| Patent application number | Description | Published |
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| 20090075568 | POLISHING PAD, METHOD OF PRODUCING THE SAME AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE BY USING THE SAME - The present invention provides a polishing pad used for planarizing inter layer dielectrics and the like by CMP (chemical mechanical polishing) in the manufacturing process of a semiconductor device, a method of producing the polishing pad and a method of producing a semiconductor device by using the polishing pad. The present invention relates to a semiconductor wafer polishing pad having grooves in a polishing surface and formed from a foamed polyurethane, wherein a processed surface of the groove comprising a side surface and a bottom surface has a surface roughness Ra of not more than 10. | 03-19-2009 |
| 20090104850 | POLISHING PAD - An object of the present invention is to provide a polishing pad excellent in polishing rate and superior in longevity without generating center slow. Another object of the present invention is to provide a method of manufacturing a semiconductor device with the polishing pad. Disclosed is a polishing pad having a polishing layer consisting of a polyurethane foam having fine cells, wherein a high-molecular-weight polyol component that is a starting component of the polyurethane foam contains a hydrophobic high-molecular-weight polyol A having a number-average molecular weight of 550 to 800 and a hydrophobic high-molecular-weight polyol B having a number-average molecular weight of 950 to 1300 in an A/B ratio of from 10/90 to 50/50 by weight. | 04-23-2009 |
| 20090137188 | POLISHING PAD - A polishing pad provides excellent optical detection accuracy properties over a broad wavelength range (particularly at the short-wavelength side). A method for manufacturing a semiconductor device includes a process of polishing the surface of a semiconductor wafer with this polishing pad. The polishing pad has a polishing layer containing a polishing region and a light-transmitting region, wherein the light-transmitting region includes a polyurethane resin having an aromatic ring density of 2 wt % or less, and the light transmittance of the light-transmitting region is 30% or more in the overall range of wavelengths of 300 to 400 nm. | 05-28-2009 |
| 20090137189 | POLISHING PAD - An object of the present invention is to provide a polishing pad excellent in optical detection accuracy in a broad wavelength range (particularly at the short-wavelength side) and capable of preventing a slurry from leaking from the boundary between a polishing region and a light-transmitting region. Disclosed is a polishing pad including at least a transparent support film laminated on one side of a polishing layer including a polishing region and a light-transmitting region, wherein the light transmittance of an optical detection region containing at least the light-transmitting region and the transparent support film is 40% or more in the overall range of wavelengths of 300 to 400 nm. | 05-28-2009 |
| 20100003896 | POLISHING PAD - A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (A), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (A) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices. | 01-07-2010 |
| 20100015893 | POLISHING PAD - An object of the invention is to provide a polishing pad having excellent planarization performance and wear resistance and to provide a method for manufacture thereof. The invention is directed to a polishing pad including a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam is a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that is capable of reacting with 4,4′-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 100° C. or more, (2) an isocyanate-terminated prepolymer (B) that is capable of reacting with 4,4′-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 40° C. or less, and (3) 4,4′-methylenebis(o-chloroaniline), and the isocyanate-terminated prepolymers (A) and (B) are mixed in an (A)/(B) ratio of 50/50 to 90/10 (by wt %). | 01-21-2010 |
| 20110026063 | IMAGE READING APPARATUS AND IMAGE DETERMINING METHOD - As provided with a first reading section and a second reading section for reading both surfaces of a document, an image reading apparatus respectively calculates gamma correction values in gamma correcting sections and correction factors in color correcting sections, and corrects colors of criteria images being read by the first reading section and the second reading section in accordance with sample data stored on a storing section in order to substantially match the colors of both criteria images. In addition, the image reading apparatus utilizes an distinctive color range common for the both surfaces which defines a color about a distinguishing pattern, in order to determine whether images of both surfaces contain the distinguishing pattern or not. | 02-03-2011 |
| Patent application number | Description | Published |
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| 20090253353 | POLISHING PAD - It is an object of the invention to provide a polishing pad capable of high precision optical detection of an endpoint during polishing in progress and prevention of slurry leakage from between a polishing region and a light-transmitting region during the use thereof even after the polishing pad has been used for a long period. It is a second object of the invention to provide a polishing pad capable of suppression of deterioration of polishing characteristics (such as in-plane uniformity) and generation of scratches due to a difference in behavior of a polishing region and a light-transmitting region during polishing. It is a third object of the invention to provide a polishing pad having a polishing region and a light-transmitting region with a concentration of a specific metal equal to or lower than a specific value (threshold value). | 10-08-2009 |
| 20100048102 | POLISHING PAD - A polishing pad capable of maintaining a high level of dimensional stability upon moisture absorption or water absorption and providing high polishing rate includes a polishing layer of a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol, (2) an isocyanate-terminated prepolymer (B) that includes a polymerized diisocyanate and a polyethylene glycol with a number average molecular weight of 200 to 1,000, and (3) a chain extender. | 02-25-2010 |
| 20100245898 | Image processing device and image forming device - When an image based on RGB image data accepted by the image processing section and the ICU is to be enlarged by the zoom process section of the ICU (or when specification of an area in an image is accepted by the operation section), the leak-preventing identification mark detecting section, the positional relation calculating section and the forgery-preventing identification mark detecting section respectively determine whether patterns respectively representing a leak-preventing identification mark and a forgery-preventing identification mark are included separately in the entire area of the image and in an area to be enlarged (or an area whose specification has been accepted) or not. | 09-30-2010 |
