Patent application number | Description | Published |
20100188794 | Electrostatic chuck and device of manufacturing organic light emitting diode having the same - The present invention discloses an electrostatic chuck sucking and supporting a substrate with an electrostatic force and an OLED manufacturing apparatus having the same. The electrostatic chuck includes an insulating plate having at least one opening penetrating a center thereof, a pair of electrodes mounted on the insulating plate, a first controller applying a voltage to the pair of electrodes, and an electrostatic charge removing unit disposed near the insulating plate and emitting ions into the at least one opening to remove electrostatic charges distributed around a side of the insulating plate. | 07-29-2010 |
20100275842 | Evaporating apparatus - Provided is an evaporating apparatus that deposits a deposition material onto a treatment object. The evaporating apparatus includes a base, a deposition source, and first and second correction units. The deposition source deposits the deposition material onto the treatment object. The base is disposed separately from the treatment object. The deposition source is placed on a surface of the base. The first and second correction units located between the deposition source and the treatment object. The first and second correction units are disposed on outer regions of the deposition source and face each other. Each of the first and second correction units rotates to control the thickness of a layer formed by the deposition material deposited on the treatment object. | 11-04-2010 |
20100279021 | APPARATUS FOR DEPOSITING ORGANIC MATERIAL AND DEPOSITING METHOD THEREOF - An apparatus for depositing an organic material and a depositing method thereof, wherein a deposition process is performed with respect to a second substrate while transfer and alignment processes are performed with respect to a first substrate in a chamber, so that loss of an organic material wasted in the transfer and alignment processes can be reduced, thereby maximizing material efficiency and minimizing a processing tack time. The apparatus includes a chamber having an interior divided into a first substrate deposition area and a second substrate deposition area, an organic material deposition source transferred to within ones of the first and second substrate deposition areas to spray particles of an organic material onto respective ones of first and second substrates and a first transferring unit to rotate the organic material deposition source in a first direction from one of the first and second substrate deposition areas to an other of the first and second substrate deposition areas. | 11-04-2010 |
20100304025 | DEPOSITION APPARATUS AND METHOD OF CONTROLLING THE SAME - A deposition apparatus including a plurality of reaction chambers, and a method of controlling the deposition apparatus. The deposition apparatus includes a first chamber to deposit a first deposition material onto a deposition body, a second chamber to deposit a second and different deposition material onto the deposition body, a third chamber to deposit the first deposition material onto the deposition body, a transfer chamber connected to the first through third chambers, the transfer chamber to transfer the deposition body to ones of the first through third chambers and a control unit to transport the deposition body from the transfer chamber to ones of the first through third chambers. | 12-02-2010 |
20110073042 | Substrate Centering Device and Organic Material Deposition System - A substrate centering device for an organic material deposition system comprises: a plurality of substrate support holders configured to be reciprocally movable in a facing direction within an organic material deposition chamber and supporting both side portions of a substrate loaded by a robot; a substrate centering unit configured to be reciprocally movable at each of the substrate support holders and centering the substrate by guiding both side portions of the substrate; and a plurality of substrate clampers configured to be reciprocally movable in a vertical direction at each of the substrate support holders, and clamping the substrate that has been centered by the substrate centering unit. | 03-31-2011 |
20110083788 | SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD - A substrate bonding apparatus includes a vacuum chamber having a bonding space where a first substrate and a second substrates are bonded together, a first pump for sucking air of the bonding space at a first intensity, a second pump for sucking the air of the bonding space at a second intensity greater than the first intensity, a nitrogen supply for supplying nitrogen to the bonding space, a sensor for sensing the pressure of the bonding space; and a controller for controlling the first pump, the second pump, and the nitrogen supply. | 04-14-2011 |
20130302134 | SUBSTRATE CENTERING DEVICE AND ORGANIC MATERIAL DEPOSITION SYSTEM - A substrate centering device for an organic material deposition system comprises: a plurality of substrate support holders configured to be reciprocally movable in a facing direction within an organic material deposition chamber and supporting both side portions of a substrate loaded by a robot; a substrate centering unit configured to be reciprocally movable at each of the substrate support holders and centering the substrate by guiding both side portions of the substrate; and a plurality of substrate clampers configured to be reciprocally movable in a vertical direction at each of the substrate support holders, and clamping the substrate that has been centered by the substrate centering unit. | 11-14-2013 |
20130309403 | APPARATUS FOR DEPOSITING ORGANIC MATERIAL AND DEPOSITING METHOD THEREOF - An apparatus for depositing an organic material and a depositing method thereof, wherein a deposition process is performed with respect to a second substrate while transfer and alignment processes are performed with respect to a first substrate in a chamber, so that loss of an organic material wasted in the transfer and alignment processes can be reduced, thereby maximizing material efficiency and minimizing a processing tack time. The apparatus includes a chamber having an interior divided into a first substrate deposition area and a second substrate deposition area, an organic material deposition source transferred to within ones of the first and second substrate deposition areas to spray particles of an organic material onto respective ones of first and second substrates and a first transferring unit to rotate the organic material deposition source in a first direction from one of the first and second substrate deposition areas to an other of the first and second substrate deposition areas. | 11-21-2013 |
20130319597 | SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD - A substrate bonding apparatus includes a vacuum chamber having a bonding space where a first substrate and a second substrates are bonded together, a first pump for sucking air of the bonding space at a first intensity, a second pump for sucking the air of the bonding space at a second intensity greater than the first intensity, a nitrogen supply for supplying nitrogen to the bonding space, a sensor for sensing the pressure of the bonding space; and a controller for controlling the first pump, the second pump, and the nitrogen supply. | 12-05-2013 |
20140037849 | DEPOSITING APPARATUS AND METHOD FOR MEASURING DEPOSITION QUANTITY USING THE SAME - A deposition apparatus may uniformly control deposited quantities of a plurality of depositing sources by efficiently determining an abnormal depositing source. The deposition apparatus may reduce loss of materials by exactly determining an abnormal depositing source. The deposition apparatus includes: a plurality of depositing sources spraying a deposition material; a substrate holder fixing a substrate to face the depositing source; a depositing source shutter disposed at one side of the depositing source and opening and closing an passage of each depositing source; and a main shutter disposed between the depositing source and the substrate fixed to the substrate holder and depositing a part of the deposition material on the substrate through the main shutter. | 02-06-2014 |
20140131311 | THIN FILM FORMING APPARATUS AND THIN FILM FORMING METHOD USING THE SAME - A thin film forming apparatus and a thin film forming method using the same are disclosed. In one aspect, the thin film forming apparatus comprises a mask that includes a blocking portion and an opening. It also includes an etching source that jets an etching gas through the opening of the mask to etch a thin film according to a pattern. The mask includes a gas blower for blowing a gas around the opening so that the etching gas does not penetrate into a thin film area corresponding to the block portion. When the thin film forming apparatus is used, a normal residual area of a thin film may be safely preserved and patterning may be accurately performed. Thus, the quality of a product manufactured by using the thin film forming apparatus may be improved. | 05-15-2014 |
20140319475 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF - An organic light emitting diode display is disclosed. In one aspect, the display includes a pixel electrode formed on a substrate and a pixel defining layer on the pixel electrode, the pixel defining layer having an opening exposing a part of the pixel electrode, and a stepped side wall of the opening. The display also includes an organic emission layer on the pixel electrode in the opening of the pixel defining layer and a common electrode covering the organic emission layer and the pixel defining layer. The pixel defining layer has a stepped side wall of the opening. | 10-30-2014 |
20140322852 | DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DIODE DISPLAY - A deposition apparatus includes a deposition chamber, a plurality of substrate holders comprising a first holder configured to maintain a substrate at a first substrate position in the deposition chamber and a second holder configured to maintain another substrate at a second substrate position in the deposition chamber, a deposition source disposed in the deposition chamber and configured to supply a deposition material to apply onto substrates placed at the first and second substrate positions, and a deposition source transfer mechanism configured to move the deposition source to be opposite to one of the first and second substrates in a first direction, a substrate transfer mechanism configured to transfer a substrate in a second direction to or from the first substrate position and further configured to transfer another substrate in the second direction to or from the second substrate position. | 10-30-2014 |