Patent application number | Description | Published |
20080261138 | ELECTROSTATIC LATENT IMAGE DEVELOPING TONER - An objective is to provide an electrostatic latent image developing toner exhibiting ultra-low temperature fixability together with high resolution, excellent fluidity and anti-blocking property, and excellent aging stability in a toner vessel, in which the toner is supplied into an image forming apparatus. Also disclosed is an electrostatic latent image developing toner stored in a vessel possessing an ejecting outlet, capable of fitting into an image forming apparatus, wherein the vessel has a cross-sectional area of the outlet of 0.07-2.00 cm | 10-23-2008 |
20080304869 | TONER BOTTLE FOR ELECTROSTATIC LATENT IMAGE DEVELOPING - A toner bottle containing a cylindrical toner container having therein a toner comprising at least a resin, a colorant and an external additive, the toner container having a toner discharge port on an end thereof and a rotation axis along the cylindrical toner container, and the toner container being installable in an image forming apparatus, wherein the toner container has plural protrusions which are intermittently provided in an interior of the cylindrical container, the protrusions having a function to convey the toner toward the toner discharge port when the toner container is rotated around the rotation axis; an X-ray intensity ratio of titanium to silicon (Ti/Si) determined via X-ray fluorescence spectrometry of the toner is 1.0 to 3.0; and a conveyance index of the toner is 2.0 to 10.0 mg/sec. | 12-11-2008 |
20090081477 | MATERIAL FOR ELECTRIC CONTACT AND METHOD OF PRODUCING THE SAME - A material for electric contact comprising, on a conductive substrate, a first layer composed of a noble metal or an alloy comprising the noble metal as a major component with an arithmetic average roughness Ra of (A) μm and, as an upper layer of the first layer, a second layer composed of a noble metal or an alloy comprising the noble metal as a major component with a covering thickness of from 0.001×(A) μm or more to (A) μm or less, and
| 03-26-2009 |
20090087770 | TONER FOR ELECTROPHOTOGRAPHY - An electrophotographic toner is disclosed, meeting the requirement that G′ (60)/G′ (80) is from 1×10 | 04-02-2009 |
20100062663 | ELECTRICAL CONTACT MATERIAL, METHOD OF MANUFACTURING THE SAME, AND ELECTRICAL CONTACT - An electrical contact material includes a surface layer formed of a noble metal or an alloy containing the noble metal as a major constituent. An organic film having heat resistance is formed on a surface of the surface layer, and the organic film is formed of an organic compound having an ether bonding group. Accordingly, the electrical contact material has good corrosion resistance and sliding resistance. | 03-11-2010 |
20100101831 | ELECTRICAL CONTACT MATERIAL, METHOD FOR MANUFACTURING THE SAME AND ELECTRICAL CONTACT - The present invention relates to an electrical contact material having a surface layer made of a noble metal or an alloy having the noble metal as its main component, a method for manufacturing the same and an electrical contact using the same. Recently, electrical contact materials having excellent abrasion resistance are used for sliding electrical contacts such as a connector terminal of an automobile harness, a contact switch mounted in a cellular phone and terminals of a memory card. Although there have been known ones having an organic coating film composed of either aliphatic amine or mercaptan or a mixture of the both provided on the electrical contact material described above as the electrical contact materials having excellent abrasion resistance, they have had problems that even though they are effective with a low load of 0.5 N or below, abrasion accelerates when the load exceeds 0.5 N and sliding characteristics drop under a high-temperature environment. The invention solves the abovementioned problems by providing an organic coating film formed of an organic compound containing aliphatic amine on the electrical contact material. | 04-29-2010 |
20100163276 | SILVER-COATED MATERIAL FOR MOVABLE CONTACT COMPONENT AND METHOD FOR MANUFACTURING SUCH SILVER-COATED MATERIAL - A silver-coated material for a movable contact component is provided, in which a conductive base member ( | 07-01-2010 |
20100186993 | SILVER-COATED MATERIAL FOR MOVABLE CONTACT COMPONENT AND METHOD FOR MANUFACTURING SUCH SILVER-COATED MATERIAL - A silver-coated material for a movable contact component includes an electrically conductive base member ( | 07-29-2010 |
20110003167 | METALLIC MATERIAL FOR A CONNECTOR AND METHOD OF PRODUCING THE SAME - A metallic material for a connector, having a base material of a bar material or a rectangular wire material formed of copper or a copper alloy, in which a striped copper-tin alloy layer is formed in the longitudinal direction of the metallic material on a part of the surface of the metallic material, and in which a tin layer or a tin alloy layer is formed on the remaining part of the surface of the metallic material; and, a method of producing a metallic material for a connector, containing: providing a bar material or a rectangular wire material of copper or a copper alloy as a base material; forming a tin plating layer or a tin alloy plating layer on the base material, to obtain an intermediate material; and subjecting the intermediate material to reflow treatment in a stripe form in the longitudinal direction of the intermediate material. | 01-06-2011 |
20110003520 | TERMINAL FOR CONNECTOR AND METHOD OF PRODUCING THE SAME - A connector terminal, fabricated from a metallic material for connector which material has a tin or tin alloy layer, formed on a copper or copper alloy base material, wherein the thickness of the tin or tin alloy layer at a contact site on the surface of the terminal is smaller than the thickness of the tin or tin alloy layer in the areas other than the contact site, and a copper-tin alloy layer is formed as an under layer of the tin or tin alloy layer at the contact site; and a connector terminal, fabricated from a metallic material for connector which material has a copper or copper alloy base material, wherein a copper-tin alloy layer is formed in a spot shape at a contact site on the surface of the terminal, and a tin or tin alloy layer is formed in the remaining areas on the surface. | 01-06-2011 |
20110009015 | FRETTING-RESISTANT CONNECTOR AND PROCESS FOR MANUFACTURING THE SAME - A fretting-resistant connector, having an organic coating that is formed of an organic compound which has an ether linkage group at least a part on a surface of an electrically conductive metal material. | 01-13-2011 |
20110036621 | METAL MATERIAL, METHOD FOR PRODUCING THE SAME, AND ELECTRICAL/ELECTRONIC COMPONENT USING THE SAME - A metal material ( | 02-17-2011 |
20110117488 | CARRIER AND TWO-COMPONENT DEVELOPER COMPOSED OF THE CARRIER - An objective is to provide a carrier exhibiting stable charge providing ability in which sufficient charge can be provided to toner having a small particle diameter, and no image contamination such as fog caused by toner scattering via lack of electrification is generated. Another objective is to provide a carrier capable of maintaining a charging level of no interference for image formation even under the image forming condition at which a charging level for printing a number of prints continuously is difficult to be maintained. Disclosed is a carrier comprising a core particle made of ferrite possessing Mg and coated thereon, a resin, wherein the core particle has a ratio of the number of irregular-shaped core particles of at most 5%, based on the total number of core particles, and a surface of the core particle has grains having a maximum grain diameter of 2-5 μm. | 05-19-2011 |
20110293926 | LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICES, METHOD OF PRODUCING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE - A lead frame for optical semiconductor devices in which a layer | 12-01-2011 |
20120073944 | SWITCH INTEGRATED CASING AND ELECTRONIC EQUIPMENT HAVING THE CASING - A switch integrated type housing includes a housing body, a switch button sheet, a conductor and a cover sheet. The housing body is provided with a plurality of concave sections on an outer surface of the housing body. The switch button sheet is provided on the outer surface to cover the plurality of concave sections. The conductor has a dome shape downwardly projecting and is provided in each of the plurality of concave sections to contact the switch button sheet. The cover sheet is provided between the switch button sheet and the outer surface of the housing body in a portion of the outer surface of the housing body other than the plurality of concave sections and to cover a lower surface of the conductor in each of the plurality of concave sections. | 03-29-2012 |
20120168800 | LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE - A lead frame for an optical semiconductor device, having a reflection layer ( | 07-05-2012 |
20120168810 | LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE - A lead frame for an optical semiconductor device, having: a layer | 07-05-2012 |
20120301745 | SILVER-COATED COMPOSITE MATERIAL FOR A MOVABLE CONTACT PART, METHOD OF PRODUCING THE SAME, AND MOVABLE CONTACT PART - A silver-coated composite material for movable contact parts, which has: an underlying layer composed of any one of nickel, cobalt, a nickel alloy, and a cobalt alloy at least provided on a part of the surface of a stainless steel substrate; an intermediate layer composed of copper or a copper alloy provided thereon; and a silver or silver alloy layer provided thereon as an outermost layer, wherein a thickness of the intermediate layer is 0.05 to 0.3 μm, and wherein an average grain size of the silver or silver alloy provided as the outermost layer is 0.5 to 5.0 μm. | 11-29-2012 |
20130099270 | LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE - A lead frame for an optical semiconductor device, having a reflection layer at least on one side or each side of the outermost surface of a substrate, partially or entirely, in which the reflection layer has, on the outermost surface at least in a region where light emitted by an optical semiconductor element is reflected, a microstructure with at least the surface thereof having been mechanically deformed, which is converted from a plating microstructure formed of a metal or an alloy thereof; a method of producing the same, and an optical semiconductor device having the same. | 04-25-2013 |