Patent application number | Description | Published |
20090048774 | Route information display device and route information display method - A route information display device is provided which calculates a branch point in routes to a plurality of inputted destinations, and uses the branch point to control information modes. | 02-19-2009 |
20090248284 | TRAVEL SUPPORT SYSTEM AND TRAVEL SUPPORT METHOD - Provided is a travel support system which sufficiently uses notified non-equipped vehicle information, and includes: an equipped-vehicle detecting unit ( | 10-01-2009 |
20090281721 | TRANSIT INFORMATION PROVISION DEVICE, METHOD AND PROGRAM - A transit information provision device is provided which provides transit information with an optimal method according to a situation of a user; the transit information provision device including a transit event information acquiring unit ( | 11-12-2009 |
20090312946 | TRAVEL HISTORY EDITING DEVICE - A travel history editing device in the present invention includes: a position information detecting unit ( | 12-17-2009 |
20100036601 | DESTINATION PREDICTION APPARATUS AND METHOD THEREOF - To provide a destination prediction apparatus which predicts a destination more accurately than before. A destination prediction apparatus which predicts a destination of a mobile object includes: a stay characteristic accumulating unit ( | 02-11-2010 |
20100225469 | NOTIFICATION SYSTEM, NOTIFICATION DEVICE, AND NOTIFICATION METHOD - Conventional notification systems have a poor operability since a notification is transmitted every time a child moves outside a predetermined area. Provided is a notification system comprising: a first position detection unit ( | 09-09-2010 |
20100304757 | MOBILE DEVICE AND METHOD FOR IDENTIFYING LOCATION THEREOF - To provide a mobile device which can accurately identify a location of the mobile device in relation to a user. | 12-02-2010 |
20110144543 | BEHAVIOR RECOGNITION APPARATUS - A behavior recognition apparatus includes: a hand movement observation unit ( | 06-16-2011 |
20110175755 | VEHICLE LOCATION DETECTION DEVICE AND VEHICLE LOCATION DETECTION METHOD - The vehicle location detection device includes: a sound source location specifying unit which calculates an attenuation amount of a sound pressure of a vehicle sound by subtracting a sound pressure detected by a sound pressure detecting unit from a sound pressure indicated by vehicle sound pressure information stored in a sound pressure information storage unit, and specifies a location where another vehicle emitting a vehicle sound is predicted to be present, by specifying a sound source location of a sound diffracted by an obstacle which is specified by a diffraction location specifying unit and serves as a diffraction point, based on the calculated attenuation amount, a rule indicating an attenuation amount dependent on a propagation distance of the sound, and a relationship indicated by diffraction information stored in a diffraction information storage unit; and a presentation unit which presents the specified location. | 07-21-2011 |
20110246126 | REVOLUTION INCREASE-DECREASE DETERMINATION DEVICE AND REVOLUTION INCREASE-DECREASE DETERMINATION METHOD - An acceleration-deceleration determination device includes: a DFT analysis unit which calculate, from an engine sound, a frequency signal at a predetermined frequency for each of predetermined time periods; and an acceleration-deceleration determination unit which determines whether the number of engine revolutions is increasing or decreasing, by determining whether a phase of the frequency signal is increasing at an accelerating rate over time or decreasing at an accelerating rate over time. | 10-06-2011 |
20120039478 | SOUND RECOGNITION DEVICE AND SOUND RECOGNITION METHOD - A sound recognition device includes: a frequency analysis unit which analyzes a frequency signal of a sound signal; a phase curve calculation unit which calculates a phase curve approximating temporal fluctuations of a phase of the frequency signal; an error calculation unit which calculates an error between the phase curve and the phase of the frequency signal; and a sound signal recognition unit which recognizes whether or not the sound signal is a signal of a periodic sound, based on the calculated error. The phase curve is expressed by a quadratic polynomial in which a value of the phase is a variable. | 02-16-2012 |
20120323532 | VEHICLE COUNTING DEVICE AND VEHICLE COUNTING METHOD - A vehicle counting device including: a frequency analysis unit that analyzes a frequency of a surrounding sound detected by a vehicle sound detection microphone; a vehicle sound candidate selection unit that selects, as one or more vehicle sound candidates, one or more sounds included in the surrounding sound, based on the analysis by the frequency analysis unit, each of the one or more sounds being in a frequency band where a sound pressure is greater than or equal to a predetermined threshold value; a phase curve calculation unit that calculates, for each of the one or more vehicle sound candidates, a phase curve; and a vehicle count determination unit that classifies the one or more phase curves into at least one group, based on shapes of the one or more phase curves, and determines a total number of the at least one group as the number of the nearby vehicles. | 12-20-2012 |
20130009791 | VEHICLE DIRECTION IDENTIFICATION DEVICE, VEHICLE DIRECTION IDENTIFICATION METHOD AND PROGRAM THEREFOR - A vehicle direction identification device includes: a frequency analysis unit which analyzes amplitude or phase of surrounding sound in each analysis section; a sound source direction identification unit which identifies a sound source direction included in the surrounding sound for each analysis section; a vehicle identification information storage unit which stores first vehicle identification information including a first threshold value; a first vehicle identification unit which calculates a rate of occurrence of each sound source direction and identifies the sound source direction whose rate of occurrence is equal to or exceeds the first threshold value; a second vehicle identification information calculation unit which calculates second vehicle identification information including a second threshold value smaller than the first threshold value; and a second vehicle identification unit which identifies the sound source direction whose rate of occurrence is equal to or exceeds the second threshold value. | 01-10-2013 |
20130010980 | VEHICLE DIRECTION IDENTIFICATION DEVICE, VEHICLE DIRECTION IDENTIFICATION METHOD AND PROGRAM THEREFOR - A vehicle direction identification device includes: a frequency analysis unit which analyzes phase of the surrounding sound in each analysis section specified by predetermined frequency regions and time intervals; a sound source direction identification unit which identifies a sound source direction indicating a direction of a sound included in the vehicle sound for each analysis section; a reflection information storage unit which stores (i) state information relating to rates of occurrence each of which are a count of the analysis sections of a corresponding one of the sound source directions, and (ii) reflection patterns each of which includes an estimated vehicle direction which is a vehicle direction associated with a set of the state information; and a vehicle direction identification unit which identifies a vehicle direction by checking the rates of occurrence obtained from an identification result by the sound source direction identification unit against one of the reflection patterns. | 01-10-2013 |
20130131521 | CONCENTRATION PRESENCE/ABSENCE DETERMINING DEVICE AND CONTENT EVALUATION APPARATUS - A concentration presence/absence determining device includes: a brain blood flow volume obtaining unit configured to obtain a brain blood flow volume of the user; a varying threshold obtaining unit configured to obtain a varying threshold that is a value smaller than the brain blood flow volume of the user at a base time; and an determining unit configured to determine that the user concentrates, when the brain blood flow volume obtained by the brain blood flow volume obtaining unit falls below the varying threshold obtained by the varying threshold obtaining unit. | 05-23-2013 |
Patent application number | Description | Published |
20090272562 | METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD - An object of an aspect of the present invention is to provide a method of producing a circuit board that allows highly accurate preservation of the circuit profile and gives a circuit having a desired depth in preparation of a fine circuit by additive process. | 11-05-2009 |
20090272564 | METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD - An object of an aspect of the present invention is to provide a method of producing a circuit board that allows highly accurate preservation of the circuit profile and gives a circuit having a desired depth in preparation of a fine circuit by additive process. | 11-05-2009 |
20110247860 | METHOD OF PRODUCING CIRCUIT BOARD, AND CIRCUIT BOARD OBTAINED USING THE MANUFACTURING METHOD - One aspect of the present invention resides in a method of producing a circuit board, including a film-forming step of forming a resin film on a surface of an insulative substrate; a circuit pattern-forming step of forming a circuit pattern portion by forming a recessed portion having a depth equal to or greater than a thickness of the resin film, with an outer surface of the resin film serving as a reference; a catalyst-depositing step of depositing a plating catalyst or a precursor thereof on a surface of the circuit pattern portion and a surface of the resin film; a film-separating step of removing the resin film from the insulative substrate; and a plating step of forming an electroless plating film only in a region where the plating catalyst or the precursor thereof remains after the resin film is separated. | 10-13-2011 |
20110281138 | METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAINED USING THE METHOD,METHOD OF CONNECTING SEMICONDUCTOR CHIPS, THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE, AND METHOD OF PRODUCING THE SAME - One aspect of the present invention is a method of mounting a semiconductor chip having: a step of forming a resin coating on a surface of a path connecting a bonding pad on a surface of a semiconductor chip and an electrode pad formed on a surface of an insulating base material; a step of forming, by laser beam machining, a wiring gutter having a depth that is equal to or greater than a thickness of the resin coating along the path for connecting the bonding pad and the electrode pad; a step of depositing a plating catalyst on a surface of the wiring gutter; a step of removing the resin coating; and a step of forming an electroless plating coating only at a site where the plating catalyst remains. Another aspect of the present invention is a three-dimensional structure in which a wiring is formed on a surface, wherein, on the surface of the three-dimensional structure, a recessed gutter for wiring is formed, extending between mutually intersecting adjacent faces of the three-dimensional structure, and wherein at least a part of a wiring conductor is embedded in the recessed gutter for wiring. | 11-17-2011 |
20120206891 | CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON CIRCUIT BOARD - A circuit board H | 08-16-2012 |
20120285736 | METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD - The present invention relates to a method of producing a multilayer circuit board including: a film-forming step of forming a swellable resin film on the surface of an insulative substrate, a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the swellable resin film on the external surface of the film, a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves and the surface of the swellable resin film, a film-separating step of swelling the swellable resin film with a particular liquid and then separating the swollen resin film from the insulative substrate surface, and a plating processing step of forming an electrolessly plated film only in the region where the plating catalyst or the plating catalyst formed from the plating catalyst precursor remains unseparated after separation of the film. | 11-15-2012 |
20120292083 | METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD - The present invention relates to a method of producing a circuit board, comprising: a film-forming step of forming a resin film on the surface of an insulative substrate; a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the resin film on the external surface of the resin film; a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves on the insulative substrate and the surface of the resin film; a film-removing step of removing the resin film; and a plating processing step of electroless-plating the insulative substrate after removal of the resin film, wherein a partial reinforcing structure is formed in a region of the circuit groove in the circuit groove-forming step. | 11-22-2012 |
20130056247 | WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICONDUCTOR DEVICE, WIRING BOARD, MEMORY CARD, ELECTRIC DEVICE, MODULE AND MULTILAYER CIRCUIT BOARD - A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device | 03-07-2013 |
20130200522 | METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAINED USING THE METHOD, METHOD OF CONNECTING SEMICONDUCTOR CHIPS, THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE, AND METHOD OF PRODUCING THE SAME - A method of mounting a semiconductor chip includes: forming a resin coating on a surface of a path connecting a bonding pad on a surface of a semiconductor chip and an electrode pad formed on a surface of an insulating base material; forming, by laser beam machining, a wiring gutter having a depth that is equal to or greater than a thickness of the resin coating along the path for connecting the bonding pad and the electrode pad; depositing a plating catalyst on a surface of the wiring gutter; removing the resin coating; and forming an electroless plating coating only at a site where the plating catalyst remains. | 08-08-2013 |
20130265729 | ELECTRONIC COMPONENTS ASSEMBLY - The present invention relates to electronic components assembly for electrically connecting electronic components to each other, wherein a wiring formed on a surface of a first electronic component and a wiring formed on a surface of a second electronic component face each other, and are bonded to each other with an electric conductor interposed therebetween, so as to electrically connect the first electronic component and the second electronic component. The electric conductor is a resin composition containing solder or conductive filler. | 10-10-2013 |
20130319735 | METAL-CLAD LAMINATE AND PRINTED WIRING BOARD - A metal-clad laminate of the present invention comprises an insulating layer, and a metal layer that is present at least on one surface side of the insulating layer. The insulating layer is a laminate of at least three layers: a center layer, a first resin layer that is present on one surface side of the center layer, and a second resin layer that is present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a respective resin composition. The elastic modulus of the cured product of the resin composition contained in the center layer is lower than the elastic moduli of both the cured product of the resin composition contained in the first resin layer and the cured product of the resin composition contained in the second resin layer. | 12-05-2013 |
20130337188 | RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD - The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ∈1 represents an absorbance coefficient per unit weight of a resin film | 12-19-2013 |
20140090876 | METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAINED USING THE METHOD, METHOD OF CONNECTING SEMICONDUCTOR CHIPS, THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE, AND METHOD OF PRODUCING THE SAME - A three-dimensional structure in which a wiring and a pad part are provided on a surface is provided. A recessed gutter for wiring and a hole for the pad part having a depth that is greater than a thickness of the recessed gutter for wiring are provided on the surface of the three-dimensional structure. The hole for the pad part is provided in succession with the recessed gutter for wiring. At least a part of a wiring conductor is embedded in the recessed gutter for wiring and in the hole for the pad part. | 04-03-2014 |
20140097004 | METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAINED USING THE METHOD, METHOD OF CONNECTING SEMICONDUCTOR CHIPS, THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE, AND METHOD OF PRODUCING THE SAME - A three-dimensional structure in which a wiring is provided on a surface is provided. At least a part of the surface of the three-dimensional structure includes an insulating layer containing filler. A recessed gutter for wiring is provided on the surface of the three-dimensional structure, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring. | 04-10-2014 |
20140182887 | THREE-DIMENSIONAL STRUCTURE FOR WIRING FORMATION - One aspect of the present invention is a three-dimensional structure that has a concave-convex form including a gutter for wiring having at least partially a width of 20 μm or less, wherein at least a part of a wiring conductor is embedded in the gutter for wiring, and a wiring that extends in such a manner as to creep along the concave-convex form is provided. | 07-03-2014 |
20140183751 | THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE - One aspect of the present invention is a three-dimensional structure in which a wiring is formed on a surface, the three-dimensional structure having an insulating resin layer that contains a filler formed from at least one element selected from typical non-metal elements and typical metal elements, wherein a recessed gutter for wiring is formed on a surface of the insulating resin layer, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring. | 07-03-2014 |
20140191406 | MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR DEVICE - One aspect of the present invention resides in a manufacturing method for a semiconductor package, including a covering step of forming a covering insulating layer that covers the surface of a semiconductor element, a film-forming step of forming a resin film on the surface of the covering insulating layer, a circuit pattern-forming step of forming a circuit pattern portion including recesses reaching the surfaces of electrodes of the semiconductor element and a circuit groove having a desired shape and a desired depth, a catalyst-depositing step of depositing a plating catalyst or a precursor thereof on the surface of the circuit pattern portion, a film-separating step of separating the resin film from the covering insulating layer, and a plating processing step of forming a circuit electrically connected to the electrodes, by applying electroless plating to the covering insulating layer, from which the resin film is separated. | 07-10-2014 |
20150034366 | CIRCUIT BOARD - One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface roughness Ra of 0.5 μm or less, and the conductor is at least partially embedded in a wiring groove formed in the surface of the insulating base substrate. | 02-05-2015 |
20150035202 | MANUFACTURING METHOD OF MOLDED ARTICLE - The present invention relates to a manufacturing method of a molded article, including: a molded article forming step of forming a molded article by curing a resin composition on a main surface, on the side of a bendable first supporting medium, of a laminated supporting medium obtained by laminating the first supporting medium and a second supporting medium that is harder than the first supporting medium; a second-supporting medium peeling step of peeling the second supporting medium from the first supporting medium after the molded article forming step; and a first-supporting medium peeling step of peeling the first supporting medium from the molded article while bending the first supporting medium after the second-supporting medium peeling step. The shape of the first supporting medium can be maintained at a curing temperature at which the resin composition is cured in the molded article forming step. | 02-05-2015 |
20150037589 | RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATED BOARD AND PRINTED WIRING BOARD - The present invention relates to a resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less. | 02-05-2015 |
Patent application number | Description | Published |
20090314020 | INDOOR UNIT FOR AIR CONDITIONER - An indoor unit for a multi-directional air supply air conditioner capable of performing at least a heating operation includes: an indoor fan ( | 12-24-2009 |
20100300141 | REFRIGERATION APPARATUS - An air-conditioning apparatus uses carbon dioxide as a refrigerant, and includes comprises a two-stage-compression-type compression mechanism, a heat source-side heat exchanger, an expansion mechanism, a usage-side heat exchanger, and an intercooler. The intercooler uses air as a heat source. The intercooler is configured and arranged to cool refrigerant flowing through an intermediate refrigerant tube that draws refrigerant discharged from the first-stage compression element into the second-stage compression element. The intercooler is integrated with the heat source-side heat exchanger to form an integrated heat exchanger, with the intercooler disposed in an upper part of the integrated heat exchanger. | 12-02-2010 |
20110011126 | HEAT EXCHANGER - A heat exchanger includes heat transfer tubes forming one or more refrigerant passages, and a plurality of plate-shaped fins aligned and stacked at a predetermined spacing with the heat transfer tubes passing through in a substantially perpendicular manner. A relationship between a center-to-center distance S between an adjacent pair of heat transfer tubes and an outside diameter D of the heat transfer tubes is 2.501-20-2011 | |
20110132589 | HEAT EXCHANGER GROOVED TUBE - A heat exchanger grooved tube is made of a copper alloy having a 0.2% proof stress of greater than or equal to 40 N/mm | 06-09-2011 |
20120073786 | CEILING-MOUNTED AIR CONDITIONING UNIT - A ceiling-mounted air conditioning unit includes an indoor heat exchanger disposed on an outer peripheral side of a centrifugal blower. The indoor heat exchanger includes plural heat transfer tubes arranged in multiple stages in a vertical direction and in three rows in a flow direction of air blown out from the blower and are connected to a refrigerant inlet of the indoor heat exchanger in a case where the indoor heat exchanger functions as an evaporator of the refrigerant during cooling, plural liquid refrigerant tubes connected to the heat transfer tubes in a first row on a most upwind side, second row-side gas refrigerant tubes connected to a refrigerant outlet of the indoor heat exchanger during cooling and connected to the heat transfer tubes in a second row, and third row-side gas refrigerant tubes connected to the heat transfer tubes in a third row on a most downwind side. | 03-29-2012 |
20130284416 | HEAT EXCHANGER AND AIR CONDITIONER - A heat exchanger has a plurality of flat tubes, and a plurality of fins in which the flat tubes are inserted in an orthogonal direction. Each of the fins includes a fin body, and an attachment portion to which the flat tube is attached. The fin body includes an insertion region in which the flat tube is inserted, and an extension region on the downwind side of the insertion region. A spacer configured to keep a space between the fins is formed in each of the insertion region and the extension region by cutting and bending part of the fin. The spacer of the extension region is straight behind the spacer of the insertion region on the downwind side. The spacer of the insertion region is configured such that the spacer body is tilted with respect to an airflow. | 10-31-2013 |
20130299141 | HEAT EXCHANGER AND AIR CONDITIONER - A heat exchanger includes flat tubes and fins. The plate-like fins are spaced from one another by a predetermined distance in the direction in which the flat tubes extend. The flat tubes are inserted in pipe insertion portions of the fins. In the fins, parts of the fins between vertically adjacent ones of the flat tubes are heat transfer parts. Each of the heat transfer parts includes protrusions and louvers. The protrusions are located at a windward region of the heat transfer part and formed by making the heat transfer part protrude in an inverted V shape. The louvers are located in a leeward region of the heat transfer part and bend out from the heat transfer part. | 11-14-2013 |
20130299152 | HEAT EXCHANGER AND AIR CONDITIONER - A fin of a heat exchanger includes: a plurality of intermediate plates arranged one above another and dividing a space between adjacent ones of flat tubes into air passages; a plurality of tube insertion portions each provided between vertically adjacent ones of the intermediate plates, with an upwind side thereof being open such that a corresponding one of the flat tubes is inserted therein; a vertically extending downwind plate that is continuous with downwind ends of the plurality of intermediate plates arranged one above another; and a plurality of upwind plates extending further toward an upwind side than the flat tubes from upwind side ends of the intermediate plates. Each of the upwind plates is provided with at least one upwind side heat-transfer portion which projects toward the air passages. | 11-14-2013 |
20130299153 | HEAT EXCHANGER AND AIR CONDITIONER - Each of a plurality of heat-transfer portions has a plurality of protrusions which are protruded toward an air passage and extend in a direction intersecting with an airflow direction. The protrusions are arranged in the airflow direction. | 11-14-2013 |
20140102131 | OUTDOOR UNIT OF REFRIGERATION SYSTEM - In an outdoor unit, first through third intermediate heat exchangers and an outdoor heat exchanger are disposed to stand along an air inlet of an outdoor casing, and the outdoor heat exchanger is located above the first through third intermediate heat exchangers. | 04-17-2014 |
20150083377 | HEAT EXCHANGER - A heat exchanger includes a plurality of principal heat exchange sections and auxiliary heat exchange sections. Each of the auxiliary heat exchange sections is in series connection to a corresponding one of the principal heat exchange sections. Of tube number ratios of the number of the flat tubes constituting each of the heat exchange sections to the number of the flat tubes constituting a corresponding one of the auxiliary heat exchange sections, the first principal heat exchange sections which is the lowermost one has the smallest tube number ratio. Consequently, discharge of liquid refrigerant from a lower portion of the first principal heat exchange section is accelerated during defrosting, thereby shortening the time required for defrosting. | 03-26-2015 |