Yi-Ru
Yi-Ru Chen, New Taipei TW
Patent application number | Description | Published |
---|---|---|
20150049065 | MULTI-FUNCTION TOUCH PEN AND ELECTRONIC DEVICE WITH MULTI-FUNCTION TOUCH PEN - A multi-function touch pen for a portable electronic device includes a pen body and an audio output module. The pen body includes a touching input terminal, located at a first end of the pen body for inputting information to the portable electronic device, and an audio input unit located adjacent to the touch input terminal for inputting audio signals to the portable electronic device. The audio output module is located at a second end of the pen body for outputting audio signals generated from the portable electronic device. | 02-19-2015 |
20150074945 | PIVOT APPARATUS AND ELECTRONIC DEVICE USING PIVOT APPARATUS - A pivot apparatus to allow the opening and closing together of two elements in the manner of a clamshell includes a first pivoting member defining a helical gap, a second pivoting member, and a motivating member. The first pivoting member and the motivating member are coupled to the second pivoting member from opposite directions. The motivating member has a retractable pole and a positioning post protruding from the retractable pole. When the retractable pole couples to the first pivoting member, the positioning post extends into and is guided by the helical gap. The retractable pole can move axially to motivate the positioning post to slide along the helical gap. The first pivoting member is rotated relative to the second pivoting member by the positioning post. The present disclosure further discloses an electronic device using the pivot apparatus. | 03-19-2015 |
Yi-Ru Chen, Taipei TW
Patent application number | Description | Published |
---|---|---|
20080257931 | STAPLER SWITCHABLE BETWEEN VARIOUS OPERATION MODES AND SWITCHING METHOD THEREOF - Disclosed is a stapler having various operation modes, as well as methods for switching the stapler among the operation modes. The stapler includes a primary staple magazine, a secondary staple magazine, a staple selector, a drive blade selector and a cover. The primary and secondary magazines respectively contain primary and secondary staples. The staple selector and the drive blade selector are movable for switching the stapler between primary and secondary staple modes. The stapler also includes a perforation for performing a perforating operation, and a switch for securing the stapler in a collapsed, compact form to simplify storage thereof. The stapler is switchable among a primary staple mode, a secondary staple mode, a perforation mode and a storage mode by means of the staple selector and the drive blade selector. | 10-23-2008 |
Yi-Ru Cheng, Taipei TW
Patent application number | Description | Published |
---|---|---|
20100090937 | Displaying Method for Field Sequential Color Displays Using Two Color Fields - A displaying method for field sequential color displays using two color fields to produce a full color image is disclosed. The displaying method includes: providing a target full color image, displaying a first color field and displaying a second color field. The target full color image is formed by a first color image optical stimulus, a second color image optical stimulus and a third color image optical stimulus. The first color field displays the first color image optical stimulus and a first part of the third color image optical stimulus, while the second color field displays the second color image optical stimulus and a second part of the third color image optical stimulus, which compensates the shortage of the third color image optical stimulus in the first color field. The target full color image is generated by displaying the first and second color fields in sequence, so as to decrease the displaying frequency of field sequential color displays. | 04-15-2010 |
Yi-Ru Chen-Sarkanen, New Brighton, MN US
Patent application number | Description | Published |
---|---|---|
20140335571 | LIGNIN-DEGRADING METHODS - Disclosed herein are methods that involve degrading materials that include lignin. In one aspect, the method generally includes contacting a lignin sample with a lignin depolymerase and contacting the lignin sample with an auxiliary compound. In another aspect, the method generally includes contacting an auxiliary compound with a sample that includes uncleaved lignin macromolecules and at least partially cleaved lignin components in intermolecular association with other lignin components and/or at least a portion of the uncleaved lignin macromolecules. In both aspects, the auxiliary compound dissociates at least partially cleaved lignin components from one another and/or the uncleaved lignin macromolecules. | 11-13-2014 |
Yi-Ru Hsu, Taoyuan County TW
Patent application number | Description | Published |
---|---|---|
20150076315 | THREE-DIMENSIONAL SHOCK-ABSORBING DEVICE - The present invention provides a three-dimensional shock-absorbing device, which comprises a base, a carrying base, and a carrying platform. The carrying base is disposed between the base and the carrying platform. A first elastic member is disposed between carrying base and the base for providing vertical shock-absorbing effect. A first limiting groove and a sliding member are disposed between the carrying platform and the carrying base for providing horizontal shock-absorbing effect. In addition, second elastic members connected to the base are disposed on the periphery of the carrying platform for providing horizontal and vertical shock-absorbing effects concurrently and thus achieving three-dimensional shock-absorbing effects. Moreover, the present invention has more support and less tipping. Besides, it is more durable. | 03-19-2015 |
Yi-Ru Hsu, Longtan Shiang TW
Patent application number | Description | Published |
---|---|---|
20110005330 | Apparatus for measuring the strength of solar cells - Disclosed is an apparatus for measuring the strength of solar cells. The apparatus includes a shell, a flexible element, a fastener unit, an inlet valve and a vent valve. The shell is used to cover the solar cells. The flexible element is disposed in the shell, thus dividing the interior of the shell into a first chamber and a second chamber. The fastener unit is used to firmly attach the flexible element to the shell. The inlet valve is in communication with the first chamber. The vent valve is in communication with the first chamber. | 01-13-2011 |
Yi-Ru Hsu, Jinsha Township TW
Patent application number | Description | Published |
---|---|---|
20100313637 | Device of Testing Robustness of Photovoltaic Module Terminal - A terminal is tested for its robustness. The terminal is for a photovoltaic module. The photovoltaic module is put on a frame unit and is connected with a load unit. The present invention reduces human errors, improves test accuracy and achieves easy operation. | 12-16-2010 |
Yi-Ru Hsu, Kinmen County TW
Patent application number | Description | Published |
---|---|---|
20130092152 | Adjusting Device of Solar Tracker for Testing Off-axis Beam Damage of A Concentrator Photovoltaic (CPV) Module - An adjusting device is provided for solar tracker. The adjusting device is used for testing off-axis beam damage of a CPV module. A universal transmission unit is comprised for adjustment. Thus, a CPV module is exactly focused to a predestined position. Furthermore, a focusing point of the CPV module can be biased to the predestined position for testing off-axis beam damage. | 04-18-2013 |
20140076400 | SYSTEM FOR MONITORING OPERATING ANGLE OF SOLAR TRACKER IN REAL TIME - A system monitors an operating angle of a solar tracker in real time. The system includes a solar tracker, an angle measurement device, and a processing device. The solar tracker carries a CPV module and controls a light receiving side of the CPV module to face the sun squarely. The angle measurement device is disposed on the solar tracker to measure an angle of inclination of the light receiving side of the CPV module and generate a measured signal. The processing device receives and records the measured signal. Furthermore, the system performs computation required for efficiency evaluation and performance rating of the CPV module, using the measured operating angle of the solar tracker and ambient parameters. | 03-20-2014 |
Yi-Ru Hsu, Kinmen TW
Patent application number | Description | Published |
---|---|---|
20110103423 | Apparatus for Measuring the Temperature Coefficient of a Concentrator Photovoltaic Module - Disclosed is an apparatus for measuring temperature coefficients of a concentrator photovoltaic module. The apparatus includes a solar simulator for providing a radiant source, a environment chamber, a concentrator photovoltaic module, a temperature control unit for controlling the temperature of environment chamber, a circuit-voltage curve measurement unit for measuring current-voltage characteristics of a photovoltaic device and a reference cell for measuring the irradiation of the solar simulator. | 05-05-2011 |
Yi-Ru Huang, Tainan City TW
Patent application number | Description | Published |
---|---|---|
20130134464 | LIGHT EMITTING DIODE DEVICE AND FLIP-CHIP PACKAGED LIGHT EMITTING DIODE DEVICE - The present invention relates to a light emitting diode (LED) and a flip-chip packaged LED device. The present invention provides an LED device. The LED device is flipped on and connected electrically with a packaging substrate and thus forming the flip-chip packaged LED device. The LED device mainly has an Ohmic-contact layer and a planarized buffer layer between a second-type doping layer and a reflection layer. The Ohmic-contact layer improves the Ohmic-contact characteristics between the second-type doping layer and the reflection layer without affecting the light emitting efficiency of the LED device and the flip-chip packaged LED device. The planarized buffer layer id disposed between the Ohmic-contact layer and the reflection layer for smoothening the Ohmic-contact layer and hence enabling the reflection layer to adhere to the planarized buffer layer smoothly. Thereby, the reflection layer can have the effect of mirror reflection and the scattering phenomenon on the reflected light can be reduced as well. | 05-30-2013 |
20130146915 | LIGHT EMITTING DIODE AND FLIP-CHIP LIGHT EMITTING DIODE PACKAGE - A light emitting diode including a first doped layer, a light emitting layer, a second doped layer and a substrate is provided. A plurality of first grooves penetrate through the second doped layer and the light emitting layer. Thus, a partial surface of the first doped layer is exposed. At least one of the plurality of first grooves extends to edges of the second dope layer and the light emitting layer. An insulating layer is disposed over a part of second doped layer and extends to sidewalls of the first grooves. A first contact is set in the first grooves and electrically connected to the first doped layer. A second contact is set on the second doped layer and electrically connected to the second doped layer. By the first grooves, the first contact can be electrically connected to the first doped layer for improving current spreading. | 06-13-2013 |
20130153944 | SEMICONDUCTOR PACKAGE STRUCTURE - A semiconductor package structure includes an insulating substrate, a patterned conductive layer, a light emitting diode (LED) chip and a conductive connection part. The insulating substrate has an upper surface divided into an element configuration region and an element bonding region. The patterned conductive layer includes plural circuits located in the element configuration region and at least one bonding pad located in the element bonding region. The LED chip is flip chip bonded on the patterned conductive layer and electrically connected to the circuits. The conductive connection part has a first end point electrically connected to the bonding pad and a second end point electrically connected to an external circuit. The bonding pad and a corner of the LED chip are disposed correspondingly. A horizontal distance between an apex of the corner and the first end point of the conductive connection part is greater than or equal to 30 micrometers. | 06-20-2013 |
20130221394 | LIGHT EMITTING DIODE AND FLIP-CHIP LIGHT EMITTING DIODE PACKAGE - A light emitting diode (LED) is revealed. The LED includes a substrate, a first-type-doped layer, a light emitting layer, a second-type-doped layer, a plurality of first grooves, a second groove, an insulation layer, a first contact, and a second contact. The LED features that the second groove is connected to one end of each first groove and penetrates the second-type-doped layer and the light emitting layer to expose a part of the first-type-doped layer. The contact area between the first contact and the first-type-doped layer is increased. Therefore, the LED is worked at high current densities without heat accumulation. Moreover, the light emitting area is not reduced and the light emitting efficiency is not affected. The LED is flipped on a package substrate to form a flip-chip LED package. | 08-29-2013 |
20130277641 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND FLIP CHIP PACKAGE DEVICE - A semiconductor light emitting device including a first type doped semiconductor layer, a light emitting layer, a second type doped semiconductor layer, and a reflection layer is provided. The first type doped semiconductor layer has a mesa portion and a depression portion. The light emitting layer is disposed on the mesa portion and has a first surface, a second surface and a first side surface connecting the first surface with the second surface. The second type doped semiconductor layer is disposed on the light emitting layer and has a third surface, a fourth surface and a second side surface connecting the third surface with the fourth surface. Observing from a viewing direction parallel to the light emitting layer, the reflection layer covers at least part of the first side surface and at least part of the second side surface. A flip chip package device is also provided. | 10-24-2013 |
20140159082 | LIGHT-EMITTING DEVICE - A light-emitting device including a substrate, a photoelectric structure and a coarse structure is provided. The substrate has an upper surface and a lower surface opposite to each other, and an annular side surface connecting the upper surface and the lower surface. The photoelectric structure is disposed on the upper surface of the substrate. The coarse structure is formed on the annular side surface of the substrate. A ratio of a thickness of the substrate and a thickness of the coarse structure is greater than or equal to 1 and less than or equal to 20. Therefore, the overall light-emitting efficiency of the light-emitting device may be improved. | 06-12-2014 |
20140167080 | LIGHT EMITTING DEVICE - A light emitting device includes a substrate, light emitting units, an insulation layer, a current distribution layer and a reflective layer. The substrate has an upper surface. The light emitting units are disposed on the upper surface and include at least one first light emitting diode (LED) and at least one second LED. A first side wall of the first LED is adjacent to a second side wall of the second LED so as to define a concave portion exposing a portion of the upper surface. The insulation layer at least covers the first side wall and the second side wall. The current distribution layer covers the concave portion and at least covers a portion of the second LED. The reflective layer covers the current distribution layer and is electrically connected to the first LED and the second LED. | 06-19-2014 |
20150021639 | LIGHT EMITTING DIODE STRUCTURE - A light emitting diode structure including a substrate, a semiconductor epitaxial layer and a reflective conductive structure layer is provided. The semiconductor epitaxial layer is disposed on the substrate and exposes a portion of the substrate. The reflective conductive structure layer covers a part of the semiconductor epitaxial layer and the portion of the substrate exposed by the semiconductor epitaxial layer. | 01-22-2015 |
Yi-Ru Liu, Heping Township TW
Patent application number | Description | Published |
---|---|---|
20090004995 | CASE SUBSTRATE - A case substrate including a base material and a coating layer coated on the base material. The coating layer has a hollow-out opening corresponding to the position of an infrared receiver, such that infrared rays can pass through the base material from the hollow-out opening and thus being received by the receiver. | 01-01-2009 |