Patent application number | Description | Published |
20080278921 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME, AND PRINTED CIRCUIT BOARD - Provided are a semiconductor package, a method of forming the semiconductor package, and a printed circuit board (PCB). The semiconductor package includes: a PCB including at least two parts divided by an isolation region; a semiconductor chip mounted on the PCB; and a molding layer disposed in the isolation region. The method includes: preparing a PCB, the PCB including a plurality of chip regions and a scribe region; forming isolation regions dividing each of the chip regions into two parts, the isolation regions including inner isolation regions and outer isolation regions, the inner isolation regions being provided in the chip regions, the outer isolation regions being provided at both ends of the inner isolation regions so as to extend toward the scribe region; mounting semiconductor chips on the chip regions; and cutting the PCB along the scribe region to divide the chip regions into at least two parts. | 11-13-2008 |
20110272716 | LEAD FRAME FOR CHIP PACKAGE, CHIP PACKAGE, PACKAGE MODULE, AND ILLUMINATION APPARATUS INCLUDING CHIP PACKAGE MODULE - A lead frame for a chip package, a chip package, a package module, and an illumination apparatus including the chip package module. The chip package includes a first coupling portion and a second coupling portion that are coupled to each other on edges of a lead frame for mounting a chip thereon, and thus a package module is easily embodied by coupling the first coupling portion and the second coupling portion to each other. | 11-10-2011 |
20120181555 | LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - Light-emitting device packages which may be manufactured using post-molding and with improved heat emission performance and optical quality, and methods of manufacturing the light-emitting device packages. The light-emitting device package includes: a heat dissipation pad; a light-emitting device formed on the heat dissipation pad; a pair of lead frames disposed to be spaced apart from each other at both sides of the light-emitting device and the heat dissipation pad; a molding member surrounding the side of the light-emitting device except for an emission surface of the light-emitting device; and bonding wires for electrically connecting the lead frames to the light-emitting device. | 07-19-2012 |
20120187437 | LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE LIGHT-EMITTING DEVICE PACKAGE - A light-emitting device package having improved connection reliability of a bonding wire, heat dissipation properties, and light quality due to post-molding and a method of manufacturing the light-emitting device package. The light-emitting device package includes, for example, a wiring substrate having an opening; a light-emitting device that is disposed on the wiring substrate and covers the opening; a bonding wire electrically connecting a bottom surface of the wiring substrate to a bottom surface of the light-emitting device via the opening; a molding member that surrounds a side surface of the light-emitting device and not a top surface of the light-emitting device, which is an emission surface, is formed on a portion of a top surface of the wiring substrate, and is formed in the opening of the wiring substrate to cover the bonding wire; and a solder resist and a bump formed on the bottom surface of the wiring substrate. | 07-26-2012 |
20120205699 | LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A light-emitting device package and a method of manufacturing the light-emitting device package. The light-emitting device package includes a wiring substrate; a Zener diode mounted on a first region of the wiring substrate; a light-emitting device chip mounted on the first region and a second region of the wiring substrate; and a molding member for fixing at least a portion of the wiring substrate, wherein the Zener diode is embedded in the molding member. | 08-16-2012 |
20120205708 | LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A light-emitting device package. The light-emitting device package includes a lead frame comprising a plurality of separate leads; a molding member that fixes the plurality of leads and comprises an opening portion that exposes the lead frame; and a light-emitting device chip that is attached on the lead frame in the opening portion and emits light through an upper surface portion of the light-emitting device chip, wherein a height of the molding member is lower than a height of the light-emitting device chip with respect to the lead frame. | 08-16-2012 |
20130170178 | LIGHT SOURCE MODULE AND ILLUMINATION APPARATUS HAVING THE SAME - A light source module including: a cover unit having a pipe structure with one open end or two open ends; a cap unit coupled to the one open end or two open ends of the cover unit; a light source unit including a light emitting device, the light source unit mounted on the cap unit and covered by the cover unit; and a wavelength conversion unit disposed in an internal space of the cover unit and coupled to the light source unit while covering the light emitting device, the wavelength conversion unit converting a wavelength of light emitted from the light emitting device to allow the wavelength-converted light to be emitted through the cover unit. | 07-04-2013 |
20130182432 | ILLUMINATION DEVICE - An illumination device includes a main body unit, a light source module and a cover unit. The light source module is disposed in an upper space of the main body unit to be separated therefrom and includes a substrate and at least one light emitting device respectively disposed on both surfaces of the substrate. The cover unit is disposed on the main body unit to cover the light source module and allowing light emitted from the light source module to be emitted from a surface of the cover unit in a radial manner. | 07-18-2013 |