Patent application number | Description | Published |
20080231693 | OPTICAL DEVICE, CAMERA MODULE, MOBILE PHONE, DIGITAL STILL CAMERA, AND MEDICAL ENDOSCOPE - An optical device includes an optical element and a transparent element. The optical element includes an image pickup region provided on a main surface of a semiconductor substrate for outputting a signal according to incident light, a peripheral circuit region provided around the image pickup region for transmitting a signal received from the image pickup region, and an electrode pad provided on a part of an edge of the main surface of the semiconductor substrate for outputting a signal transmitted through the peripheral circuit region. The transparent member is bonded to the semiconductor substrate so that the transparent member covers the image pickup region and that an end face of the transparent member is located between the electrode pad and the image pickup region when viewed two-dimensionally. The transparent member is positioned so that a distance between the end face and the image pickup region is 0.04 mm or more. | 09-25-2008 |
20080303107 | OPTICAL DEVICE AND METHOD FOR FABRICATING THE SAME, CAMERA MODULE USING OPTICAL DEVICE, AND ELECTRONIC EQUIPMENT MOUNTING CAMERA MODULE - An optical device includes a light receiving element chip having: an active region formed on a principal plane of a substrate and made by arranging a plurality of light receiving pixels; a circuit region disposed around an outer circumference of the active region; a penetrating conductor provided to penetrate the substrate in the thickness direction of the substrate; and an external connection terminal provided on a back surface of the substrate facing the principal plane thereof and connected to the penetrating conductor. The optical device further includes a microlens, a planarization film, and a transparent protective film formed on the planarization film. | 12-11-2008 |
20090045495 | SEMICONDUCTOR DEVICE WITH SIDE TERMINALS - Side terminals | 02-19-2009 |
20090184335 | OPTICAL SEMICONDUCTOR DEVICE - An optical semiconductor device includes: a package having a bottom portion and a sidewall portion; a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface fixed to the bottom portion of the package; a transparent member fixed to the semiconductor chip so as to cover the optical element; and a sealing resin filling a space between the package and the semiconductor chip. The sidewall portion has in an upper part thereof an overhang portion that projects toward inside of the package. The transparent member is exposed from a window portion formed by the overhang portion. | 07-23-2009 |
20090283887 | OPTICAL SEMICONDUCTOR DEVICE - An optical semiconductor device of the present invention includes a semiconductor chip ( | 11-19-2009 |
20100176476 | OPTICAL DEVICE, SOLID-STATE IMAGING DEVICE, AND METHOD - An optical device including: an optical element including a light-receiving unit as a part of a top surface; a transparent member deposited on the optical element to cover the light-receiving unit; and a sealant formed to seal around the transparent member. The transparent member includes: a first protrusion formed in an upper region of a side surface of the transparent member such that a step is created on the side surface; and a tapered surface on an end surface of the first protrusion, the tapered surface being sloped such that a to cross-sectional area of the transparent member decreases towards an upper side of the transparent member. The sealant covers entirely at least a part of the side surface of the transparent member, the part of the side surface being located below the first protrusion. | 07-15-2010 |
20100181636 | OPTICAL DEVICE, SOLID-STATE IMAGING DEVICE, AND METHOD OF MANUFACTURING OPTICAL DEVICE - An optical device includes the following structures. An optical element includes a light-receiving element at an upper surface of the optical element. A transparent member is disposed on the upper surface to cover the light-receiving element. A case includes a bottom wall, a side wall protruding from an outer edge of the bottom wall, and a through-hole penetrating the bottom wall. A sealant is filled in a space defined by surfaces of the optical element, the transparent member, and the case, and also in the through-hole. Here, the optical element and the transparent member are stored in a region between the bottom wall and the side wall. The sealant is filled to the region to seal the space. The bottom wall is segmented into: a center region in which the optical element is placed; and a peripheral region outside the center region. The through-hole is arranged in the peripheral region. | 07-22-2010 |
20100193240 | DEVICE - A device includes: a package having a bottom and a side wall surrounding the bottom; an element adhered to the bottom of the package; an internal contact formed inside the package; a resin encapsulation material with which a space between the package and the element is filled; and a coating formed to cover an end surface of the internal contact near the element, and made of a material whose thermal expansion coefficient is greater than or equal to the thermal expansion coefficient of the package and less than the thermal expansion coefficient of the resin encapsulation material. | 08-05-2010 |
20110163328 | OPTICAL SEMICONDUCTOR DEVICE - An optical semiconductor device includes: a package having a bottom portion and a sidewall portion; a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface fixed to the bottom portion of the package; a transparent member fixed to the semiconductor chip so as to cover the optical element; and a sealing resin filling a space between the package and the semiconductor chip. The sidewall portion has in an upper part thereof an overhang portion that projects toward inside of the package. The transparent member is exposed from a window portion formed by the overhang portion. | 07-07-2011 |
20110285003 | OPTICAL DEVICE AND METHOD FOR MANUFACTURING OPTICAL DEVICE, AND CAMERA MODULE AND ENDOSCOPE MODULE EQUIPPED WITH OPTICAL DEVICE - An optical device is equipped with a light receiving region | 11-24-2011 |