Patent application number | Description | Published |
20080199806 | PATTERNING PROCESS AND RESIST COMPOSITION - A pattern is formed by applying a positive resist composition comprising a polymer comprising 7-oxanorbornane ring-bearing recurring units and acid labile group-bearing recurring units and an acid generator onto a substrate to form a resist film, heat treating and exposing the resist film to radiation, heat treating and developing the resist film with a developer, and causing the resist film to crosslink and cure with the aid of acid and/or heat. A second resist pattern is then formed in the space area of the first resist pattern. The double patterning process reduces the pitch between patterns to one half. | 08-21-2008 |
20090053651 | PATTERNING PROCESS - A pattern is formed by applying a first positive resist composition onto a substrate, heat treatment, exposure, heat treatment and development to form a first resist pattern; causing the first resist pattern to crosslink and cure by irradiation of high-energy radiation of up to 180 nm wavelength or EB; further applying a second positive resist composition onto the substrate, heat treatment, exposure, heat treatment and development to form a second resist pattern. The double patterning process reduces the pitch between patterns to one half. | 02-26-2009 |
20100209849 | PATTERN FORMING PROCESS AND RESIST-MODIFYING COMPOSITION - A patterning process includes (1) coating and baking a first positive resist composition to form a first resist film, exposing, post-exposure baking, and alkali developing to form a first resist pattern, (2) applying a resist-modifying composition to the first resist pattern and heating to modify the first resist pattern, (3) coating and baking a second positive resist composition to form a second resist film, exposing, post-exposure baking, and alkali developing to form a second resist pattern. The modified first resist film has a contact angle with pure water of 50°-85°. | 08-19-2010 |
20100248493 | PHOTOMASK BLANK, PROCESSING METHOD, AND ETCHING METHOD - A photomask blank is provided comprising a transparent substrate, a single or multi-layer film including an outermost layer composed of chromium base material, and an etching mask film. The etching mask film is a silicon oxide base material film formed of a composition comprising a hydrolytic condensate of a hydrolyzable silane, a crosslink promoter, and an organic solvent and having a thickness of 1-10 nm. The etching mask film has high resistance to chlorine dry etching, ensuring high-accuracy processing of the photomask blank. | 09-30-2010 |
20120135350 | POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS - A positive resist composition comprising (A) a polymer comprising recurring units of a specific structure adapted to generate an acid in response to high-energy radiation and acid labile units, the polymer having an alkali solubility that increases under the action of an acid, and (B) a sulfonium salt of a specific structure exhibits a high resolution in forming fine size patterns, typically trench patterns and hole patterns. Lithographic properties of profile, DOF and roughness are improved. | 05-31-2012 |
20130209922 | CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND PATTERN FORMING PROCESS - A polymer comprising recurring units having an acid-eliminatable group on a side chain and aromatic ring-bearing cyclic olefin units is used to formulate a chemically amplified negative resist composition. Any size shift between the irradiated pattern and the formed resist which can arise in forming a pattern including isolated feature and isolated space portions is reduced, and a high resolution is obtained. | 08-15-2013 |
Patent application number | Description | Published |
20100055621 | Patterning process - There is disclosed a patterning process including steps of at least: forming a photoresist film on a substrate; exposing the photoresist film to a high energy beam; developing by using a developer; forming a photoresist pattern; and then forming a spacer on the photoresist pattern sidewall, thereby forming a pattern on the substrate, a patterning process, wherein at least the photoresist pattern having the hardness of 0.4 GPa or more or the Young's modulus of 9.2 GPa or more as a film strength is formed, and a pattern is formed on the substrate by forming a silicon oxide film as the spacer on the photoresist pattern sidewall. There can be provided a patterning process without causing a deformation of a resist pattern and an increase in LWR at the time of forming a silicon oxide film on a photoresist pattern. | 03-04-2010 |
20150086908 | PHOTOMASK BLANK AND METHOD FOR MANUFACTURING PHOTOMASK BLANK - The present invention relates to a photomask blank obtained by forming a resist film after performing a silylation process on a silicon-containing inorganic film and provides a method for manufacturing a photomask blank having at least a silicon-containing inorganic film over a transparent substrate and a resist film on the silicon-containing inorganic film, comprising: forming the silicon-containing inorganic film such that a surface that will contact the resist film has an oxygen concentration not less than 55 atomic percent and not more than 75 atomic percent; performing a silylation process after forming the silicon-containing inorganic film; and then forming the resist film by application. The method can inhibit generation of defects due to resist residues or the like after development. | 03-26-2015 |
20150086909 | METHOD FOR MANUFACTURING PHOTOMASK BLANK - The present invention relates to a photomask blank obtained by forming a resist film after performing a silylation process on a silicon-containing inorganic film and provides a method for manufacturing a photomask blank having at least a silicon-containing inorganic film over a transparent substrate and a resist film on the inorganic film, comprising: forming the silicon-containing inorganic film; heat treating the formed silicon-containing inorganic film at a temperature more than 200° C. under an atmosphere containing oxygen; performing a silylation process after the heat treatment; and then forming the resist film by application. The method can inhibit generation of defects due to resist residues or the like after development. | 03-26-2015 |
Patent application number | Description | Published |
20130069320 | Seal Structure for Electronic Control Device - Seal structure for electronic control device having a seal portion formed between an outer peripheral surface of a connector and an inner peripheral surface of a housing, and provided with a seal groove and a protruding line. The seal portion has a deep bottom portion having a seal groove, a shallow bottom portion whose seal groove is shallower than that of the deep bottom portion, and a connecting portion connecting these deep and shallow bottom portions. Width of the seal groove of the shallow bottom portion is set to be larger than the deep bottom portion As a position of a seal groove of the connecting portion gets closer to the deep bottom portion from the shallow bottom portion, depth of the seal groove of the connecting portion is set to be gradually larger, and width of the seal groove of the connecting portion is set to be gradually smaller. | 03-21-2013 |
20130070432 | Seal Structure for Electronic Control Device - A seal structure for an electronic control device having a circuit board housed in a watertight space a housing that is formed by fitting a plurality of fitting members together, has first and second seal portions which are formed at a fitting surface portion between the fitting members that are fitted together. One side of a pair of the fitting members of each of the first and second seal portions is provided with a seal groove, the other side is provided with a protruding line. An auxiliary seal groove and an auxiliary protruding line are formed on opposing surfaces of the seal groove and the protruding line at a merged part where the first and second seal portions meet each other. The auxiliary seal groove and the auxiliary protruding line continuously extend from the seal groove up to an end surface of the protruding line. | 03-21-2013 |
20130250521 | ELECTRONIC CONTROL APPARATUS - An electronic control apparatus includes housing members, and a circuit board. At least one of the housing members is opposed to a heat-generating region which is heated by the heat-generating electronic component. A heat radiating portion of the housing member includes a convex portion protruding from an inner wall surface at a location opposed to the heat-generating region, and a concave portion opened to an outer wall surface at a location shifted from the convex portion in a thickness direction. The convex portion is close to the heat-generating region through a clearance. The concave portion has a lateral wall formed in a tapered shape such that an opening area of the concave portion is larger than a bottom area of the concave portion. A thickness of the heat radiating portion is smaller than a thickness of a region peripheral to the heat radiating portion in the housing member. | 09-26-2013 |
20140080329 | ELECTRONIC CONTROL DEVICE - An electronic control device including a circuit board, a connector with connector pins having a board connecting portion at which the connector pins are electrically connected with the circuit board, a pair of housing members accommodating the circuit board and the connector therebetween, a waterproof seal portion through which connection between the connector and the pair of housing members and connection between the pair of housing members are provided in a fluid-tight manner, the waterproof seal portion including a connector-side waterproof seal portion disposed between the connector and one of the pair of housing members which is opposed to the board connecting portion of the connector pins, and a barrier portion disposed between the board connecting portion of the connector pins and the connector-side waterproof seal portion. | 03-20-2014 |