Youichiro
Youichiro Baba, Miyoshi-Shi JP
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20150243532 | METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR MODULE - Disclosed is a technique capable of preventing an encapsulating material from covering a heat-dissipating surface of a semiconductor module, which releases heat of a switching element. Specifically disclosed a step for manufacturing a semiconductor module including a submodule having a collector and an emitter with heat-dissipating surfaces, including a step for placing the submodule in the cavity so that the submodule is pressed by the pressing device while covering the heat-dissipating surface of the emitter with the pressing device and covering the heat-dissipating surface of the collector with the lower mold, and a step for feeding the encapsulating material to the cavity by moving the piston so that the pressure of the cavity measured by the pressure measuring device does not exceed the pressure at which the pressing device presses the submodule. | 08-27-2015 |
Youichiro Baba, Nishikamo-Gun JP
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20090229864 | INSULATING CIRCUIT BOARD AND INSULATING CIRCUIT BOARD HAVING COOLING SINK - An insulating circuit board includes an insulating plate, a circuit board joined to a first surface of the insulating plate, and a metal plate joined to a second surface of the insulating plate. The circuit board is formed from an Al alloy having a purity of 99.98% or more or pure Al, and the metal plate is formed from an Al alloy having a purity of 98.00% or more and 99.90% or less. The thickness (a) of the circuit board is 0.2 mm or more and 0.8 mm or less, the thickness (b) of the metal plate is 0.6 mm or more and 1.5 mm or less, and the thicknesses satisfy the expression of a/b≦1. An insulating circuit board having a cooling sink includes cooling sink joined via a second solder layer. The second solder layer contains Sn as its main component, and has a Young's modulus, 35 GPa or more, a 0.2% proof stress of, 30 MPa or more, and a tensile strength of, 40 MPa or more. The cooling sink is formed from, pure Al or an Al alloy. | 09-17-2009 |
Youichiro Jido, Chiba JP
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20100222618 | METALWORKING LUBRICANT - Provided is a lubricant for metal working comprising a vinylidene compound having 12 to 64 carbon atoms obtained by oligomerizing α-olefins, having 4 to 20 carbon atoms, using a metallocene catalyst. The lubricant for metal working is excellent in a workability and a surface detergency property and has a high flash point and can reduce environmental pollution. | 09-02-2010 |
20120058925 | WATER-SOLUBLE PROCESSING OIL AGENT - To provide a water-soluble working fluid which less adversely affects the human body and the ecological system as compared with conventional water-soluble working fluids, which has high rotting resistance, and which provides excellent working performance. | 03-08-2012 |
Youichiro Kawai, Okazaki-Shi Aichi-Ken JP
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20150069284 | NANOCOMPOSITE THERMOELECTRIC CONVERSION MATERIAL AND METHOD OF MANUFACTURING THE SAME - A nanocomposite thermoelectric conversion material includes: crystal grains of a matrix phase material; and a grain boundary phase that is formed in an interface between the crystal grains and includes an insulating material. In the interface between the crystal grains of the matrix phase material, an element that forms the matrix phase material and an element that forms the insulating material are bonded by a chemical bond. | 03-12-2015 |
Youichiro Kawai, Okazaki-Shi JP
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20150280096 | PHONON SCATTERING MATERIAL, NANOCOMPOSITE THERMOELECTRIC MATERIAL, AND METHOD OF PRODUCING THE SAME - Provided is a compound which is mixed with a thermoelectric conversion material matrix as a phonon scattering material. The compound is represented by the following formula: | 10-01-2015 |
Youichiro Nakagawa, Shiga JP
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20090032992 | APPARATUS FOR PRODUCING POLYMER FILM AND PROCESS FOR PRODUCING POLYMER FILM - An apparatus and method suitable for producing a polymer film, particularly a polyimide film, perform drying and heat treatment using a tenter type feeding apparatus that suppresses the problems of deformation of film in the vicinity of pore into which the pins bite and breakage of the pores to form long pores in the width direction. The apparatus includes a device to suppress deformation of the film in the vicinity of the tenter pins at the time point when the both ends of the film is pierced with the pins and cools the pin temperature to less than 180° C. at the time when the film is pierced with the pins. Individual pins can be arranged on the innermost side of the pin sheets so that they are all disposed at the same distance both in the film feeding direction in the individual pin sheets and between other pin sheets. | 02-05-2009 |
Youichiro Nakahara, Tsu-Shi JP
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20100263921 | CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A circuit board includes: an insulating substrate; and a circuit formed on the insulating substrate. The circuit includes: a undercoat layer with a circuit pattern formed by irradiating a metal thin film covering a surface of the insulating substrate with a laser along an outer shape of the circuit so as to partly remove the metal thin film along the outer shape of the circuit; a Cu plating layer, a Ni plating layer and a Au plating layer formed by metal plating and sequentially provided on a surface of the undercoat layer. A first middle plating layer and a second middle plating layer are provided between the Ni plating layer and the Au plating layer. The first middle plating layer includes metal with a less noble standard electrode potential with respect to Au and is in contact with the Au plating layer. The second middle plating layer includes metal with a noble standard electrode potential with respect to the metal in the first middle plating layer and is in contact with the first middle plating layer. | 10-21-2010 |
Youichiro Nakahara, Tsu JP
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20090266173 | PRESSURE SENSOR - In a pressure sensor including a pressure detecting element in an intermediate portion or at a deep side of a through hole formed in a protrusion, a body portion (a base portion and the protrusion) is made of ceramic or an insulative resin material and molded into a predetermined shape, and the pressure sensor is constituted as a molded interconnect device in which a conductive pattern is formed on a surface thereof. Accordingly, a smaller pressure sensor can be obtained. | 10-29-2009 |
Youichiro Nishikawa, Katano City JP
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20120212062 | BATTERY PARALLEL-OPERATION CIRCUIT AND BATTERY SYSTEM - A first line includes a switching element and is electrically coupled to a branch point and an external load which is electrically connectable to a battery parallel-operation circuit. A second line includes a resistive element, and is electrically coupled to the external load and the branch point. The first line and the second line are each provided in a plurality. The plural first lines are connected in parallel to one another, and the plural second lines are connected in parallel to one another. The branch points are electrically coupled respectively to plural external, connectable battery units. | 08-23-2012 |
20120212183 | POWER MANAGEMENT SYSTEM - Provided is a power management system capable of controlling charge and discharge of storage batteries according to power requirement of load even when handling electric power of large scale. A system controller receives load-related information data including the power requirement of load and storage battery-related information data including a state of a storage battery assembly including multiple storage batteries and creates an overall charge-discharge control instruction for the entire power management system based on the load-related information data and the storage battery-related information data. A hierarchical charge-discharge control apparatus receives the overall charge-discharge control instruction from the system controller and performs charge-discharge control of the multiple storage batteries, classified into hierarchical levels, on a hierarchical level basis. | 08-23-2012 |
Youichiro Yamada, Itabashi-Ku JP
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20110125808 | CONSTRUCTION INFORMATION MANAGEMENT DEVICE AND CONSTRUCTION INFORMATION MANAGEMENT SYSTEM - A construction information management device and a construction information management system can readily grasp the history information about each layer below the surface of a road on which construction has been repeatedly carried out. After a subject construction is finished, a user creates the construction information about the subject construction in a construction information processing terminal, and the construction information is transmitted to a construction information management device. The construction information management device receives the construction information, and, based on the construction information, analyzes the pavement structure of the construction zone. Based on the analyzed construction information, the construction information management device also updates the history information about the construction subject road in a superimposing manner. When a request signal for requesting the history information is transmitted from the construction information processing terminal, the construction information management device transmits the updated history information to the construction information processing terminal. | 05-26-2011 |