| Patent application number | Description | Published |
| 20120240604 | HEAT PUMP SYSTEM FOR VEHICLE - A heat pump system for a vehicle includes a water cooled condenser that uses a coolant as a heat exchange media and uses waste heat generated from a motor and an electronic device to improve heating performance, efficiency, and dehumidifying performance. A control method is also described. | 09-27-2012 |
| 20120318012 | HEAT PUMP SYSTEM FOR VEHICLE - A heat pump system may include a cooling assembly disposed on a vehicle to circulate electric devices with coolant through a cooling line, wherein the cooling assembly includes a radiator disposed at a front side of the vehicle, uses a water pump to circulate coolant through the cooling line, and cools the supplied coolant through heat exchange with outside air, and a cooling fan that blows wind through the radiator, an air conditioning assembly connected to a refrigerant line connected to the cooling assembly to control heating and cooling, and a heat exchanger connected to the cooling line such that the coolant is circulated therein, selectively uses the waste heat generated from the electric devices according to modes to vary the temperature of the coolant, and is connected to the refrigerant line of the air conditioning assembly such that an inflow refrigerant exchanges heat with the coolant. | 12-20-2012 |
| 20130019615 | HEAT PUMP SYSTEM FOR VEHICLE AND CONTROL METHOD THEREOF - A method for controlling a heat pump system is provided with air conditioning means connected to a controller and including a plurality of valves and expansion valves connected to each other through a refrigerant line and a bypass line, a compressor, an accumulator, an evaporator, an exterior condenser, an interior condenser, and an HVAC module having a PTC heater and a door at a warming mode, a cooling mode, a dehumidification mode, a dehumidification/defrosting mode, or an extremely low temperature dehumidification/defrosting mode according to selection of a driver. | 01-24-2013 |
| Patent application number | Description | Published |
| 20080315402 | PRINTED CIRCUIT BOARD, MEMORY MODULE HAVING THE SAME AND FABRICATION METHOD THEREOF - A printed circuit board, a memory module having the same, and a fabrication method thereof. The printed circuit board includes an interconnection substrate on which electronic components are mounted and in which a plurality of signal lines are arranged. The signal lines are electrically coupled to the electronic components. A heat sink is disposed on one surface of the interconnection substrate to dissipate heat of the electronic components, and in which no signal lines are arranged. The printed circuit board includes a bending substrate coupling the interconnection substrate to the heat sink, and formed of a flexible material configured to be bent. | 12-25-2008 |
| 20100164357 | PHOTOSENSITIVE PASTE COMPOSITION FOR FABRICATING THE PLASMA DISPLAY PANEL ELECTRODE, PLASMA DISPLAY PANEL ELECTRODE AND PLASMA DISPLAY PANEL THEREBY - Disclosed herein is a photosensitive paste composition for a plasma display panel (PDP) electrode capable of minimizing edge curl, i.e., a phenomenon in which the edge of an electrode pattern portion is curled during baking and thus improving withstand voltage. The photosensitive paste composition comprises 40 to 55% by weight of a conductive powder, 5 to 15% by weight of an inorganic binder, 35 to 55% by weight of an organic vehicle, and the remaining percentage by weight of a solvent, wherein the inorganic binder is present in an amount of 15 to 35 parts by weight, with respect to 100 parts by weight of the conductive powder. Further disclosed are a plasma display panel (PDP) electrode fabricated using the composition, and a plasma display panel (PDP) comprising the electrode. | 07-01-2010 |
| 20100288418 | MAGNETIC SHEET FOR RADIO FREQUENCY IDENTIFICATION ANTENNA, METHOD OF MANUFACTURING THE SAME, AND RADIO FREQUENCY IDENTIFICATION ANTENNA USING THE SAME - Provided are a magnetic sheet for use in a radio frequency identification (RFID) antenna, an RFID antenna including the magnetic sheet, and a method of manufacturing the magnetic sheet, in which the magnetic sheet includes an amorphous alloy selected from the group consisting of Fe—Si—B, Fe—Si—B—Cu—Nb, Fe—Zr—B and Co—Fe—Si—B. The magnetic sheet is made by laminating amorphous alloy ribbons made of an amorphous alloy between magnetic sheet layers formed of alloy powder including at least one amorphous alloy and then compression-molding the amorphous alloy ribbons, to thereby control microcrack of the amorphous alloy ribbons and enhance characteristic of an end-product. The magnetic sheet is also thin, and has an excellent magnetic permeability, and a simple manufacturing process. | 11-18-2010 |
| 20110256671 | SEMICONDUCTOR MEMORY MODULE WITH REVERSE MOUNTED CHIP RESISTOR - A semiconductor memory module having a reverse mounted chip resistor, and a method of fabricating the same are provided. By reverse mounting the chip resistor on the semiconductor memory module, the resistive material is protected, thereby preventing open circuits caused by damage to the resistive material. Also, a chip-resistor connection pad of a module substrate is formed to extend higher from the module substrate than other connection pads connected to other elements. Thus, the resistive material of the chip resistor does not contact the module substrate, thereby preventing poor alignment and defective connections. | 10-20-2011 |
| Patent application number | Description | Published |
| 20100071300 | THREE-DIMENSIONAL CELLULAR LIGHT STRUCTURES WEAVING BY HELICAL WIRES AND THE MANUFACTURING METHOD OF THE SAME - Disclosed herein is a three-dimensional cellular light structure formed of continuous wire groups. In the cellular light structure, six orientational helical wire groups are intercrossed each other at 60 degrees or 120 degrees of angles in a three-dimensional space to thereby form a uniform pattern and having a good mechanical property such as strength, rigidity or the like. A method of mass-producing the structure in a cost-effective manner is also disclosed. The three-dimensional cellular light structure has a similar form to the Kagome truss. According to the manufacturing method of the three-dimensional cellular light structure of the present invention, a frame assembly consisting of rectangular frames and connection support bars is used, when the 1st, 2nd, 3rd, 4th, 5th and 6th-axis helical wires are assembled. In addition, the manufacturing method is characterized by comprising a step of arranging and fixing the 1st, 2nd and 3rd-axis wires on the frames to form a plurality of two-dimensional Kagome planes, a step of connecting the frames by means of connection support bars, and a step of assembling the 4th, 5th and 6th-axis wires to fabricate a three-dimensional cellular light structure. When required, the intersection points of the wires are bonded by means of welding, brazing, soldering, or a liquid-or-spray-form adhesive to provide a structural material having a light weight and a good mechanical strength and rigidity, it can be made into a fiber-reinforced composite material by filling part of or entire internal empty space of the structure. | 03-25-2010 |
| Patent application number | Description | Published |
| 20100037947 | Thin film type solar cell and method for manufacturing the same - A thin film type solar cell and a method for manufacturing the same is disclosed, the thin film type solar cell comprising a first electrode in a predetermined pattern on a substrate; a first semiconductor layer on the first electrode; a second electrode in a predetermined pattern on the first semiconductor layer; a second semiconductor layer on the second electrode; and a third electrode in a predetermined pattern on the second semiconductor layer, the first and third electrodes being electrically connected with each other, wherein a first solar cell is composed of a combination of the first electrode, the first semiconductor layer, and the second electrode; a second solar cell is composed of a combination of the second electrode, the second semiconductor layer, and the third electrode; and the first and second solar cells are connected in parallel, whereby it is possible to realize improved efficiency of the entire thin film type solar cell without performing a process for a current matching between the first and second solar cells. | 02-18-2010 |
| 20110226419 | Process Chamber, Semiconductor Manufacturing Apparatus and Substrate Processing Method Having the Same - Disclosed herein is a semiconductor manufacturing apparatus including a transfer chamber provided with a substrate moving device to move substrates, a load lock chamber to align the substrates and to load and unload the substrates into and out of the transfer chamber, and at least one process chamber to process the substrates transferred from the transfer chambers. Each of the at least one process chamber includes a chamber body provided with a substrate entrance formed on a side surface thereof, a substrate support provided within the chamber body such that at least two substrates are disposed on the substrate support, and at least one divider provided within the chamber body to align the at least two substrates. | 09-22-2011 |
| Patent application number | Description | Published |
| 20120007625 | Test Socket for Testing Electrical Characteristics of a Memory Module - A test socket may include a socket frame, a plate, a socket pin and a link. The socket frame may have a slot configured to accept an object. The plate may be free to move in the slot along an inserting direction of the object to support a lower surface of the object. The socket pin may be movably arranged in a direction substantially perpendicular to the inserting direction of the object. The socket pin may selectively make contact with a tab of the object. A link may be pivotally connected to the socket pin and the plate. Thus, the socket pin of the test socket may avoid dragging along the tab of the object during insertion, and accordingly, the tab of the object may avoid damage. | 01-12-2012 |
| 20120182653 | SEMICONDUCTOR MODULE AND SYSTEM INCLUDING THE SAME - A semiconductor module includes a printed circuit board, at least one on-board device unit coupled between at least one voltage line and a power line. The at least on-board device unit is mounted on the printed circuit board. At least one electrostatic discharge protection circuit unit, configured to protect the at least one on-board device unit from an electrostatic discharge that occurs in the at least one voltage line, is coupled to the at least one voltage line. | 07-19-2012 |
| 20120318562 | WORKING PANEL AND WORKING PANEL SET COMPRISING ARRAY BOARD PATTERNS - A working panel includes first array board patterns arranged in a first region and including first and second guide bar patterns facing each other and N first unit board patterns, where N is a natural number greater than or equal to 2, positioned between the first and second guide bar patterns, and second array board patterns including third and fourth guide bar patterns facing each other, and M second unit board patterns, where 1≦M| 12-20-2012 | |
| Patent application number | Description | Published |
| 20090129041 | Stacked semiconductor module, method of fabricating the same, and electronic system using the same - A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs. | 05-21-2009 |
| 20100015362 | METHOD OF ELECTROLESS PLATING - An apparatus for electroless plating includes a plating bath containing an aqueous metal salt solution, and a magnetic field generator for generating a magnetic field. An object to be plated is immersed in the solution. The magnetic field generated by the magnetic field generator increases the level at which the metal ions are attracted to a surface of the object. Therefore, a layer of plating of good quality may be formed at a rapid rate. | 01-21-2010 |
| 20110174021 | Washing machine - A washing machine including a housing and a detergent supply device to supply detergents. The detergent supply device includes a rotary case installed to be rotatable about the lower end thereof and rotated to be protruded from the housing, and detergent containers detachably installed in the rotary case. The rotary case is rotated so that the upper portions of the detergent containers are protruded forwardly, and thus the detergents are easily injected into the respective detergent containers. | 07-21-2011 |
| 20120108839 | PROCESS FOR PREPARING PROSTAGLANDIN DERIVATIVES - The present invention relates to a process for preparing a prostaglandin derivative and an intermediate therefor. In accordance with the present invention, the prostaglandin F (PGF) derivative can be efficiently prepared with high purity by removing the protecting group of a protected prostaglandin E (PGE) derivative obtained from conjugate addition and then stereoselectively reducing the ketone group on the cyclopentanone ring of the PGE derivative. | 05-03-2012 |
| Patent application number | Description | Published |
| 20090023079 | Photomask and Method of Forming Overlay Vernier of Semiconductor Device Using the Same - This patent relates to a photomask and a method of forming an overlay vernier of a semiconductor device employing the same. The photomask includes a reticle formed of a first material through which light can transmit, a first pattern formed on the reticle and formed of a material through which light cannot transmit, a second pattern having a size smaller than the first pattern, and an auxiliary pattern formed to come in contact with the first pattern and formed of a second material different from the first material of the reticle. Thus, inclination is formed on side portions of the overlay vernier and a thin film may be easily formed on the overlay vernier. | 01-22-2009 |
| 20090201991 | METHOD FOR INTRA PREDICTION CODING OF IMAGE DATA - A method of performing an intra prediction coding with respect to a plurality of blocks included in an image frame is provided. The method of performing an intra prediction coding includes confirming whether a neighboring pixel that is referred to in an intra prediction of a block exists in the current frame, if the neighboring pixel referred to in the intra prediction exists, reading the color difference signal value of the pixel referred to in the intra prediction from the current image frame, if at least one neighboring pixel referred to in the intra prediction does not exist, reading the color difference signal value of at least one pixel from the previous image frame and performing the intra prediction with reference to the read color difference signal value of the pixel. | 08-13-2009 |
| 20090325360 | Method of Forming Trench of Semiconductor Device - The invention relates to a method of forming a trench of a semiconductor device. According to the method, a semiconductor substrate including a first region and a second region is provided. A gate insulating layer, a gate conductive layer, and a hard mask pattern are formed over the semiconductor substrate. First trenches are simultaneously formed in respective isolation areas of the first region and the second region by etching the gate conductive layer, the gate insulating layer, and the semiconductor substrate using an etch process employing the hard mask pattern. A second trench having a recess is formed on a bottom of the first trench formed in the second region. The recess is formed by widening the first trench by further etching the first trench. | 12-31-2009 |
| 20100036965 | METHOD OF TRANSMITTING/RECEIVING STREAMING DATA IN COMMUNICATION SYSTEM INCLUDING SERVER AND MOBILE COMMUNICATION TERMINAL, AND COMMUNICATION SYSTEM THEREFOR - Disclosed are a method of transmitting/receiving streaming data, to which a bit rate suitable for a mobile communication terminal is applied, in a communication system including a server and the mobile communication terminal, and a communication system therefor. The communication system include the server for converting multimedia data into the streaming data, and transmitting the streaming data to the mobile communication terminal; and the mobile communication terminal for, on receiving the streaming data from the server, collecting streaming parameters for use to determine the bit rate, and newly determining the bit rate. | 02-11-2010 |
| 20100142927 | AUDIO AND VIDEO SYNCHRONIZATION APPARATUS AND METHOD IN WIRELESS COMMUNICATION NETWORK - An audio and video synchronization apparatus and method in a wireless communication network are provided. The audio and video synchronization apparatus includes a receiver that receives audio frames and video frames, a playback buffer that sequentially buffers the audio frames, a detector that determines whether the audio frames are synchronized with the video frames and adjusts a playback time of the video frames based on a playback time of the audio frames if it is determined the audio frames are not synchronized with the video frames. | 06-10-2010 |
| 20110191491 | METHOD AND APPARATUS FOR REPRODUCING MULTIMEDIA DATA BY CONTROLLING REPRODUCING SPEED - Provided are a multimedia data reproducing method and an apparatus for controlling a multimedia data reproducing speed based on a multimedia data packet receiving speed. The method including controlling a reproducing speed of the multimedia data based on a first time difference between times at which a plurality of packets including the multimedia data are respectively received and a second time difference between times to respectively reproduce the multimedia data corresponding to the plurality of packets; and reproducing the multimedia data at the controlled reproducing speed. | 08-04-2011 |