Patent application number | Description | Published |
20090167335 | Probe Card - Provided is a probe card capable of surely bringing probes into contact with a contact object regardless of a temperature environment of a test. To achieve the object, the probe card includes a plurality of probes that are made of a conductive material and come into contact with electrode pads of a semiconductor wafer to input or output an electric signal; a probe head that houses and holds the probes; a substrate that has a wiring pattern corresponding to the circuitry; and a space transformer that is stacked on the probe head, changes a space of the wiring pattern of the substrate and thus relays wires, and has electrode pads provided on a surface on a side opposed to the probe head in association with the relayed wires. Both ends of the probes come into contact with portions near the centers of the electrodes pads of the semiconductor wafer and the space transformer under an environment having an average temperature of a lowest temperature and a highest temperature in testing the semiconductor wafer. | 07-02-2009 |
20090219043 | Probe Card - A probe card includes probes that are made of a conductive material and come into contact with a semiconductor wafer to receive or output an electric signal; a probe head that holds the probes; a substrate that has a wiring pattern corresponding to a circuit structure for generating a signal for a test; a reinforcing member that reinforces the substrate; an interposer that is stacked on the substrate for connection of wires of the substrate; a space transformer that is stacked between the interposer and the probe head and transforms intervals among the wires; and a plurality of first post members that have a height greater than the thickness of the substrate, and are embedded in a portion of the substrate on which the interposer is stacked. | 09-03-2009 |
20100001748 | Probe Card - A probe card includes a flat wiring board having a wiring pattern corresponding to a circuit structure for generating a signal for a test, an interposer that is stacked on the wiring board and relays wirings of the wiring board, a space transformer that is stacked on the interposer and fastened thereto by an adhesive, transforms a space between the wirings relayed by the interposer, and leads the wirings out to a surface opposite a surface facing the interposer, and a probe head that is stacked on the space transformer and houses and holds a plurality of probes. | 01-07-2010 |
20100001752 | PARALLELISM ADJUSTING MECHANISM OF PROBE CARD - A parallelism adjusting mechanism of a probe card is provided. The parallelism adjusting mechanism can bring probes held by a probe card into uniform contact with a wafer even if a parallelism between a mounting reference surface for the probe card and the wafer as a test object is lost. To achieve this purpose, specifically, to adjust a parallelism of a probe card ( | 01-07-2010 |
20100052707 | Probe Card - A probe card includes probes that come into contact with a semiconductor wafer to receive or output an electric signal; a probe head that holds the probes; a substrate that has a wiring pattern corresponding to a circuit structure for generating a signal for a test; a reinforcing member that reinforces the substrate; an interposer that is stacked on the substrate and includes a housing having connection terminals resilient in an axial direction thereof and hole portions each housing one of the connection terminals; and a space transformer that is stacked between the interposer and the probe head and transforms intervals among the wires. | 03-04-2010 |
20140162503 | CONTACT STRUCTURE UNIT - A contact structure unit that achieves electrical continuity between a substrate, which includes a plurality of electrodes, and a contact object includes a first-type contact-carrying member including a contact portion which makes contact with the contact object; includes a plurality of second-type contact-carrying members each of which includes a leading end portion formed at one end portion and making contact with the electrodes and each of which makes contact with the first-type contact-carrying member at the other end portion; and includes a plurality of coil springs each of which is disposed between the contact portion and the leading end portions and each of which biases the contact portion and the leading end portions. | 06-12-2014 |
20140247065 | PROBE UNIT - The probe unit includes probe groups of two or more contact probes to be in contact with one electrode of a contact target body on a side of one end in a longitudinal direction and the respective contact probes are to be in contact with separate electrodes of a board on a side of another end. The contact probe includes an end portion arranged on the side of one end, having nail portions in a tapered end shape, and brought into contact with the one electrode at the nail portions; a second contact unit arranged on the side of another end, and to be in contact with a corresponding electrode of the board; and a coil spring arranged between the end portion and the second contact unit, and biasing the end portion and the second contact unit. | 09-04-2014 |
20150139722 | SOCKET ATTACHMENT STRUCTURE AND SPRING MEMBER - A socket attachment structure for attaching a socket to a substrate, the socket including a plurality of contact probes that respectively contact the substrate and a contacted body at both longitudinal direction ends thereof, a probe holder that accommodates and holds therein the plurality of contact probes according to a predetermined pattern, and a holder member provided around the probe holder, includes: a plurality of support members that extend out from a principal plane of the substrate and are respectively inserted through insertion holes provided in the holder member; and a spring member that is attached to the plurality of support members in a state of biasing the holder member placed on the substrate towards the substrate. | 05-21-2015 |