Patent application number | Description | Published |
20100158130 | VIDEO DECODING METHOD - Video decoding methods are disclosed. The video decoding method comprises providing a historical syntax element of a previous video frame, receiving a current video frame to determine a current syntax element therein, determining whether a high-level syntax error is present in the current syntax element, wherein upon detection of the high-level syntax error, determining a replacement syntax element according to the historical syntax element to replace the current syntax element, decoding the replaced current video frame to detect whether there is a missing video frame or undecodable video frame, and upon detection of the missing video frame or undecodable video frame, generating a replacement video frame to substitute for the missing or the undecodable video frame. | 06-24-2010 |
20110026847 | REGION-BASED METHOD FOR ITERATIVE REGULARIZATION IMAGE ENHANCEMENT, AND ASSOCIATED REGION-BASED APPARATUS AND ASSOCIATED PROCESSING CIRCUIT - A region-based method for iterative regularization image enhancement, includes: for each region of a plurality of regions of an image, performing at least one gradient calculation of an objective function of a latest representative function of the region and updating the latest representative function according to the gradient calculation; and for the region of the plurality of regions of the image, when at least one predetermined convergence criterion is not satisfied, iteratively updating the latest representative function according to at least one gradient calculation of the same objective function of the latest representative function. In particular, the region-based method further includes: for the region of the plurality of regions of the image, when the predetermined convergence criterion is satisfied, performing postprocessing on the latest representative function of the region to generate an iteratively regularized partial image corresponding to the region. An associated region-based apparatus and processing circuit are further provided. | 02-03-2011 |
20150029311 | IMAGE PROCESSING METHOD AND IMAGE PROCESSING APPARATUS - An image processing method comprising: (a) receiving at least one input image; (b) acquiring depth map from the at least one input image; and (c) performing a defocus operation according to the depth map upon one of the input images, to generate a processed image. | 01-29-2015 |
20150033157 | 3D DISPLAYING APPARATUS AND THE METHOD THEREOF - A 3D displaying method, comprising: acquiring distance information map from at least one image; receiving control information from a user input device; modifying the distance information map according to the control information to generate modified distance information map; generating an interactive 3D image according to the modified distance information map; and displaying the interactive 3D image. | 01-29-2015 |
Patent application number | Description | Published |
20090161117 | INCLINED EXPOSURE LITHOGRAPHY SYSTEM - A method and an apparatus are disclosed for scatterfield microscopical measurement. The method integrates a scatterometer and a bright-field microscope for enabling the measurement precision to be better than the optical diffraction limit. With the aforesaid method and apparatus, a detection beam is generated by performing a process on a uniform light using an LCoS (liquid crystal on silicon) or a DMD (digital micro-mirror device) which is to directed to image on the back focal plane of an object to be measured, and then scattered beams resulting from the detection beam on the object's surface are focused on a plane to form an optical signal which is to be detected by an array-type detection device. The detection beam can be oriented by the modulation device to illuminate on the object at a number of different angles, by which zero order or higher order diffraction intensities at different positions of the plane at different incident angles can be collected. | 06-25-2009 |
20100165316 | INCLINED EXPOSURE LITHOGRAPHY SYSTEM - An inclined exposure lithography system is disclosed, which comprises: a substrate; a photoresist layer, formed on the substrate; a mask, disposed over the photoresist layer with a gap therebetween; and a refraction element disposed over the mask so that a light beam from a light source is refracted by a specific angle. | 07-01-2010 |
20120007230 | CONDUCTIVE BUMP FOR SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURE - An embodiment of the disclosure includes a conductive bump on a semiconductor die. A substrate is provided. A bond pad is over the substrate. An under bump metallurgy (UBM) layer is over the bond pad. A copper pillar is over the UBM layer. The copper pillar has a top surface with a first width and sidewalls with a concave shape. A nickel layer having a top surface and a bottom surface is over the top surface of the copper pillar. The bottom surface of the nickel layer has a second width. A ratio of the second width to the first width is between about 0.93 to about 1.07. A solder material is over the top surface of the cap layer. | 01-12-2012 |
20120088362 | Thermal Compressive Bond Head - A method includes allowing a work piece having a solder bump to contact a bond head; heating the bond head until the solder bump is melted; and conducting a cooling media into the bond head to cool the solder bump and to solidify the solder bump. | 04-12-2012 |
20120227886 | Substrate Assembly Carrier Using Electrostatic Force - A portable electrostatic chuck carrier includes a holder having a dielectric top surface, and bipolar electrodes under the dielectric top surface. The bipolar electrodes includes positive electrodes and negative electrodes electrically insulated from the positive electrodes. The positive electrodes and the negative electrodes are allocated in an alternating pattern in a plane substantially parallel to the dielectric top surface. | 09-13-2012 |
20130146647 | Integrated Reflow and Cleaning Process and Apparatus for Performing the Same - A method includes reflowing a solder region of a package structure, and performing a cleaning on the package structure at a cleaning temperature higher than a room temperature. Between the step of reflowing and the step of cleaning, the package structure is not cooled to temperatures close to the room temperature. | 06-13-2013 |
20140048586 | Innovative Multi-Purpose Dipping Plate - The present disclosure is directed to an apparatus for the application of soldering flux to a semiconductor workpiece. In some embodiments the apparatus comprises a dipping plate having a reservoir which is adapted to containing different depths of flux material. In some embodiments, the reservoir comprises at least two landing regions having sidewalls which form first and second dipping zones. The disclosed apparatus can allow dipping of the semiconductor workpiece in different depths of soldering flux without the necessity for changing dipping plates. | 02-20-2014 |