Yong Sam
Yong Sam Kwon, Gyeonggi-Do KR
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20150374641 | FILM-FORMING PHARMACEUTICAL COMPOSITION FOR WOUND HEALING AND METHOD FOR PREPARING THE SAME - The present invention relates to a pharmaceutical composition for forming a film directly on a wound to accelerate wound healing, a use for the same, a treatment method using the same, and a method for preparing the same. The film-forming composition according to the present invention forms a film directly on the wound to increase the adhesion to the wound. The formed thin hydrophilic film protects the wound surface to prevent infection of the wound surface, retains the physiologically active substance useful for wound healing on the wound surface to promote the wound healing, and allow drugs to be continuously delivered to the wound surface. Therefore, the composition according to the present invention has excellent wound healing effect and has excellent usability as it is not absorbed into clothing, bandage, etc., thus effectively replacing conventional gel or ointment formations for delivering physiologically active substances. | 12-31-2015 |
Yong Sam Lee, Suwon KR
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20140116753 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - There are provided a wiring board in which plating layers constituting wiring patterns are formed to have uniform thicknesses, and a method of manufacturing the wiring board. The wiring board includes an insulating layer; and wiring patterns formed on the insulating layer, wherein at least one of the wiring patterns is formed by stacking two or more plating layers. | 05-01-2014 |
Yong Sam Lee, Yongin KR
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20140353025 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first insulating layer; a pad formed on the first insulating layer; a second insulating layer covered on the first insulating layer having the pad thereon; and a via hole formed in the second insulating layer. The pad has a surface that is non-planar. | 12-04-2014 |
Yong Sam Lee, Yongin-Si KR
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20150129293 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via connecting internal circuit layers through the core and the insulator. | 05-14-2015 |
20150373841 | CORE AND PRINTED CIRCUIT BOARD - A printed circuit board, according to one embodiment, includes: a core having a slope pattern formed on a side surface thereof; a first insulating layer laminated on the core; a second insulating layer laminated on the first insulating layer to cover the side surface of the core; an inner circuit layer and an outer circuit layer respectively formed on the first insulating layer and the second insulating layer; and a solder resist layer laminated on the second insulating layer. | 12-24-2015 |
Yong Sam Lee, Suwon-Si KR
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20150325510 | CHIP ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - A chip electronic component may be capable of improving connectivity between internal coils formed on upper and lower surfaces of an insulating substrate and preventing loss of inductance due to the areas of via pads by decreasing sizes of the outermost via electrodes and decreasing sizes of the via pad. | 11-12-2015 |
Yong Sam Lee, Gyunggi-Do KR
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20120168220 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a multi-layer printed circuit board and a method of manufacturing the same. In the multi-layer printed circuit board and the method of manufacturing the same, circuit layers formed in a plurality of insulating layers are electrically interconnected through vias formed in a lump, thereby making it possible to secure bonding reliability of an interlayer circuit layer and more stably secure performance of the printed circuit board. In addition, since a stacked type via structure may be implemented by performing a via hole drilling process, a desmear process, and a copper plating process only one time after an insulating layer and an circuit layer are stacked, a manufacturing process, a manufacturing time, and manufacturing costs of the stacked type via structure may be reduced. | 07-05-2012 |
Yong Sam Lee, Daegu KR
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20150060778 | FLEXIBLE ORGANIC ELECTROLUMINESCENT DEVICE AND METHOD FOR FABRICATING THE SAME - Provided is a flexible organic electroluminescent device and a method for fabricating the same. In the flexible electroluminescent device, line hole patterns are formed on surfaces of a plurality of inorganic layers positioned in a pad region in which a flexible printed circuit board is connected to prevent a path of cracks caused by repeated bending and spreading of the organic electroluminescent device from spreading to the interior of the device. | 03-05-2015 |
Yong Sam Shin, Hwaseong-Si KR
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20130117808 | APPARATUS AND METHOD FOR ENHANCING SECURITY IN HETEROGENEOUS COMPUTING ENVIRONMENT - An apparatus and method for enhancing security and stability in a heterogeneous computing environment that supports an open standard parallel program are provided. A method of enhancing security in a heterogeneous computing environment may include loading a source code kernel corresponding to an application program to be installed in a host system, determining whether the source code kernel is targeted for integrity check, based on a security policy of the host system, prior to cross-compiling the source code kernel, requesting a security engine of a computing device to check an integrity of the source code kernel, when the source code kernel is determined to be targeted for the integrity check, and controlling an operation of a runtime compiler based on a check result received from the security engine. | 05-09-2013 |
20130247065 | APPARATUS AND METHOD FOR EXECUTING MULTI-OPERATING SYSTEMS - An apparatus and method for executing multi-operating systems (OS) are provided. Resources allocated to the respective multi-OSs are managed by management applications of the multi-OSs. A processor executes a plurality of multi-OSs. Each of the plurality of multi-OSs executes the management application. Each of the plurality of multi-OSs regards a resource held by another multi-OS among the plurality of multi-OSs as used by the corresponding management application, thereby preventing the resource from being allocated to another application included in the multi-OS. | 09-19-2013 |
Yong Sam Shin, Hwasung-Si KR
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20130246797 | APPARATUS AND METHOD FOR ELECTRONIC SIGNATURE VERIFICATION - An apparatus for electronic signature verification, including a grouping unit to group, into at least one group, a plurality of kernels included in an application to which electronic signature verification is to be performed, and an electronic signature verification unit to perform electronic signature verification with respect to the at least one group. | 09-19-2013 |