Patent application number | Description | Published |
20080251632 | Wing-Flapping Flying Apparatus and Method of Using the Same - The present invention provides a wing-flapping flying apparatus, which can fly by moving its wings similar to a bird hovering or flying in the air by flapping its wings. The wing-flapping flying apparatus comprises: a body; a rotating shaft rotatably joined to the body; driving means for rotating the rotating shaft; and wings reciprocated between two points and connected to the rotating shaft so as to be rotated together with the rotating shaft and to be relatively torsionally rotated with respect to the rotating shaft. The wing-flapping flying apparatus generates lift throughout an entire wing-flapping movement without generating lift only throughout the half of a wing-flapping movement or offsetting the generated lift by the other half of the wing-flapping movement. Therefore, the wing-flapping flying apparatus can provide not only a stable flight but also a softly hovering or ascending and descending flight. | 10-16-2008 |
20090032947 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING - A semiconductor device has a semiconductor die having at least one bond pad formed on a first surface thereof. A substrate has at least one bond finger formed on a first surface thereof. A second surface of the semiconductor die is attached to the first surface of the substrate. A conductive wire connects the bond pad of the semiconductor die and the bond finger of the substrate wherein at least one end of the conductive wire has a stack bump. An encapsulant is provided to encapsulate the semiconductor die and the conductive wire. | 02-05-2009 |
20140042600 | Semiconductor Package and Manufacturing Method Thereof - A semiconductor package and manufacturing method thereof are disclosed and may include a first semiconductor device comprising a first bond pad on a first surface of the first semiconductor device, a first encapsulant material surrounding side edges of the first semiconductor device, and a redistribution layer (RDL) formed on the first surface of the first semiconductor device and on a first surface of the encapsulant material. The RDL may electrically couple the first bond pad to a second bond pad formed above the first surface of the encapsulant material. A second semiconductor device comprising a third bond pad on a first surface of the second semiconductor device may face the first surface of the first semiconductor device and be electrically coupled to the first bond pad on the first semiconductor device. The first surface of the first semiconductor device may be coplanar with the first surface of the encapsulant material. | 02-13-2014 |
20140077366 | Wafer Level Fan-Out Package With a Fiducial Die - A wafer level fan-out package with a fiducial die is disclosed and may include a semiconductor die and a transparent fiducial die both encapsulated in a molding compound resin, passivation layers on an upper surface and a lower surface of the molding compound resin except where redistribution layers are formed on upper and lower surfaces of the molding compound resin, and a metal pattern on a lower surface of the transparent fiducial die that is visible through an exposed upper surface of the transparent fiducial die. The pattern may comprise a standard coordinate for forming a through mold via utilizing laser drilling. | 03-20-2014 |
20140138788 | PACKAGE OF FINGER PRINT SENSOR AND FABRICATING METHOD THEREOF - Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof. | 05-22-2014 |
20150049421 | ELECTRONIC DEVICE PACKAGE STRUCTURE AND METHOD FABRICATING THE SAME - In one embodiment, an electronic device package structure includes an electronic die having conductive pads on one surface. The one surface is further attached to at least one lead. A conductive layer covers at least one conductive pad and at least portion of the lead thereby electrically connecting the lead to the conductive pad. | 02-19-2015 |
Patent application number | Description | Published |
20140165959 | ENGINE HAVING VARIABLE VALVE TIMING DEVICE AND VARIABLE TUMBLE DEVICE - An engine having a variable valve timing device and a variable tumble device, may include the variable valve timing device advancing or delaying a rotation of an intake camshaft or an exhaust camshaft, an intake valve or an exhaust valve configured to be operated by the intake camshaft or the exhaust camshaft respectively to open and close an intake port or an exhaust port, and the variable tumble device that may be disposed on an upstream side of the intake valve in the intake port and changes a flow of a gas being suck to form a tumble in a combustion chamber. | 06-19-2014 |
20140165960 | VARIABLE INTAKE MANIFOLD FOR INTERNAL COMBUSTION ENGINE AND VARIABLE AIR INTAKE DEVICE USING THE SAME - A variable intake manifold apparatus for an internal combustion engine, may include an inlet drawing in outside air and being connected to a main passage, first and second outlets branched from the main passage and fluid-connected to the inlet through the main passage and releasing the outside air drawn through the main passage through the first and second outlets, and a partition dividing the main passage and one of the first and second intake passages. | 06-19-2014 |
20140172271 | METHOD OF CONTROLLING ELECTRIC CONTINUOUS VARIABLE VALVE TIMING APPARATUS - A method of controlling an electric continuous variable valve timing apparatus improves starting performance of an engine by a simplified phase control for the camshaft. The method, in which intake and exhaust timing of an engine is changed in accordance with a phase of the camshaft, may include: determining whether starting off of the engine is required during driving; recognizing a target phase of the camshaft for next starting of the engine; controlling the phase of the camshaft so that the intake timing of the engine is advanced in accordance with the target phase; and ending the phase control of the camshaft in accordance with a state of the engine or the camshaft. | 06-19-2014 |
20140182565 | BRAKE NEGATIVE PRESSURE GENERATING DEVICE FOR VEHICLE - A brake negative pressure generating device of a vehicle includes: an electrically-driven supercharger for drawing in, compressing, and supplying outside air; a vacuum chamber connected to an inlet opening of the electrically-driven supercharger and supplying negative pressure for brake force boosting; a negative pressure supply passage for connecting the inlet opening of the electrically-driven supercharger and the vacuum chamber; and a first negative pressure control valve for opening and closing an inlet passage. Accordingly, the electrically-driven supercharger is run to supplement brake negative force if the brake negative force is not sufficient. | 07-03-2014 |
20140216422 | METHOD OF CONTROLLING ENGINE - A method of engine control includes: determining and comparing actual and target supply amounts of EGR gas; sensing an open rate of an EGR valve to control the actual supply amount supplied to an intake line; if the actual supply amount is smaller than the target supply amount and if the EGR-valve open rate is at a maximum, fixing an open rate of a bypass valve installed at a bypass line that bypasses an electrodynamic turbocharger to a minimum open rate; and controlling the EGR-valve open rate in a state in which the bypass-valve open rate is fixed to a minimum open rate. Therefore EGR gas can be more precisely and stably supplied. | 08-07-2014 |
20140230417 | EXHAUST GAS COMBUSTION SYSTEM - An exhaust gas combustion system advances exhaust timing by using an electric CVVT apparatus. The system may include: an air supply passage adapted to provide for passing air to be supplied to an engine; an exhaust manifold adapted to transmit exhaust gas of the engine to an exhaust passage; an air injection passage adapted to connect the air supply passage with the exhaust manifold so as to supply a part of air passing through the air supply passage to the exhaust manifold; and an air valve disposed at the air injection passage so as to selectively open or close the air injection passage. Unburned gas melded in exhaust gas may be combusted according to air supplied to the exhaust manifold. | 08-21-2014 |
20140238016 | SUPERCHARGING SYSTEM FOR ENGINE - A supercharging system for an engine includes: a cylinder block forming a combustion chamber; an intake manifold connected to the cylinder block to supply ambient air thereto; an exhaust manifold collecting exhaust gas discharged from the combustion chamber and guiding the same to the environment; a third supercharge path connecting an inlet of the intake manifold to the exhaust manifold; and an electric supercharger supplying compressed air to the exhaust manifold through the third supercharge path. Responsiveness of an engine is enhanced and stabilization of the engine is promoted. | 08-28-2014 |
20140238017 | NEGATIVE PRESSURE FORMING DEVICE FOR BRAKE OF VEHICLE - A brake vacuum pressure forming device for a motor vehicle may include a vacuum chamber supplying a vacuum pressure boosting a break operating force, an electric supercharger connected to the vacuum chamber to supply vacuum pressure thereto, a first vacuum pressure supply path connecting the electric supercharger and the vacuum chamber, and a vacuum pressure control valve mounted on the first vacuum pressure supply path and opening and closing the first vacuum pressure supply path. | 08-28-2014 |
20150020522 | ENGINE SYSTEM - An engine system may include a first intake line connected to an intake manifold and supplying the intake manifold disposed on a cylinder block with outside air, an intake bypass valve disposed on the first intake line, a second intake line that bypasses the first intake bypass valve to the intake manifold, a first exhaust line through which exhaust gas flows from an exhaust manifold disposed on the cylinder block, an exhaust bypass valve disposed on the first exhaust line, a second exhaust line connected to the exhaust manifold and bypasses the exhaust bypass valve, a turbo charger disposed between the second intake line and the second exhaust line and operated by exhaust gas passing the second exhaust line to pump intake air flowing the second intake line, and a control portion that controls the intake bypass valve and the exhaust bypass valve depending on a driving condition. | 01-22-2015 |
20150068204 | ENGINE SYSTEM - An engine system may include a main intake line, a supplementary intake line branched from the main intake line and joined to the main intake line, an intake bypass valve mounted to the main intake line, a main exhaust line mounted to an exhaust manifold, a supplementary exhaust line branched from the exhaust manifold and joined to the main exhaust line, an exhaust bypass valve mounted to the main exhaust line and selectively opening the main exhaust line, a turbocharger disposed adjacent to the supplementary exhaust line and operated by exhaust gas passing through the supplementary exhaust line, and a control unit for controlling the intake bypass valve and the exhaust bypass valve depending on an operation condition, wherein the exhaust gas is re-circulated from an upstream side of the exhaust bypass valve to the main intake line passing through an EGR (Exhaust Gas Recirculation) cooler and an EGR valve. | 03-12-2015 |