Patent application number | Description | Published |
20090175021 | Electromagnetic-wave suppressing material, electromagnetic-wave suppressing device, and electronic apparatus - An electromagnetic-wave suppressing material is provided. The electromagnetic-wave suppressing material includes an ionic liquid and nanometer-order particles mixed with the ionic liquid, where 10 wt % or more of the nanometer-order particles is mixed with respect to 100 wt % of the ionic liquid. | 07-09-2009 |
20100139971 | ELECTROMAGNETIC WAVE SUPPRESSION SHEET, DEVICE, AND ELECTRONIC APPARATUS - Disclosed is an electromagnetic wave suppression sheet obtained by mixing metallic magnetic particles into a resin and formed into a sheet shape. In the electromagnetic wave suppression sheet, a coercive force is 320 [A/m] or more and a saturation magnetization is 0.35 [Wb/m | 06-10-2010 |
20100200796 | COMPOSITION FOR ELECTROMAGNETIC WAVE SUPPRESSION AND HEAT RADIATION AND METHOD FOR MANUFACTURING COMPOSITION FOR ELECTROMAGNETIC WAVE SUPPRESSION AND HEAT RADIATION - A composition for electromagnetic wave suppression and heat radiation includes: a matrix composed of a high molecular material or a low molecular material; and a magnetic particle filled in the matrix upon mixing a magnetic powder having a relation of {(tap density)/density}≧0.58 with the matrix. | 08-12-2010 |
20110006864 | HIGH FREQUENCY COUPLER AND COMMUNICATION DEVICE - A high frequency coupler includes a ground, a first coupling electrode connected via a first resonator unit to an input and output terminal of a communication circuit, and one or more second coupling electrodes connected via a second resonator unit designed utilizing a ground to a ground terminal of the communication circuit. | 01-13-2011 |
20110234014 | Antenna module and electronic apparatus - Provided is an antenna module including: an antenna coil having a first pattern width; a magnetic sheet, which includes a first surface on which the antenna coil is to be arranged, and has a first distance being a distance on the first surface between an edge of the first surface and the antenna coil, the first distance being twice or more as large as the first pattern width; and a conductor, which includes a second surface on which the magnetic sheet is to be arranged while a surface opposite to the first surface of the magnetic sheet faces the second surface, and has a second distance being a distance on the second surface between an edge of the second surface and the antenna coil, the second distance being equal to or larger than the first distance. | 09-29-2011 |
20120062435 | MAGNETIC SHEET, ANTENNA MODULE, ELECTRONIC APPARATUS, AND MAGNETIC SHEET MANUFACTURING METHOD - A magnetic sheet for use with an antenna module is provided. The magnetic sheet may have a magnetically permeable layer having a plurality of randomly shaped pieces such that the magnetic sheet is configured to affect a resonance frequency of the antenna module. At least one of the randomly shaped pieces of the magnetic sheet does not have a rectangular or triangular shape. | 03-15-2012 |
20130014984 | ELECTROMAGNETIC WAVE ABSORBER, METHOD OF PRODUCING THE SAME, FLEXIBLE PRINTED WIRING BOARD AND ELECTRONIC DEVICEAANM Iida; HironoriAACI KanagawaAACO JPAAGP Iida; Hironori Kanagawa JPAANM Yamanoi; ShunAACI KanagawaAACO JPAAGP Yamanoi; Shun Kanagawa JPAANM Minatoya; MachikoAACI TokyoAACO JPAAGP Minatoya; Machiko Tokyo JPAANM Tabata; SeiichiroAACI KanagawaAACO JPAAGP Tabata; Seiichiro Kanagawa JPAANM Yamada; ShinichiroAACI KanagawaAACO JPAAGP Yamada; Shinichiro Kanagawa JPAANM Kanno; MasayoshiAACI KanagawaAACO JPAAGP Kanno; Masayoshi Kanagawa JPAANM Mitsugi; MasakazuAACI KanagawaAACO JPAAGP Mitsugi; Masakazu Kanagawa JPAANM Kato; YoshihiroAACI KanagawaAACO JPAAGP Kato; Yoshihiro Kanagawa JP - Provided is an electromagnetic wave absorber, including a base material and a porous carbon material containing, as a raw material, a plant-based material having a silicon content of 5% by mass or more, in which the porous carbon material has a specific surface area value as measured by the nitrogen BET method of 400 m | 01-17-2013 |
Patent application number | Description | Published |
20080197434 | MAGNETIC MEMORY DEVICE - A magnetic memory device in which an MRAM element is magnetically shielded from large external magnetic fields. The magnetic memory device includes:
| 08-21-2008 |
20090017316 | Prepreg and laminate - A prepreg for a printed wiring board, comprising a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler, and a laminate comprising the above prepreg. | 01-15-2009 |
20120009836 | PREPREG AND LAMINATE - This invention relates to a prepreg having a low thermal expansion coefficient in plane direction and a high rigidity, and more particularly to a prepreg comprising a glass cloth (A), and a resin composition including a cyanate ester resin (B), a non-halogen based epoxy resin (C) and an inorganic filler (D), wherein the glass cloth (A) is characterized that when the weight per 1 m | 01-12-2012 |
20120018072 | METHOD FOR STORING RESIN SOLUTION, AND METHOD FOR PRODUCING PREPREG AND LAMINATE - This invention relates to a method for storing a naphthol aralkyl type cyanate ester resin solution, which is difficult to precipitate due to long term storage in a solution state, and particularly relates to a method for storing a naphthol aralkyl type cyanate ester resin solution (AB), which comprises: preparing (i) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, (ii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, or (iii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A) and a maleimide compound (B), and a solvent, and; storing the resin solution (AB). | 01-26-2012 |
20140015338 | RECEIVING COIL, RECEPTION APPARATUS AND NON-CONTACT POWER TRANSMISSION SYSTEM - Provided is a device including a receiving coil, including a core having a magnetic body, a coil portion in which a wire is wound around the core and which is electromagnetically coupled to an external coil to transmit power, and a non-magnetic body arranged at a predetermined distance from a side face of the coil portion. | 01-16-2014 |
20140329066 | RESIN COMPOSITION, PREPREG, AND LAMINATE - To provide a prepreg resin composition which has good solubility in a solvent and with which moreover a cured product having excellent flame resistance and a low water absorption rate can be made simply and with good reproducibility, and a prepreg and a laminate and a printed wiring board and the like using the same. The prepreg resin composition of the present invention including at least a cyanate compound (A) obtained by cyanation of a phenol-modified xylene formaldehyde resin, an epoxy resin (B), and an inorganic filler. | 11-06-2014 |
20140332159 | METHOD FOR PRODUCING PREPREG AND LAMINATE - This invention relates to a method for storing a naphthol aralkyl type cyanate ester resin solution, which is difficult to precipitate due to long term storage in a solution state, and particularly relates to a method for storing a naphthol aralkyl type cyanate ester resin solution (AB), which comprises: preparing (i) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, (ii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, or (iii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A) and a maleimide compound (B), and a solvent, and; storing the resin solution (AB). | 11-13-2014 |
20140349089 | RESIN COMPOSITION, AND PREPREG AND LAMINATE USING THE SAME - The present invention provides a resin composition with which a laminate, a printed wiring board, and the like that not only have high thermal conductivity but have good moldability with the occurrence of cracks and voids suppressed can be implemented simply and with good reproducibility, and a prepreg, a laminate, a metal foil-clad laminate, and the like using the same. The resin composition of the present invention is a resin composition comprising at least a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), and a second filler (D), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in the range of 1:0.02 to 1:0.2. | 11-27-2014 |
20140377565 | RESIN COMPOSITION, PREPREG, AND LAMINATE - A resin composition of the present invention contains a mixture (A) of at least two of cyanate ester compounds selected from the group consisting of cyanate ester compounds (A1) to (A3) having a specific structural unit, an epoxy resin (B), and an inorganic filler (C). A prepreg of the present invention is obtained by impregnating a base material with the resin composition or applying the resin composition to a base material. Furthermore, a metal foil-clad laminate of the present invention is the laminate comprising the prepreg. Furthermore, a printed wiring board of the present invention contains an insulating layer and a conductor layer formed on a surface of the insulating layer, in which the insulating layer contains the resin composition. | 12-25-2014 |
20150035800 | INFORMATION TERMINAL APPARATUS - According to an embodiment, an information terminal apparatus includes: a display device equipped with a touch panel; a position detecting section configured to detect a position of a material body in a three-dimensional space opposite to a display surface of the display device; and a command generating section configured to generate a predetermined command for causing predetermined processing to be executed, on the basis of touch position information of a touch position on the touch panel by a touch operation on the touch panel and position-in-space information of the material body in the three-dimensional space detected by the position detecting section after the touch panel is touched or in a state of the touch panel being touched. | 02-05-2015 |
20150056454 | RESIN COMPOSITION, PREPREG, AND METAL FOIL-CLAD LAMINATE - Provided are a resin composition that can realize a prepreg, a metal foil-clad laminate and the like high in light reflectance in an ultraviolet region and in a visible light region, small in the reduction in light reflectance due to a heating treatment and a light irradiation treatment, good in peel strength of metal foil, also excellent in heat resistance after moisture absorption, also good in outer appearance, and also excellent in preservation stability, and a prepreg, a metal foil-clad laminate and the like using the same. The resin composition of the present invention contains at least an epoxy-modified silicone compound (A), a branched imide resin (B) having an isocyanurate group and a carboxyl group, a phosphorus curing accelerator (C), titanium dioxide (D) and a dispersant (E). The branched imide resin (B) is preferably at least one selected from the group consisting of an epoxy-modified branched imide resin, an alcohol-modified branched imide resin and an amine-modified branched imide resin. | 02-26-2015 |
20150181707 | RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE AND PRINTED WIRING BOARD - A resin composition capable of achieving a printed wiring board or the like excellent in heat dissipation properties, water absorption properties, copper foil peel strength, and heat resistance after moisture absorption is provided. A prepreg, a laminate, a metal foil clad laminate, a printed wiring board and the like, which use the resin composition are also provided. The resin composition of the present invention having at least an epoxy resin, a cyanate ester compound, and an inorganic filler, wherein the inorganic filler includes at least a surface-treated silicon carbide of a silicon carbide powder having at least a part of the surface treated with an inorganic oxide. | 06-25-2015 |
20150210832 | RESIN SHEET, SUPPORT WITH RESIN LAYER, LAMINATE AND METAL FOIL-CLAD LAMINATE - The present invention provides a resin sheet that exhibits a small reduction in light reflectance due to a heating treatment and a light irradiation treatment with an excellent heat resistance being maintained. The present invention provides a resin sheet including a layer including a resin composition containing an aliphatic epoxy-modified silicone compound (A), a branched imide resin having an isocyanurate group and a carboxyl group (B), titanium dioxide (C) and a wetting and dispersing agent (D). | 07-30-2015 |
Patent application number | Description | Published |
20130045650 | RESIN COMPOSITION, PREPREG, AND LAMINATED SHEET - There is provided a resin composition that, despite the fact that the content of an inorganic filler is on approximately the same level as that of the conventional resins, can provide a cured resin product that has a low coefficient of thermal expansion in a plane direction and possesses excellent heat resistance and flame retardance. The resin composition comprises an epoxy resin (A), a maleimide compound (B), a curing agent (C), and an inorganic filler (D), the epoxy resin (A) being represented by formula (I): | 02-21-2013 |
20130089743 | RESIN COMPOSITION, PREPREG, AND LAMINATED SHEET - There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler. | 04-11-2013 |
20130136930 | RESIN COMPOSITION, PREPREG, AND LAMINATE - There are provided a resin composition for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance, a prepreg prepared using the resin composition, and a laminated sheet and a metal foil-laminated sheet prepared using the prepreg. The resin composition comprises (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by formula (1): | 05-30-2013 |
Patent application number | Description | Published |
20140017502 | RESIN COMPOSITION, PREPREG AND LAMINATE - It is an object to provide a prepreg for a printed laminate that has a low thermal expansion coefficient in the planar direction, excellent drillability, and further excellent heat resistance and flame retardancy, and a laminate and a metal foil-clad laminate. A resin composition according to the present invention includes a molybdenum compound (A); an epoxy resin (B); a curing agent (C); and an inorganic filler (D), wherein a Mohs hardness of the inorganic filler (D) is 3.5 or more, and a content of the inorganic filler (D) is 40 to 600 parts by mass based on 100 parts by mass of a total of resin solid components. | 01-16-2014 |
20140308489 | MOLYBDENUM COMPOUND POWDER, PREPREG, AND LAMINATE - The present invention provides a novel surface-treated molybdenum compound powder and provides a prepreg, a laminate, a metal foil laminate, a printed wiring board, and the like that have a low thermal expansion coefficient in the planar direction, and excellent drillability, heat resistance, and flame retardancy. The surface-treated molybdenum compound powder of the present invention has at least part of the surface thereof coated with an inorganic oxide, and this is used as a filler. | 10-16-2014 |
20150034369 | RESIN COMPOSITION FOR PRINTED WIRING BOARDS - Provided is a resin composition which enables the formation of a roughened surface having a low roughness degree on the surface of an insulation layer in a printed wiring board material when used on the insulation layer regardless of the roughening conditions employed and also enables the formation of a conductive layer having excellent adhesion properties, heat resistance, heat resistance under absorption of moisture, thermal expansion properties and chemical resistance on the roughened surface. A resin composition comprising (A) an inorganic filler that is soluble in an acid, (B) a cyanic acid ester compound and (C) an epoxy resin. | 02-05-2015 |
20150050472 | RESIN COMPOSITION, PREPREG AND LAMINATE - The present invention provides a resin composition which can simply provide, with good reproducibility, a laminate, a printed wiring board, and the like that not only have excellent heat dissipation properties but have good moldability, good mechanical drillability and excellent appearance, and a prepreg, a metal foil-clad laminate, and the like using the same. A resin composition having a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), a second inorganic filler (D), and a molybdenum compound (E), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in a range of 1:0.02 to 1:0.2. | 02-19-2015 |