Patent application number | Description | Published |
20090079983 | Surface inspection device - A surface inspection device includes an illumination optical system that illuminates, with a linearly polarized light, a surface of a wafer where a repeated pattern is formed; an alignment stage that holds the wafer; a pick-up optical system that picks up an image of reflected light from the surface of the wafer; an image storage unit that stores the image picked up by the pick-up optical system; an image processing unit that performs predetermined image processing on the image stored in the image storage unit and detects a defect of the repeated pattern; and an image output unit that outputs the results of the image processing by the image processing unit. The orientation of the transmission axis of a second polarizing plate is set to be inclined at 45 degrees with respect to the transmission axis of a first polarizing plate. | 03-26-2009 |
20090316978 | MANUFACTURING METHOD FOR INSPECTION DEVICE - In a manufacturing method for an inspection device, a distortion measurement step has a first step of a line sensor picking up an image of a linear pattern extending substantially in parallel with a main scanning axis direction to create two-dimensional image data of the linear pattern, and calculating a distortion amount in a sub-scanning axis direction in a two-dimensional image from the created two-dimensional image data of the linear pattern; and a second step of the line sensor picking up an image of an oblique linear pattern extending in an inclined direction with respect to the main scanning axis direction to create two-dimensional image data of the oblique pattern, and calculating a distortion amount in the main scanning axis direction in the two-dimensional image from the created two-dimensional image data of the oblique pattern and the distortion amount in the sub-scanning axis direction calculated in the first step. | 12-24-2009 |
20100177312 | SURFACE INSPECTION METHOD AND SURFACE INSPECTION DEVICE - A surface inspection method inspects a surface of a wafer having a repeated pattern formed by double patterning. The method includes: a first step (S | 07-15-2010 |
20100182603 | Surface Inspection Device - A surface inspection device includes an illumination optical system that illuminates, with a linearly polarized light, a surface of a wafer where a repeated pattern is formed; an alignment stage that holds the wafer; a pick-up optical system that picks up an image of reflected light from the surface of the wafer; an image storage unit that stores the image picked up by the pick-up optical system; an image processing unit that performs predetermined image processing on the image stored in the image storage unit and detects a defect of the repeated pattern; and an image output unit that outputs the results of the image processing by the image processing unit. The orientation of the transmission axis of a second polarizing plate is set to be inclined at 45 degrees with respect to the transmission axis of a first polarizing plate. | 07-22-2010 |
20120122252 | METHOD FOR INSPECTING SUBSTRATE, SUBSTRATE INSPECTION APPARATUS, EXPOSURE SYSTEM, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE - There is provided a method for inspecting a substrate including: irradiating an illumination light onto a first surface or a second surface opposite to the first surface, of a substrate in which a pattern having a periodicity and extending from the first surface to an inside of the substrate is formed in the first surface, the illumination light having a permeability to permeate the substrate to a predetermined depth; detecting a light reflected from or transmitted through the substrate due to irradiation of the illumination light; and inspecting the substrate by utilizing information based on the periodicity of the pattern obtained from detection of the light reflected from or transmitted through the substrate. | 05-17-2012 |
20120164763 | SURFACE INSPECTION APPARATUS, METHOD FOR INSPECTING SURFACE, EXPOSURE SYSTEM, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE - A surface inspection apparatus includes: an irradiation unit; a detection unit configured to detect a first detection signal according to a first light beam and a second detection signal according to a second light beam; a providing unit which is configured to provide a first reference data and a second reference data; and a determination unit which is configured to determine a processing condition of the pattern in the substrate as an inspection object substrate, based on consistency between the first detection signal and the first reference data, and consistency between the second detection signal and the second reference data. | 06-28-2012 |
20130217154 | INSPECTION APPARATUS, INSPECTION METHOD, EXPOSURE METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A surface inspection apparatus ( | 08-22-2013 |
20140315330 | MEASUREMENT DEVICE, MEASUREMENT METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - There is provided a measuring apparatus including: an illuminator configured to illuminate, with an illumination light, a substrate having a pattern formed by exposure on a surface; a detector configured to detect the illumination light modulated by the pattern to output a detection signal; and a measuring unit configured to measure an exposure condition of the pattern of a desired portion by using the detection signals detected at a plurality of portions of the pattern. | 10-23-2014 |