| Patent application number | Description | Published |
|---|
| 20080251697 | IMAGE SENSOR AND METHOD OF FABRICATION - Disclosed is an image sensor and method of fabricating the same. The image sensor includes a photoelectric transformation region formed in a semiconductor substrate, and pluralities of interlayer dielectric films formed over the photoelectric transformation regions. The interlayer dielectric films contain multilevel interconnection layers. A color filter layer is disposed in a well region formed in the interlayer dielectric films over the photoelectric transformation region. A passivation layer is interposed between the color filter layer and the interlayer dielectric films. | 10-16-2008 |
| 20080283884 | CMOS IMAGE DEVICE WITH POLYSILICON CONTACT STUDS - A CMOS image device comprises a pixel array region including a photo diode region, a floating diffusion region, and at least one MOS transistor having a gate and a junction region, a CMOS logic region disposed around the pixel array region, the CMOS logic region including a plurality of nMOS transistors and pMOS transistors, and contact studs formed on the floating diffusion region and the junction region in the pixel array region, the contact studs comprising impurity-doped polysilicon layers. | 11-20-2008 |
| 20090008688 | Unit pixels, image sensors and methods of manufacturing the same - Unit pixels, image sensors and methods for fabricating the image sensor are provided. A unit pixel includes: a photodiode for accumulating photocharges; a floating diffusion region for detecting the photocharges accumulated in the photodiode; a reset element for periodically resetting the floating diffusion region; a drive element for amplifying the photocharges accumulated in the floating diffusion region; a selection element for selecting the unit pixel; and a silicide layer formed on top surfaces of the transfer gate. The photocharges are transferred to the floating diffusion region via a transfer gate. | 01-08-2009 |
| 20090014763 | CMOS image sensor with photo-detector protecting layers - An image sensor includes a logic region and an APS region having a first gate electrode, a photo-detector, a first protecting layer, first spacers, and a second protecting layer. The first gate electrode is formed over a semiconductor substrate. The photo-detector is formed to a side of the first gate electrode within the semiconductor substrate. The first protecting layer is formed over the first gate electrode and the photo-detector. The first spacers are formed over the first protecting layer to the sides of the first gate electrode. The second protecting layer is formed over the first protecting layer and the spacers. The first and second protecting layers are for preventing a contaminant from reaching the photo-detector. | 01-15-2009 |
| 20090087986 | Semiconductor devices using fine patterns and methods of forming fine patterns - Example embodiments may provide fine patterns for semiconductor devices and methods of forming fine patterns for semiconductor devices. Example methods may include forming a spacer pattern on a substrate and/or an insulating layer pattern adjacent to sides of the spacer pattern and/or disposed at the same level as the spacer pattern, forming a pair of recesses exposing sides of the spacer pattern by removing a portion of the insulating layer pattern, and/or filling a conductive material in the recesses. | 04-02-2009 |
| 20090160971 | Image sensor with adjusted gains in active and black pixels - An image sensor includes an active pixel and a black pixel. The active pixel has a first signal gain and a first dark signal level, and the black pixel has a second signal gain and a second dark signal level. At least one of the first and second signal gains is adjusted such that the first and second dark signal levels are substantially equal for minimizing image defects in the image sensor. | 06-25-2009 |
| 20090200591 | IMAGE SENSOR WITH LIGHT RECEIVING REGION HAVING DIFFERENT POTENTIAL ENERGY ACCORDING TO WAVELENGTH OF LIGHT AND ELECTRONIC PRODUCT EMPLOYING THE SAME - There is provided a CMOS image sensor and an electronic product using the same. The CMOS image sensor includes a plurality of pixels for embodying colors having different wavelengths. Each of pixels includes a buried barrier layer disposed in a semiconductor substrate and having a barrier potential energy of a conduction band thereof at an equilibrium state, a first layer disposed at a main surface of the semiconductor substrate separated from the buried barrier layer in a vertical direction and having a first potential energy of a conduction band thereof at the equilibrium state, and a second layer disposed between the first region and the buried barrier layer having a second potential energy of a conduction band thereof at the equilibrium state. The second potential energy is higher than the first potential energy and the barrier potential energy and a thickness of the second layer is thicker as the wavelength is longer | 08-13-2009 |
| 20090309144 | CMOS Image sensor having a crosstalk prevention structure - In a method of manufacturing a CMOS image sensor, a P type epitaxial layer is formed on an N type substrate. A deep P | 12-17-2009 |
| 20100055823 | Methods of manufacturing CMOS image sensors - Complementary metal-oxide semiconductor (CMOS) image sensors (CIS) and methods of manufacturing the same are provided, the sensors include an epitaxial layer on a substrate in which a first, second, third and fourth region are defined. A photodiode may be formed at an upper portion of the epitaxial layer in the first region. A plurality of gate structures may be formed on the epitaxial layer in the second, third and fourth regions. A first blocking layer may be formed on the gate structures and the epitaxial layer in the first and second regions. A first impurity layer may be formed at an upper portion of the epitaxial layer adjacent to the gate structures in the second region, and a second impurity layer at upper portions of the epitaxial layer adjacent to the gate structures in the third and fourth regions. A color filter layer may be formed over the photodiode. A microlens may be formed on the color filter layer. | 03-04-2010 |
| 20110163362 | Methods of fabricating image sensors and image sensors fabricated thereby - A method of fabricating an image sensor may include providing a substrate including light-receiving and non-light-receiving regions; forming a plurality of gates on the non-light-receiving region; ion-implanting a first-conductivity-type dopant into the light-receiving region to form a first dopant region of a pinned photodiode; primarily ion-implanting a second-conductivity-type dopant, different from the first-conductivity-type dopant, into an entire surface of the substrate, using the gates as a first mask; forming spacers on both side walls of the gates; and secondarily ion-implanting the second-conductivity-type dopant into the entire surface of the substrate, using the plurality of gates including the spacers as a second mask, to complete a second dopant region of the pinned photodiode. An image sensor may include the substrate; a transfer gate formed on the non-light-receiving region; a first dopant region in the light-receiving region; and a second dopant region formed on a surface of the light-receiving region. | 07-07-2011 |
| 20110163363 | COMS image sensors and methods of manufacturing the same - Complementary metal-oxide semiconductor (CMOS) image sensors (CIS) and methods of manufacturing the same are provided, the sensors include an epitaxial layer on a substrate in which a first, second, third and fourth region are defined. A photodiode may be formed at an upper portion of the epitaxial layer in the first region. A plurality of gate structures may be formed on the epitaxial layer in the second, third and fourth regions. A first blocking layer may be formed on the gate structures and the epitaxial layer in the first and second regions. A first impurity layer may be formed at an upper portion of the epitaxial layer adjacent to the gate structures in the second region, and a second impurity layer at upper portions of the epitaxial layer adjacent to the gate structures in the third and fourth regions. A color filter layer may be formed over the photodiode. A microlens may be formed on the color filter layer. | 07-07-2011 |
