Patent application number | Description | Published |
20080312148 | RECOMBINANT HUMAN INTERFERON-LIKE PROTEINS - This application relates to recombinant human interferon-like proteins. In one embodiment a recombinant protein created by gene shuffling technology is described having enhanced anti-viral and anti-proliferative activities in comparison to naturally occurring human interferon alpha 2b (HuIFN-α2b). The invention encompasses a polynucleotide encoding the protein and recombinant vectors and host cells comprising the polynucleotide. Preferably the polynucleotide is selected from the group of polynucleotides each having a sequence at least 93% identical to SEQ ID: No. 1 and the protein is selected from the group of proteins each having an amino acid sequence at least 85% identical to SEQ ID No: 2. The proteins and compositions comprising the proteins can be used for treatment of conditions responsive to interferon therapy, such as viral diseases and cancer. | 12-18-2008 |
20090081218 | FUSION PROTEINS - A fusion protein having a non-immunoglobulin polypeptide having a cysteine residue proximal to the C terminal thereof, and an immunoglobulin component with a mutated hinge region is provided. The mutation comprises a point mutated site corresponding in position to the position in a native hinge region of the cysteine residue located nearest the cysteine residue of the non-Ig component. The distance from the cysteine residue of the non-immunoglobulin polypeptide and any remaining cysteine residues of the mutated hinge region is sufficient to prevent the formation of a disulphide bond therebetween. | 03-26-2009 |
20090297522 | RECOMBINANT HUMAN EPO-FC FUSION PROTEINS WITH PROLONGED HALF-LIFE AND ENHANCED ERYTHROPOIETIC ACTIVITY IN VIVO - A recombinant fusion protein comprising a human erythropoietin peptide portion linked to an immunoglobulin peptide portion is described. The fusion protein has a prolonged half-life in vivo in comparison to naturally occurring or recombinant native human erythropoietin. In one embodiment of the invention the protein has a half-life in vivo at least three fold higher than native human erythropoietin. The fusion protein also exhibits enhanced erythropoietic bioactivity in comparison to native human erythropoietin. In one embodiment, the fusion protein comprises the complete peptide sequence of a human erythropoietin (EPO) molecule and the peptide sequence of an Fc fragment of human immunoglobulin IgG1. The Fc fragment in the fusion protein includes the hinge region, CH2 and CH3 domains of human immunoglobulin IgG1. The EPO molecule may be linked directly to the Fc fragment to avoid extraneous peptide linkers and lessen the risk of an immunogenic response when administered in vivo. In one embodiment the hinge region is a human Fc fragment variant having a non-cysteine residue at amino acid 6. The invention also relates to nucleic acid and amino acid sequences encoding the fusion protein and transfected cell lines and methods for producing the fusion protein. The invention further includes pharmaceutical compositions comprising the fusion protein and methods of using the fusion protein and/or the pharmaceutical compositions, for example to stimulate erythropoiesis in subjects in need of therapy. | 12-03-2009 |
20100099145 | RECOMBINANT HUMAN EPO-FC FUSION PROTEINS WITH PROLONGED HALF-LIFE AND ENHANCED ERYTHROPOIETIC ACTIVITY IN VIVO - A recombinant fusion protein comprising a human erythropoietin peptide portion linked to an immunoglobulin peptide portion is described. The fusion protein has a prolonged half-life in vivo in comparison to naturally occurring or recombinant native human erythropoietin. In one embodiment of the invention, the protein has a half-life in vivo at least three fold higher than native human erythropoietin. The fusion protein also exhibits enhanced erythropoietic bioactivity in comparison to native human erythropoietin. In one embodiment, the fusion protein comprises the complete peptide sequence of a human erythropoietin (EPO) molecule and the peptide sequence of an Fc fragment of human immunoglobulin IgG1. The Fc fragment in the fusion protein includes the hinge region, CH2 and CH3 domains of human immunoglobulin IgG1. The EPO molecule may be linked directly to the Fc fragment to avoid extraneous peptide linkers and lessen the risk of an immunogenic response when administered in vivo. In one embodiment the hinge region is a human Fc fragment variant having a non-cysteine residue at amino acid 6. The invention also relates to nucleic acid and amino acid sequences encoding the fusion protein and transfected cell lines and methods for producing the fusion protein. The invention further includes pharmaceutical compositions comprising the fusion protein and methods of using the fusion protein and/or the pharmaceutical compositions, for example to stimulate erythropoiesis in subjects in need of therapy. | 04-22-2010 |
20100099612 | RECOMBINANT HUMAN INTERFERON-LIKE PROTEINS - This application relates to recombinant human interferon-like proteins. In one embodiment a recombinant protein created by gene shuffling technology is described having enhanced anti-viral and anti-proliferative activities in comparison to naturally occurring human interferon alpha 2b (HuIFN-α2b). The invention encompasses a polynucleotide encoding the protein and recombinant vectors and host cells comprising the polynucleotide. Preferably the polynucleotide is selected from the group of polynucleotides each having a sequence at least 93% identical to SEQ ID: No. 1 and the protein is selected from the group of proteins each having an amino acid sequence at least 85% identical to SEQ ID No: 2. The proteins and compositions comprising the proteins can be used for treatment of conditions responsive to interferon therapy, such as viral diseases and cancer. | 04-22-2010 |
20100129904 | RECOMBINANT HUMAN INTERFERON-LIKE PROTEINS - This application relates to recombinant human interferon-like proteins. In one embodiment a recombinant protein created by gene shuffling technology is described having enhanced anti-viral and anti-proliferative activities in comparison to naturally occurring human interferon alpha 2b (HuIFN-α2b). The invention encompasses a polynucleotide encoding the protein and recombinant vectors and host cells comprising the polynucleotide. Preferably the polynucleotide is selected from the group of polynucleotides each having a sequence at least 93% identical to SEQ ID: No. 1 and the protein is selected from the group of proteins each having an amino acid sequence at least 85% identical to SEQ ID No: 2. The proteins and compositions comprising the proteins can be used for treatment of conditions responsive to interferon therapy, such as viral diseases and cancer. | 05-27-2010 |
20100303759 | RECOMBINANT HUMAN INTERFERON-LIKE PROTEINS - This application relates to recombinant human interferon-like proteins. In one embodiment a recombinant protein created by gene shuffling technology is described having enhanced anti-viral and anti-proliferative activities in comparison to naturally occurring human interferon alpha 2b (HuIFN-α2b). The invention encompasses a polynucleotide encoding the protein and recombinant vectors and host cells comprising the polynucleotide. Preferably the polynucleotide is selected from the group of polynucleotides each having a sequence at least 93% identical to SEQ ID: No. 1 and the protein is selected from the group of proteins each having an amino acid sequence at least 85% identical to SEQ ID No: 2. The proteins and compositions comprising the proteins can be used for treatment of conditions responsive to interferon therapy, such as viral diseases and cancer. | 12-02-2010 |
20120100099 | FUSION PROTEINS HAVING MUTATED IMMUNOGLOBULIN HINGE REGION - A fusion protein having a non-immunoglobulin polypeptide having a cysteine residue proximal to the C terminal thereof, and an immunoglobulin component with a mutated hinge region is provided. The mutation comprises a point mutated site corresponding in position to the position in a native hinge region of the cysteine residue located nearest the cysteine residue of the non-Ig component. The distance from the cysteine residue of the non-immunoglobulin polypeptide and any remaining cysteine residues of the mutated hinge region is sufficient to prevent the formation of a disulphide bond therebetween. | 04-26-2012 |
20130189226 | RECOMBINANT HUMAN INTERFERON-LIKE PROTEINS - This application relates to recombinant human interferon-like proteins. In one embodiment a recombinant protein created by gene shuffling technology is described having enhanced anti-viral and anti-proliferative activities in comparison to naturally occurring human inteferon like alpha 2b (HuIFN-α2b). The invention encompasses a polynucleotide encoding the protein and recombinant vectors and host cells comprising the polynucleotide. Preferably the polynucleotide is selected from the group of polynucleotides each having a sequence at least 93% identical to SEQ ID: No. 1 and the protein is selected from the group of proteins each having an amino acid sequence at least 85% identical to SEQ ID No: 2. The proteins and compositions comprising the proteins can be used for treatment of conditions responsive to interferon therapy, such as viral diseases and cancer. | 07-25-2013 |
20130224198 | RECOMBINANT HUMAN EPO-FC FUSION PROTEINS WITH PROLONGED HALF-LIFE AND ENHANCED ERYTHROPOIETIC ACTIVITY IN VIVO - A recombinant fusion protein comprising a human erythropoietin peptide portion linked to an immunoglobulin peptide portion is described. The fusion protein has a prolonged half-life in vivo compared to naturally occurring or recombinant native human erythropoietin. In one embodiment, the protein has a half-life in vivo at least three-fold higher than native human erythropoietin. The fusion protein exhibits enhanced erythropoietic bioactivity compared to native human erythropoietin. In one embodiment, the fusion protein comprises the complete peptide sequence of a human erythropoietin (EPO) molecule and the peptide sequence of an Fc fragment of human IgG1, which Fc fragment includes the hinge region, CH2 and CH3 domains. The EPO molecule may be linked directly to the Fc fragment to avoid extraneous peptide linkers and lessen risk of an immunogenic response when administered. In one embodiment the hinge region is a human Fc fragment variant having a non-cysteine residue at amino acid 6. | 08-29-2013 |
Patent application number | Description | Published |
20080224279 | VERTICAL ELECTRICAL INTERCONNECT FORMED ON SUPPORT PRIOR TO DIE MOUNT - A die assembly includes a die mounted to a support, in which the support has interconnect pedestals formed at bond pads, and the die has interconnect terminals projecting beyond a die edge into corresponding pedestals. Also, a support has interconnect pedestals. Also, a method for electrically interconnecting a die to a support includes providing a support having interconnect pedestals formed at bond pads on the die mount surface of the support, providing a die having interconnect terminals projecting beyond a die edge, positioning the die in relation to the support such that the terminals are aligned with the corresponding pedestals, and moving the die and the support toward one another so that the terminals contact the respective pedestals. | 09-18-2008 |
20080315407 | THREE-DIMENSIONAL CIRCUITRY FORMED ON INTEGRATED CIRCUIT DEVICE USING TWO-DIMENSIONAL FABRICATION - Stackable integrated circuit devices include an integrated circuit die having interconnect pads on an active (front) side, the die having a front side edge at the conjunction of the front side of the die and a sidewall of the die, and a back side edge at the conjunction of back side of the die and the sidewall; the die further includes a conductive trace which is electrically connected to an interconnect pad and which extends over the front side edge of the die. In some embodiments the conductive trace further extends over the sidewall, and, in some such embodiments the conductive trace further extends over the back side edge of the die, and in some such embodiments the conductive trace further extends over the back side of the die. One or both of the die edges may be chamfered. Also, methods for making such a device. Also, assemblies including such a device electrically interconnected to underlying circuitry (e.g., die-to-substrate); and assemblies including a stack of at least two such devices interconnected die-to-die, or such a stack of devices electrically interconnected to underlying circuitry. Also, apparatus and methods for testing such a die. | 12-25-2008 |
20080315434 | WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS - An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board). | 12-25-2008 |
20090102038 | CHIP SCALE STACKED DIE PACKAGE - A die prepared for stacking in a chip scale stacked die assembly, having interconnect sites in an area inward from a die edge and interconnect pads near at least one die edge. Second-level interconnection of the stacked die assembly can be made by way of connections between a first die in the assembly and circuitry on a support; and interconnection between die in the stack can be made by way of connection of z-interconnects with bonds pads in the die attach side of the support near or at one or more die edges. Methods for preparing the die include processes carried out to an advanced stage at the wafer level or at the die array level. | 04-23-2009 |
20090289101 | METHOD FOR BALL GRID ARRAY (BGA) SOLDER ATTACH FOR SURFACE MOUNT - A method is provided for solder reflow which includes the steps of providing a receptacle having receptacle pads formed on an upper surface and placing a component on the receptacle, the component having a ball grid array of solder balls attached thereto. The component is placed on the receptacle in a manner which aligns the solder balls with the receptacle pads on the receptacle. The method further includes the steps of placing a weight having a predetermined size and a predetermined mass on top of the component to form a stack of the receptacle, the component and the weight, and reflowing the stack to attach the component to the receptacle by exposing the stack to high temperature to reflow the solder balls. | 11-26-2009 |
20100164124 | METHOD AND APPARATUS FOR MULTI-CHIP PACKAGING - A method and apparatus are provided for multi-chip packaging. A multi-chip package ( | 07-01-2010 |
20110147943 | WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS - An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board). | 06-23-2011 |