Patent application number | Description | Published |
20130153266 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a base substrate; at least one circuit pattern formed on the base substrate; at least one dummy pattern formed on the base substrate; and an insulating layer formed on the circuit pattern and the dummy pattern, wherein a distance between adjacent patterns to each other among the circuit patterns and the dummy patterns meets the following Equation 1. | 06-20-2013 |
20130168132 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes a base substrate; a circuit layer including a connection pad having a vertically etched upper portion and formed on the upper portion of the base substrate; a solder resist layer formed on the upper portion of the base substrate and including an opening part exposing the connection pad; and a surface treatment layer formed on the upper portion of the connection pad exposed by the opening part. | 07-04-2013 |
20140077896 | VIA STRUCTURE HAVING OPEN STUB AND PRINTED CIRCUIT BOARD HAVING THE SAME - The present invention relates to a via structure having an open stub and a printed circuit board having the same. In accordance with an embodiment of the present invention, a via structure having an open stub including: a signal transmission via passing through an insulating layer; upper and lower via pads for connecting first and second transmission lines, which are respectively formed on and under the insulating layer, and the signal transmission via; and at least one open stub connected to an outer periphery of each via pad to have a shunt capacitance with each ground pattern formed on and under the insulating layer is provided. Further, a printed circuit board with a via having an open stub is provided. | 03-20-2014 |
20140104798 | HYBRID LAMINATION SUBSTRATE, MANUFACTURING METHOD THEREOF AND PACKAGE SUBSTRATE - Disclosed herein are a hybrid lamination substrate and a manufacturing method thereof. The hybrid lamination substrate includes: a core layer; at least one first insulating layer that is made of a photosensitive resin material and is formed on an upper portion, a lower portion, or upper and lower portions of the core layer; and at least one second insulating layer that is made of a non-photosensitive resin material and is formed on the upper portion, the lower portion, or the upper and lower portions of the core layer. Further, a package substrate including the same and a manufacturing method of a hybrid lamination substrate are proposed. | 04-17-2014 |
20140166347 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a base substrate; and a circuit pattern formed on the base substrate, including a conductive filler therein, and having roughness formed on a surface thereof. | 06-19-2014 |
20140176278 | INDUCTOR AND MANUFACTURING METHOD THEREOF - There is provided an inductor, including a circuit board having an input and output terminal formed on a lower surface thereof, a connection pad formed on an upper surface thereof, and a via electrically connecting the input and output terminal and the connection pad, a coil having both ends joined to the connection pad and wound in a circular or a polygonal spiral shape in a longitudinal direction of the circuit board so as to have one or more turns, and a body stacked on the circuit board such that the coil and the connection pad are embedded therein. | 06-26-2014 |
20140182905 | PRINTED CIRCUIT BOARD AND SURFACE TREATMENT METHOD OF PRINTED CIRCUIT BOARD - Disclosed herein are a printed circuit board including a copper foil layer surface treated with Pb-free solder having the same height as that of a solder resist, and a surface treatment method of the printed circuit board. | 07-03-2014 |
20140182915 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a circuit board. A circuit board in accordance with an embodiment of the present invention includes a base substrate; an interlayer insulating layer covering the base substrate; a via structure passing through at least the interlayer insulating layer of the base substrate and the interlayer insulating layer in the vertical direction; and an etch stop pattern disposed on the interlayer insulating layer in the horizontal direction to surround the via structure and made of an insulating material. | 07-03-2014 |
20140192446 | ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is an electrostatic discharge protection device including: a substrate; electrodes disposed to be spaced apart from each other on the substrate; and an electrostatic discharge absorbing layer having atypical metal lumps formed on the substrate. | 07-10-2014 |
20140292469 | POWER INDUCTOR AND MANUFACTURING METHOD THEREOF - Disclosed herein is a power inductor including: an opening part penetrating through the insulating layer; an upper coil electrode pattern formed on an upper surface of the insulating layer and having a form in which it is wound around the opening part; a lower coil electrode pattern formed on a lower surface of the insulating layer and having a form in which it is wound around the opening part; and metal layers plated on a surface of the innermost pattern of the upper coil electrode pattern and a surface of the innermost pattern of the lower coil electrode pattern, wherein the metal layers plated on the surfaces of the innermost patterns of the upper and lower coil electrode patterns are extended to an inner wall of the opening part to thereby be connected to each other. | 10-02-2014 |
20140338955 | PRINTED CIRCUIT BOARD - Disclosed herein is a printed circuit board. According to a preferred embodiment of the present invention, the printed circuit board, includes: a base board; an upper build-up layer which is formed on the base board and includes an upper insulating layer and an upper circuit layer having at least one layer; and a lower build-up layer which is formed beneath the base board, has a different thickness from the upper build-up layer, and includes a lower insulating layer and a lower circuit layer having at least one layer. | 11-20-2014 |
20150041180 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board including: an insulating layer; and a metal circuit layer formed on at least one surface of the insulating layer, wherein the metal circuit layer has surface roughness on only its one surface, and a method of manufacturing the same. | 02-12-2015 |
20150055312 | INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an interposer substrate, including: a core layer and a through core via (TCV) penetrating through the core layer; circuit wirings formed on both surfaces of the core layer and a TCV upper pad and a TCV lower pad which are each bonded to upper and lower surfaces of the TCV formed on both surfaces of the core layer; upper insulating layers covering the TCV upper pad and the circuit wiring formed on one surface of the core layer and having the circuit wirings formed on upper surfaces thereof; a stack via penetrating through the upper insulating layers of each layer and having one end connected to the TCV upper pad; and a lower insulating layer covering the TCV lower pad and the circuit wiring formed on the other surface of the core layer and provided with an opening which exposes the TCV lower pad. | 02-26-2015 |