receive and store object identifiers and locators of the identifier registry servers, and is also configured to, as object identifiers are input from nodes of the unit networks, transfer locators of identifier registry servers to the nodes. | 10-16-2014 |
20150063110 | PROGRAMMABLE SENSOR NETWORKING APPARATUS AND SENSOR NETWORKING SERVICE METHOD USING THE SAME - Disclosed herein is a programmable sensor networking apparatus. In accordance with an embodiment, the sensor networking apparatus includes a gateway for receiving application service information from an application, generating information to be processed by each sensor node based on the received application service information, and transmitting the generated information to each sensor node, and one or more sensor nodes for receiving the information to be processed from the gateway, and processing the received information. | 03-05-2015 |
20160007398 | METHOD FOR TRANSMISSION OF IPv6 PACKETS OVER NEAR FIELD COMMUNICATION (NFC) AND DEVICE OPERATING THE SAME - Provided are a method of transmitting an Internet Packet version 6 (IPv6) packet over near field communication (NFC) and a device for performing the method. The method of transmitting an IPv6 packet over NFC includes receiving the IPv6 packet through a Logical Link Control Protocol (LLCP), and transmitting the IPv6 packet to an Information Field in Protocol Data Unit (I PDU) of the LLCP, and transmitting the IPv6 packet through an adaptation layer for IPv6 over NFC, wherein the maximum number of octets in the I PDU is determined based on a Maximum Transfer Unit (MTU). | 01-07-2016 |
Patent application number | Description | Published |
20090218077 | Air-Conditioning System And Controlling Method Thereof - The present invention discloses an air conditioning system comprises a phase separator separating a gaseous refrigerant and a liquid refrigerant from a flowing refrigerant, an evaporator evaporating the liquid refrigerant separated by the phase separator, and at least one compressor including a first compressing part receiving the refrigerant via the evaporator and a second compressing part receiving both of the gaseous refrigerant separated by the phase separator and the refrigerant via the first compressing part, wherein a volume of a first cylinder of the first compressing part is different from a volume of a second cylinder of the second compressing part. | 09-03-2009 |
20100131115 | CONTROLLING METHOD OF AIR CONDITIONER - The present invention relates to a controlling method of an air conditioner. The controlling method of an air conditioner having a phase separator, an expansion valve, a control valve, an evaporator, a multistage compressor, and a condenser, includes the steps of sensing an order to operate the air conditioner, stabilizing the air conditioner, setting a degree of superheat of refrigerant in the air conditioner, and setting an optimum intermediate pressure of the refrigerant of the air conditioner. | 05-27-2010 |
20100275624 | Air-Conditioning System And Controlling Method For The Same - An air-conditioning system and a controlling method for the same that is capable of improving the operational efficiency of the air-conditioning system are disclosed. The air-conditioning system includes a phase separator ( | 11-04-2010 |
Patent application number | Description | Published |
20100100450 | MOBILE SERVICE SYSTEM AND SERVICE METHOD USING THE SAME - The present disclosure is relate to an image comparison device using a personal video recorder, the device comprising a display unit configured to output a reference image, at least one camera configured to obtain a comparison image by taking a picture of a present scene of a subject for photography chasing a movement of an object included in the reference image while the reference image is displayed on the screen of the display unit, and a controller configured to display the comparison image with the reference image on the screen, and a method using the an image comparison device. | 04-22-2010 |
20110122403 | INSPECTION METHOD FOR BONDED WAFER USING LASER - Provided is a bonded wafer inspection method using a laser method allowing a simple and reliable test in an examination of a bonded wafer interface using a laser. To do this, a laser used bonded wafer inspection method includes, emitting a laser beam through a laser means, diffusing the emitted laser beam by a laser diffusion means, illuminating the diffused laser beam on a bonded wafer, and detecting a laser beam illuminated and transmitted at the bonded wafer using a detecting means. In a case a bonded wafer inspection method using a laser of the invention is used, defects by a foreign substance occurring at an interface of a bonded wafer is can be examined in a simple way and thus high work performance may be expected. | 05-26-2011 |
20120272279 | APPARATUS FOR PROVIDING INTERNET PROTOCOL TELEVISION BROADCASTING CONTENTS, USER TERMINAL AND METHOD FOR PROVIDING INTERNET PROTOCOL TELEVISION BROADCASTING CONTENTS INFORMATION - An apparatus and method for providing IPTV broadcasting contents information is provided. The apparatus and method is capable of easily providing a user terminal with related information that is associated with IPTV broadcasting content contents. The apparatus includes a content generator configured to generate an IPTV broadcasting content by use of a broadcasting content and a Quick Response (QR) code including related information that is associated with the broadcasting content, and a transmitter configured to transmit the IPTV broadcasting content. | 10-25-2012 |
20120314212 | INSPECTION DEVICE FOR BONDED WAFER USING LASER - Disclosed is a device for inspecting a bonded wafer using laser, which has a simple structure to facilitate an operation of the device and can detect an interface defect of the bonded wafer economically and highly reliably. To this end, the device for inspecting the bonded wafer using laser includes a laser unit, a laser diffusion unit, and a detection unit. If the device of inspecting the bonded wafer using laser according to the present invention is used, it is possible to advantageously inspect a wafer interface at a magnification desired by an inspector. In addition, the device has a simple structure, and thus it is advantageously easy to operate the device. | 12-13-2012 |
Patent application number | Description | Published |
20120173598 | APPARATUS AND METHOD FOR DIVISION OF A GALOIS FIELD BINARY POLYNOMIAL - An apparatus and method for processing a division of a binary polynomial are provided. The apparatus includes a plurality of exclusive OR (XOR) operators that may perform a selective XOR operation with respect to a conditional bit of a dividend polynomial. The plurality of XOR operators may perform selective XOR operations in parallel and accordingly, a division of a binary polynomial may be rapidly performed. | 07-05-2012 |
20120173600 | APPARATUS AND METHOD FOR PERFORMING A COMPLEX NUMBER OPERATION USING A SINGLE INSTRUCTION MULTIPLE DATA (SIMD) ARCHITECTURE - Provided are an apparatus and method for performing a complex number operation using a Single Instruction Multiple Data (SIMD) architecture. A SIMD operation apparatus may perform, in parallel, a real part operation and an imaginary part operation of a plurality of complex numbers. The real part operation and the imaginary part operation may be performed sequentially, or in parallel. | 07-05-2012 |
20130173935 | POWER CONTROL METHOD AND APPARATUS FOR ARRAY PROCESSOR - Provided is an apparatus and method for controlling power to a reconfigurable array processor. The method may determine one or more function units (FUs) as activation function units (FUs) and deactivation FUs among a plurality of FUs included in the reconfigurable array processor. The processor may interrupt power supplied to the deactivation FUs. | 07-04-2013 |
20150127924 | METHOD AND APPARATUS FOR PROCESSING SHUFFLE INSTRUCTION - A method and corresponding apparatus for processing a shuffle instruction are provided. Shuffle units are configured in a hierarchical structure, and each of the shuffle units generates a shuffled data element array by performing shuffling on an input data element array. In the hierarchical structure, which includes an upper shuffle unit and a lower shuffle unit, the shuffled data element array output from the lower shuffle unit is input to the upper shuffle unit as a portion of the input data element array for the upper shuffle unit. | 05-07-2015 |
20150149747 | METHOD OF SCHEDULING LOOPS FOR PROCESSOR HAVING A PLURALITY OF FUNCTIONAL UNITS - Provided is a loop scheduling method including scheduling a first loop using execution units, and scheduling a second loop using execution units available as a result of the scheduling of the first loop. An n-th loop (n>2) may be scheduled using a result of scheduling an (n−1)-th loop, similar to the (n−1)-th loop. The first loop may be a higher priority loop than the second loop. | 05-28-2015 |
20150154144 | METHOD AND APPARATUS FOR PERFORMING SINGLE INSTRUCTION MULTIPLE DATA (SIMD) OPERATION USING PAIRING OF REGISTERS - An apparatus and a method for performing a single instruction multiple data (SIMD) operation using pairing of registers are provided. An example SIMD apparatus includes a first register configured to store first result data generated by dyadic operators, and a second register configured to store second result data generated by the dyadic operators. The first register and the second register may be paired with each other. Examples also include the use of more than two dyadic operators and/or registers, as well as intermediate registers. | 06-04-2015 |
Patent application number | Description | Published |
20080209722 | Method for forming via hole having fine hole land - A method for forming a via hole having a fine hole land with which the density of circuit patterns can be increased. The method includes forming a via hole in a copper clad laminate, coating an etching resist over the copper clad laminate, and forming a circuit pattern on the copper foil of the copper clad laminate; forming a seed layer, coating a photoresist, and exposing an inner wall of the via hole; and forming a plated layer on the inner wall of the via hole and removing the photoresist and the seed layer. | 09-04-2008 |
20080216314 | METHOD FOR MANUFACTURING THE BGA PACKAGE BOARD - Disclosed herein is a Ball Grid Array (BGA) package board. The BGA package board includes a first external layer on which a pattern comprising a circuit pattern and a wire bonding pad pattern is formed, a second external layer on which a pattern comprising a circuit pattern and a solder ball pad pattern is formed, an insulating layer formed between the first and second external layers, a first outer via hole to electrically connect the first and second external layers to each other, and a solder resist layer formed on each of the first and second external layers, with portions of the solder resist layer corresponding to the wire bonding pad pattern and the solder ball pad pattern being opened. The solder ball pad pattern is thinner than the circuit pattern of the second external layer. | 09-11-2008 |
20080223610 | BGA PACKAGE SUBSTRATE AND METHOD OF FABRICATING SAME - Disclosed is a ball grid array (BGA) package substrate, in which a wire bonding pad and a solder ball pad are formed on a via hole, making high freedom in design of a circuit pattern and a high density circuit pattern possible, and a method of fabricating the same. | 09-18-2008 |
20100261348 | Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad - A method for fabricating a semiconductor package substrate, including: preparing a copper clad laminate and half etching a copper foil on a wire bonding pad side of the copper clad laminate; depositing a first etching resist on the opposite sides of the copper clad laminate; forming circuit patterns on the first etching resist, constructing circuits including a wire bonding pad and a ball pad after the model of the circuit patterns, and removing the first etching resist; applying a solder resist to the copper clad laminate in such a way to expose the wire bonding pad and the ball pad; and plating the wire bonding pad with gold and subjecting the ball pad to surface treatment. | 10-14-2010 |
20110095421 | Flip chip package and method of manufacturing the same - There is provided a flip chip package including an electronic device, a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is mounted, and a connection pad disposed outside the mounting region, a resin layer formed on the board and including a trench formed by removing a part of the resin layer, and a dam member provided on the trench and preventing the leakage of an underfill between the mounting region and the connection pad. Since the dam member, formed on the processed resin layer, can prevent the leakage of the underfill, a package defect rate can be lowered, and connection reliability can be improved. | 04-28-2011 |
20110266671 | SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - Disclosed herein are a substrate for a semiconductor package and a manufacturing method thereof. The substrate for the semiconductor package, which has a single-sided substrate structure including circuit patterns having a connection pad formed on only an electronic component mounting surface, can directly connect a connection pad on the top of the substrate to external connection terminals on the bottom of the substrate through a connection via formed of a metal plating layer formed in an inner wall of the via hole and a conductive metal paste filled in the via hole. | 11-03-2011 |
20110286191 | Printed circuit board and semiconductor package with the same - Disclosed herein is a printed circuit board. The printed circuit board includes a base substrate including a first region on which a semiconductor chip is mounted and a second region positioned outside the first region, first insulating patterns covering the base substrate and including trenches formed on the second region, and second insulating patterns protruding from the first insulating patterns on the second region. The trench and the second insulating pattern may be used as a structure defining an underfill forming material in a preset shape during the process of forming an underfill. | 11-24-2011 |
20120043128 | Printed circuit board and method of manufacturing the same - The present invention provides a multilayer printed circuit board and a method for manufacturing the same. The printed circuit board includes: an inner circuit layer which is disposed on a first insulating layer; a via land which is disposed on the first insulating layer to be spaced apart from the inner circuit layer and has a hole; a second insulating layer which is disposed on the first insulating layer including the inner circuit layer and the via land; first and second outer circuit layers which are disposed on outer surfaces of the first and second insulating layers, respectively; and a via which passes through the hole of the via land and the first and second insulating layers and electrically interconnects the first and second outer circuit layers. | 02-23-2012 |
20120168212 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure formed on the first surface roughness. | 07-05-2012 |
20120244662 | BOARD ON CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF - A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the single-layer board on chip package substrate includes an insulator, a circuit pattern and a flip-chip bonding pad, which are formed on an upper surface of the insulator, a conductive bump, which is in contact with a lower surface of the circuit pattern and penetrates through the insulator, a solder resist layer, which is formed on the upper surface of the insulator such that at least a portion of the flip-chip bonding pad is exposed, and a flip-chip bonding bump, which is formed on an upper surface of the flip-chip bonding pad in order to make a flip-chip connection with an electronic component. | 09-27-2012 |
20140030855 | METHOD OF MANUFACTURING FLIP CHIP PACKAGE - A method of manufacturing a flip chip package includes: providing a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is to be mounted, and a connection pad disposed outside the mounting region; forming a resin layer on the board; forming a trench by removing a part of the resin layer or forming an uneven portion at a portion of a surface of the resin layer; forming, on the trench or uneven portion, a dam member preventing leakage of an underfill between the mounting region and the connection pad; and mounting the electronic device on the mounting region. | 01-30-2014 |
20150382461 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure formed on the first surface roughness. | 12-31-2015 |
Patent application number | Description | Published |
20110276309 | TRAIN LOAD MEASURING SYSTEM AND METHOD THEREOF - Disclosed is a train load measuring system and a method thereof. The train load measuring system includes a speed/acceleration measuring unit, a position measuring unit, a railway-line state receiving unit, a driving/braking force receiving unit and a calculate unit. The speed/acceleration measuring unit measures a speed and acceleration of the train. The position measuring unit measures a current position of the train. The railway-line state receiving unit receives a railway-line state. The driving/braking force receiving unit receives driving and braking forces of the train. The calculating unit calculates a train load based on information transferred from the units. | 11-10-2011 |
20120325979 | TRAIN SENSOR UNIT FOR SENSING RADIO COMMUNICATION BASED TRAIN, TRAIN POSITION SENSING SYSTEM, AND TRAIN POSITION SENSING METHOD OF THE SYSTEM - Provided is a train sensor unit for sensing a radio communication based train to transmit train sensing information to a control unit, which includes a sensor unit, a controller unit, and a communication unit. The sensor unit obtains environmental information about an environment in which the train travels. The controller unit determines whether the train is present, based on the obtained environmental information. The communication unit wirelessly transmits the train sensing information to the control unit if the train is present. | 12-27-2012 |
20150287509 | ELECTROMAGNETIC ACTUATOR - An electromagnetic actuator includes a first body which includes a biased permanent magnet, a magnetic path control device which is disposed to adjust a magnetic path produced by the biased permanent magnet, at least one core which is disposed to face the biased permanent magnet and the magnetic path control device, and a coil which is wound on the at least one core so as to reinforce or cancel the magnetic path produced by the biased permanent magnet; and a second body which is separated from the biased permanent magnet and the magnetic path control device when the at least one core is between the second body and at least one of the biased permanent magnet and the magnetic path control device. | 10-08-2015 |
Patent application number | Description | Published |
20110133999 | APPARATUS AND METHOD FOR MEASURING RADIATED POWER OF TERMINAL - An apparatus for measuring radiated power of a terminal includes: an enclosure including a pair of couplers configured to couple an electromagnetic field radiated from the terminal or a substitution antenna and a measurement jig configured to rotate the terminal or the substitution antenna, the terminal or the substitution antenna being supposed to be arranged between the pair of couplers, with reference to at least one of X, Y, and Z axes; a driver installed outside the enclosure to drive the measurement jig; a signal generator configured to generate a feed signal transferred to the substitution antenna when the substitution antenna is arranged on the measurement jig; a feed signal transmitter configured to transfer the feed signal generated by the signal generator to the substitution antenna; and a spectrum analyzer configured to measure power of a radiated signal radiated from the terminal or the substitution antenna. | 06-09-2011 |
20120142290 | APPARATUS AND METHOD FOR DETECTING EFFECTIVE RADIATED POWER - Provided is an apparatus and method for measuring effective radiated power. The apparatus includes a reference signal power measuring unit configured to measure power of a reference signal from a wireless signal transmitted from a wireless device, and an effective radiated power calculating unit configured to calculate effective radiated power according to an allocation ratio of a reference signal in an entire signal domain using the measured reference signal power from the reference signal power measuring unit. | 06-07-2012 |
20120162031 | METHOD FOR PREDICTING PHASE PATTERN USING MAGNITUDE PATTERN IN NEAR-FIELD OR FRESNEL FIELD - Disclosed is a method for predicting a phase pattern using a magnitude pattern in near-field or Fresnel field formed by antenna radiation, including: determining a first parameter group including a first actual distance between a source antenna and a probe and the magnitude pattern at the first distance; assuming a second parameter group including a second distance that is an effective distance between the source antenna and the probe, a current magnitude distribution of the source antenna and a current phase distribution of the source antenna, based on the first parameter group; calculating the magnitude pattern at the first distance based on the second parameter group; and determining the phase pattern at the first distance when the magnitude pattern at the calculated first distance matches with the magnitude pattern at the first distance included in the first parameter group by the comparison therebetween. | 06-28-2012 |
20130249746 | METHOD AND APPARATUS FOR MEASURING RADIATED POWER OF ANTENNA - An apparatus for measuring radiated power of an antenna includes a chamber which an absorber is attached to a wall thereof; a source antenna and a test antenna configured to be arranged within the chamber; a rotational axis configured to adjust an arrangement angle of the test antenna in up-and-down directions; and a roll positioner configured to rotate the test antenna. Further, the apparatus includes a turntable configured to be provided within the chamber and be rotated in a left-to-right direction; a connection unit configured to allow the test antenna, to rotate in the left-to-right direction; and a supporting unit configured to be rotatably connected to one end of the rotational axis which the other end thereof is rotatably connected to the roll positioner. | 09-26-2013 |
20140057571 | APPARATUS FOR MEASURING RADIATED POWER OF WIRELESS COMMUNICATION DEVICE AND METHOD THEREOF - Disclosed are an apparatus for measuring radiated power and a method thereof. The apparatus for measuring radiated power includes: a measurement unit configured to receive an RF signal radiated from an antenna of the wireless communication device to generate a radiated power measurement value; a driving unit configured to vertically ascend or descend the measurement unit from the ground; and an operation control unit configured to control the driving unit to ascend the measurement unit to a point at which the antenna is installed and convert the radiated power measurement value into a measurement value on a target point. In accordance with the embodiment of the present invention, even when the antenna of the wireless communication device is inclined to the ground, the radiated power of the wireless communication device can be accurately measured by compensating for the change in the measurement distance due to the inclined angle. | 02-27-2014 |
20160040087 | METHOD FOR PREPARING HIGH-QUALITY LUBRICANT FROM BIOMASS-DERIVED FATTY ACID - Disclosed is a method for producing a quality lubricant base oil (meeting the standard of Group III or higher) comprising: decarbonylating mixed fatty acids derived from oils and fats of biological origin to produce mixed olefins; oligomerizing the mixed olefins to produce an olefinic lubricant base oil; and performing hydrogenation to remove olefins from the olefinic lubricant base oil. | 02-11-2016 |
20160075931 | DRILLING OIL AND METHOD OF PREPARING THE SAME - Embodiments of the present invention relate to drilling oil, and to a method of preparing the drilling oil, including converting C16 and/or C18 fatty acids derived from fat of biological origin into C15 and/or C17 olefins through decarbonylation. | 03-17-2016 |
Patent application number | Description | Published |
20110036969 | Unit pixels including boosting capacitors, pixel arrays including the unit pixels and photodetecting devices including the pixel arrays - A unit pixel capable of achieving full initialization of a floating diffusion area, a pixel array including the unit pixel, and a photodetecting device including the pixel array. The unit pixel includes a photodetector, a transmission transistor for transmitting charges generated from the photodetector to a floating diffusion area, a reset transistor for initializing the floating diffusion area, and a boosting capacitor having a first terminal connected to the floating diffusion area and a second terminal to which a boosting voltage is applied. | 02-17-2011 |
20110176045 | COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR IMAGE SENSOR, DATA READOUT METHOD THEREOF, AND ELECTRONIC SYSTEM INCLUDING THE SAME - A complementary metal-oxide semiconductor (CMOS) image sensor and a pixel data readout method of the same are provided. The CMOS image sensor includes: a first readout line which outputs pixel data from a shared pixel group in an odd row of a column of a pixel array in a Bayer pattern during a horizontal period; and a second readout line which outputs pixel data from a shared pixel group in an even row of the column of the pixel array during the horizontal period, wherein pixel data output to the first and second readout lines during the horizontal period correspond to a basic Bayer pattern and pixels from which pixel data are read out in each column sequentially shifts in a column direction at each horizontal period. | 07-21-2011 |
20110298949 | LIGHT LEAKAGE COMPENSATING UNIT IMAGE SENSORS, IMAGE SENSOR ARRAYS INCLUDING THE UNIT IMAGE SENSORS, AND METHODS FOR COMPENSATING FOR LIGHT LEAKAGE OF THE IMAGE SENSOR ARRAYS - A light leakage compensating unit image sensor in a back side illumination method includes a photodiode and a storage diode, in which light input to a back side of the unit image sensor is received only by an area forming an electrode of the photodiode, and an area for forming another electrode of the photodiode and an area for forming two electrodes of the storage diode are separated from each other by a well, thereby compensating light leakage. | 12-08-2011 |
20130015324 | CMOS IMAGE SENSORAANM Park; Young HwanAACI Namyangju-siAACO KRAAGP Park; Young Hwan Namyangju-si KRAANM Ahn; Jung ChakAACI Yongin-siAACO KRAAGP Ahn; Jung Chak Yongin-si KRAANM Lee; Sang JooAACI Seongnam-siAACO KRAAGP Lee; Sang Joo Seongnam-si KRAANM Park; Jong EunAACI Seongnam-siAACO KRAAGP Park; Jong Eun Seongnam-si KRAANM Jang; Young HeubAACI Suwon-siAACO KRAAGP Jang; Young Heub Suwon-si KR - In one embodiment, the image sensor includes a first photodiode configured to convert an optical signal into a photocharge, a sensing node configured to store the photocharge of the first photodiode, and a circuit configured to selectively output an electrical signal corresponding to the photocharge at the sensing node on an output line. The circuit is connected to at least a first conductive contact, and the output line is disposed between the sensing node and the first conductive contact. | 01-17-2013 |
Patent application number | Description | Published |
20100258545 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A method of manufacturing a printed circuit board is disclosed. The method in accordance with an embodiment of the present invention includes providing an insulation layer having a first area and a second area formed thereon, forming a solder resist layer on the insulation layer, in which the solder resist layer has a first opening formed thereon and the first opening exposes the first area, forming a first surface treatment layer on the first area inside the first opening, forming a second opening on the solder resist layer, in which the second opening exposes the second area, and forming a second surface treatment layer on the second area inside the second opening. | 10-14-2010 |
20110101510 | BOARD ON CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF - A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the substrate includes an insulator, a first pad and a second pad, which are provided on an upper surface of the insulator, a through-hole, which is formed in the insulator such that a lower surface of the first pad is exposed, and a solder resist layer, which is formed on the upper surface of the insulator such that at least a portion of the second pad is exposed. | 05-05-2011 |
20110110058 | BOARD ON CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF - A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the single-layer board on chip package substrate includes an insulator, a circuit pattern and a flip-chip bonding pad, which are formed on an upper surface of the insulator, a conductive bump, which is in contact with a lower surface of the circuit pattern and penetrates through the insulator, a solder resist layer, which is formed on the upper surface of the insulator such that at least a portion of the flip-chip bonding pad is exposed, and a flip-chip bonding bump, which is formed on an upper surface of the flip-chip bonding pad in order to make a flip-chip connection with an electronic component. | 05-12-2011 |