Patent application number | Description | Published |
20100132989 | NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF - An object of the present invention is to provide a polyimide precursor composition solution that (i) uses no siloxane diamine, (ii) is curable at low temperature (not more than 250° C.) and (iii) has low viscosity regardless of its high concentration, and a photosensitive resin composition, photosensitive resin film, a thermosetting resin composition, a polyimide insulating film, and a printed wiring board with an insulating film, each of which has good physical properties and is obtained by use of the polyimide precursor composition solution. The foregoing object is attained by using a polyimide precursor composition solution which includes at least a (A) urethane imide oligomer having a terminal carboxylic acid group and a (B) diamino compound and/or isocyanate compound. | 06-03-2010 |
20110061914 | NOVEL POLYIMIDE PRECURSOR COMPOSITION, USE OF THE SAME, AND PRODUCTION METHOD OF THE SAME - An object of the present invention is to provide (i) a polyimide precursor composition which is curable at a low temperature (not more than 250° C.) and which has a low viscosity despite having a high concentration, and a production method thereof, (ii) a polyimide coating film obtained from the polyimide precursor composition and having good properties, and a production method thereof, (iii) a photosensitive resin composition prepared by use of the polyimide precursor composition, and a production method thereof. The object of the present invention can be attained by a polyimide precursor composition containing an imidized tetracarboxylic acid having a specific structure and an isocyanate compound having a specific structure, or optionally a diamine. | 03-17-2011 |
20110061915 | NOVEL RESIN COMPOSITION AND USE THEREOF - An object of the present invention is to provide: a (a) thermosetting resin composition, a photosensitive resin composition, a resin composition solution, a resin film, and an insulating film, each of which (i) is curable at a low temperature (not more than 200° C.), (ii) has excellent flexibility, electrical insulating reliability, solder heat resistance, and resistance to organic solvent, (iii) causes less warpage of a substrate after curing, and (iv) has excellent adhesiveness to a sealing agent; and a (b) printed wiring board provided with the insulating film mentioned above. The object of the present invention is attainable by using a thermosetting resin composition containing at least a (A) urethane imide oligomer having a terminal carboxylic acid group and a (B) thermosetting resin. | 03-17-2011 |
20110083884 | NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF - An object of the present invention is to provide (a) a polyimide precursor solution which is curable at low temperatures (not more than 200° C.) and which has excellent long-term storage stability, (b) a photosensitive resin composition, a photosensitive resin film, a thermosetting resin composition, and a polyimide insulating film, each of which is obtainable from the polyimide precursor solution and each of which is preferably usable as an insulating material for electric and electronic purposes, and (c) a printed wiring board provided with the insulating film. The above object is achievable by use of a polyimide precursor composition solution containing at least a partially imidized polyimide precursor having a urethane bond. | 04-14-2011 |
20130333931 | NOVEL INSULATING FILM AND PRINTED WIRING BOARD PROVIDED WITH INSULATING FILM - The present invention provides an insulating film including: a (A) binder polymer; (B) spherical organic beads; and (C) fine particles containing at least one element selected from the group consisting of phosphorus, aluminum, and magnesium, both the (B) spherical organic bead and the (C) fine particles being dispersed in a predetermined state in the insulating film. | 12-19-2013 |
20140048314 | FLEXIBLE PRINTED CIRCUIT INTEGRATED WITH REINFORCING PLATE - A stiffener-integrated flexible printed circuit board includes: (A) a stiffener; (B) a thermosetting adhesive on the stiffener (A); (C) an insulator film on the thermosetting adhesive (B); and (D) a wiring-pattern-equipped film on the insulator film (C), the insulator film (C) containing at least (a) a binder polymer and (b) spherical organic beads. This provides a stiffener-integrated FPC which is excellent in adhesion between a thermosetting adhesive of a stiffener and an insulator film and which is small in warpage. | 02-20-2014 |
20140054081 | NOVEL FLEXIBLE PRINTED CIRCUIT INTEGRATED WITH CONDUCTIVE LAYER - A conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film on the electromagnetic-shielding conductive film (A); and (C) a wiring-pattern-equipped film on the insulator film (B), the insulator film (B) containing at least (a) a binder polymer and (b) spherical organic beads. | 02-27-2014 |
20140069702 | NOVEL PHOTOSENSITIVE RESIN COMPOSITION AND USE THEREOF - The photosensitive resin composition contains a (A) binder polymer, (B) cross-linked polymer particles, (C) thermosetting resin, (D) photo-polymerization initiator, and a (E) phosphoric flame retardant, in which a content of the (B) cross-linked polymer particles is 30 parts by weight to 100 parts by weight with respect to the 100 parts by weight of the (A) binder polymer, and an average particle diameter of the (B) cross-linked polymer particles is 1 μm to 10 μm. Therefore, the photosensitive resin composition (i) obtains an excellent tack-free property after being applied and dried, (ii) can be subjected to fine processing, (iii) is formed into a cured film having excellent flexibility, flame retardancy, and electrical insulation reliability, and (iv) causes a substrate to have a small warpage after being cured. | 03-13-2014 |
20140158412 | NOVEL CONDUCTIVE LAYER INTEGRATED FPC - A conductive-layer-integrated flexible printed circuit includes: (A) an electromagnetic-shielding conductive layer; (B) a photosensitive resin composition layer; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the photosensitive resin composition layer, and (C) the a wiring-pattern-equipped film being laminated in this order, and (B) the photosensitive resin composition layer being formed from a photosensitive resin composition containing at least (a) carboxyl-group-containing resin, (b) a photo-polymerization initiator, and (c) thermosetting resin. | 06-12-2014 |
20140363639 | NOVEL RESIN COMPOSITION FOR INSULATING FILM, AND USE THEREOF - The present invention provides a resin composition for an insulating film which resin composition is excellent in tack property after drying and allows a resultant insulating film to be excellent in flexibility and electrical insulation reliability and to be small in warpage after curing, a resin film for an insulating film, an insulating film, and a printed wiring board provided with an insulating film. The resin composition for an insulating film contains at least: a (A) binder polymer; and (B) cross-linked polymer particles, whose polymer has a urethane bond and a carbonate skeleton in its molecule. | 12-11-2014 |
20140370301 | NOVEL RESIN COMPOSITION FOR PIGMENT-CONTAINING INSULATING FILM, AND USE THEREOF - According to a resin composition for a pigment-containing insulating film which resin composition contains at least a (A) binder polymer and (B) pigment-containing cross-linked polymer particles, it is possible to provide a resin composition for a pigment-containing insulating film which resin composition is excellent in tack property after drying and allows a resultant pigment-containing insulating film to be excellent in flexibility and electrical insulation reliability and to be small in warpage after curing, a resin film for a pigment-containing insulating film, a pigment-containing insulating film, and a printed wiring board provided with a pigment-containing insulating film. | 12-18-2014 |
20150044451 | BLACK PHOTOSENSITIVE RESIN COMPOSITION AND USE OF SAME - Provided is a black photosensitive resin composition being microfabricatable due to its photosensitivity, allowing a cured film obtainable therefrom to be excellent in flexibility, being small in post-curing warpage of a substrate, being excellent in flame retardancy and electric insulation reliability, allowing a reduction in process contamination due to less outgassing during a reflow process, and avoiding a reduction in film thickness. The black photosensitive resin composition contains at least (A) a binder polymer, (B) a thermosetting resin, (C) a flame retardant substantially insoluble in an organic solvent, (D) a photopolymerization initiator, (E) a black colorant reflecting light having a wavelength falling within an infrared range, and (F) an organic solvent, or contains at least (A) a binder polymer, (B) a thermosetting resin, (G) spherical organic beads, (D) a photopolymerization initiator, (E) a black colorant reflecting light having a wavelength falling within an infrared range, and (F) an organic solvent. | 02-12-2015 |