Patent application number | Description | Published |
20080210373 | Bonding method, bonding apparatus, and bonding jig - A bonding method includes a pasting process of pasting a face which is a face except the element formation surface of a rod, with a predetermined face of an adherend using a bonding material to be heat-cured, an absorption process of fixing angular relation between a direction of the adherend and a direction of the rod into predetermined angular relation by absorbing the adherend and rod on a surface of the stage on the surface of which the adherend and rod, which are pasted in the pasting process, are placed, and a heat cure process of heating and curing the bonding material in a state that the direction of the adherend and the direction of the rod are fixed to the predetermined angular relation by the absorption process. | 09-04-2008 |
20090038645 | Cleaning apparatus, cleaning tank, cleaning method and computer-readable storage medium - The cleaning apparatus for cleaning a cleaning target set in a cleaning tank filled with a washing fluid includes a flow-control unit for generating a predetermined flow of the washing fluid in the cleaning tank; and an ejection unit for ejecting the washing fluid disposed on a flow path of the predetermined flow of the washing fluid. The cleaning apparatus ejects the washing fluid to outside the cleaning tank by using the ejection unit in removing contaminants on a surface of the cleaning target by washing the cleaning target with the washing fluid. Also, a cleaning tank having substantially the same structure as that of the cleaning apparatus is provided. Moreover, a cleaning method implemented using the cleaning apparatus as described above or the like is provided. | 02-12-2009 |
20090061737 | LAPPING APPARATUS AND LAPPING METHOD - A lap platen has a lapping surface contacting a surface of a work piece. A lap base has a support surface brought into contact with and supported by the lapping surface. An adapter has a first support part, a second support part and an arm part. The first support part is supported by the lap base. The work piece is attached to the second support part so that a surface of the work piece to be processed contacts the lapping surface. The arm part extends between the first and second support parts. A height adjusting mechanism adjusts a height from the lapping surface to the first support part. An inclination detector is provided to the adapter to detect an inclination of the adapter. The inclination of the adapter relative to the lapping surface is adjusted by adjusting the height of the first support part by the height adjusting mechanism. | 03-05-2009 |
20090146652 | Slider tester - A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part | 06-11-2009 |
20090146653 | Slider tester - A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part | 06-11-2009 |
20110120619 | FILM STICKING DEVICE, FILM STICKING METHOD, AND ELECTRONIC PAPER MANUFACTURING METHOD - Disclosed is a film sticking device that sticks a first film substrate and a second film substrate together on a curved-surface shape. The film sticking device includes a mold having a curved attachment surface formed into a desired curved-surface shape; an attracting and holding unit capable of relatively moving on the curved attachment surface and having plural vacuum chambers on which an attracting surface for attracting and holding the second film substrate is provided; and a suctioning unit capable of separately applying suction processing to the plural vacuum chambers. The suctioning unit starts, as the attracting and holding unit moves, the suction processing of the vacuum chamber corresponding to a position opposing the second film substrate and sequentially stops, as the second film substrate is stuck to the first film substrate, the suction processing of the vacuum chamber corresponding to the stuck second film substrate. | 05-26-2011 |
20110133365 | Film substrate processing method and film substrate processing aparatus - A method of processing a film substrate includes removing a portion of the film substrate; and fusing a part of the film substrate around the removed portion to seal scraps of the film substrate, which are generated when removing the portion of the film substrate, in the fused part of the film substrate. | 06-09-2011 |
20120031592 | ELECTRONIC COMPONENT REPAIR METHOD, ELECTRONIC COMPONENT REPAIR DEVICE, AND HEAT TRANSFER PLATE - An electronic component repair method for removing an electronic component soldered on a substrate, the method includes: mounting a heat transfer plate on the electronic component to be removed, the heat transfer plate being formed by bonding a plurality of heat transfer members via a heat insulating member, heating the heat transfer plate mounted on the electronic component by a heating unit, the heating unit heating individually each of the heat transfer members by different heat amount; and removing the electronic component from the substrate after the heating. | 02-09-2012 |
20120060356 | APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT - An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component. | 03-15-2012 |